JPS5784143A - Controlling mechanism of bonder for z axial motion - Google Patents

Controlling mechanism of bonder for z axial motion

Info

Publication number
JPS5784143A
JPS5784143A JP55160223A JP16022380A JPS5784143A JP S5784143 A JPS5784143 A JP S5784143A JP 55160223 A JP55160223 A JP 55160223A JP 16022380 A JP16022380 A JP 16022380A JP S5784143 A JPS5784143 A JP S5784143A
Authority
JP
Japan
Prior art keywords
capillary
bonder
axial motion
wire
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55160223A
Other languages
Japanese (ja)
Inventor
Akira Hatano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP55160223A priority Critical patent/JPS5784143A/en
Publication of JPS5784143A publication Critical patent/JPS5784143A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/78344—Eccentric cams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To perform the optimum bonding operation of wire by a method wherein control of Z axial motion of a bonder of wire bonding device in the manufacturing process of semiconductor device is performed by controlling of current, and transferring quantity of capillary, applied pressure, pressure applying hours, etc., are controlled, too. CONSTITUTION:Driving in the Z axial direction of the capillary 7 to send out a bonding wire is performed by a voice coil 13 through an arm 14, and control of three dimentional motion is performed joining together with X, Y axial motion of an X-Y table. Transference in the Z axial direction is performed feeding a current to the voice coil 13 through a driver 15 according to a signal of a sequencer 16, the capillary 7 is made to descend at the prescribed bonding position, and a current flowing in the driver 15 is detected by a detector 17 to feed back to the sequencer 16.
JP55160223A 1980-11-14 1980-11-14 Controlling mechanism of bonder for z axial motion Pending JPS5784143A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55160223A JPS5784143A (en) 1980-11-14 1980-11-14 Controlling mechanism of bonder for z axial motion

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55160223A JPS5784143A (en) 1980-11-14 1980-11-14 Controlling mechanism of bonder for z axial motion

Publications (1)

Publication Number Publication Date
JPS5784143A true JPS5784143A (en) 1982-05-26

Family

ID=15710372

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55160223A Pending JPS5784143A (en) 1980-11-14 1980-11-14 Controlling mechanism of bonder for z axial motion

Country Status (1)

Country Link
JP (1) JPS5784143A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6230341A (en) * 1985-07-31 1987-02-09 Fujitsu Ltd Wire bonding method
JPS6347803A (en) * 1986-08-18 1988-02-29 Mitsubishi Electric Corp Sequence controller
JPS63211640A (en) * 1987-02-27 1988-09-02 Hitachi Ltd Wire bonding method, wire bonding device and manufacture of semiconductor device using wire bonding device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6230341A (en) * 1985-07-31 1987-02-09 Fujitsu Ltd Wire bonding method
JPH0457100B2 (en) * 1985-07-31 1992-09-10 Fujitsu Kk
JPS6347803A (en) * 1986-08-18 1988-02-29 Mitsubishi Electric Corp Sequence controller
JPS63211640A (en) * 1987-02-27 1988-09-02 Hitachi Ltd Wire bonding method, wire bonding device and manufacture of semiconductor device using wire bonding device

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