JPS57136329A - Electrically treating method - Google Patents
Electrically treating methodInfo
- Publication number
- JPS57136329A JPS57136329A JP56022138A JP2213881A JPS57136329A JP S57136329 A JPS57136329 A JP S57136329A JP 56022138 A JP56022138 A JP 56022138A JP 2213881 A JP2213881 A JP 2213881A JP S57136329 A JPS57136329 A JP S57136329A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- treated
- electrode
- same shape
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Formation Of Insulating Films (AREA)
- Weting (AREA)
Abstract
PURPOSE:To prevent the concentration of an electric field to the surrounding section of a material to be treated, and to execute uniform electric treatment to the whole surface of the material to be treated by forming an electrode in the same shape as the material to be treated and in a shape smaller than the size of the material to be treated. CONSTITUTION:When electrode plates 180, 190 are connected to the positive pole of a DC power supply 20, a wafer 100 is connected to a negative pole and mesa grooves 9, 10 are coated with glass impalpable powder through an electrophoresis method, the electrode plate 180, 190 are formed in the same shape as the wafer 100 and in the shape smaller than the wafer 100. Accordingly, the thickness of a glass protective film can be uniformalized because the current density of the central section and surrounding section of the wafer 100 is equalized.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56022138A JPS57136329A (en) | 1981-02-16 | 1981-02-16 | Electrically treating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56022138A JPS57136329A (en) | 1981-02-16 | 1981-02-16 | Electrically treating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57136329A true JPS57136329A (en) | 1982-08-23 |
Family
ID=12074518
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56022138A Pending JPS57136329A (en) | 1981-02-16 | 1981-02-16 | Electrically treating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57136329A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010104568A (en) * | 2008-10-30 | 2010-05-13 | Taeko Sato | Scratcher |
-
1981
- 1981-02-16 JP JP56022138A patent/JPS57136329A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010104568A (en) * | 2008-10-30 | 2010-05-13 | Taeko Sato | Scratcher |
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