JPS5627932A - Manufacture of integrated circuit - Google Patents
Manufacture of integrated circuitInfo
- Publication number
- JPS5627932A JPS5627932A JP10534279A JP10534279A JPS5627932A JP S5627932 A JPS5627932 A JP S5627932A JP 10534279 A JP10534279 A JP 10534279A JP 10534279 A JP10534279 A JP 10534279A JP S5627932 A JPS5627932 A JP S5627932A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- chuck
- integrated circuit
- axial line
- ground
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 abstract 11
- 238000000034 method Methods 0.000 abstract 2
- 239000000919 ceramic Substances 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3046—Mechanical treatment, e.g. grinding, polishing, cutting using blasting, e.g. sand-blasting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
PURPOSE:To enable the convenient and rapid manufacture of an integrated circuit by a method wherein a substrate is absorbed to a suction chuck, the circumference of the substrate is ground to make the axial line of chuck to coincide with the center of substrate and the integrated circuit is provided on the surface of substrate. CONSTITUTION:When a printed wiring processing, for example, is to be performed on a blank substrate like ceramics, silicon, etc., the substrate 12 is made to be absorbed to a suction chuck 7' making the central point to be nearly coincide with an axial line a of the chuck 7'. The long sides of the substrate 12 is ground with grinding machines or abrasive machines 13, then the chuck 7' is made to rotate at 90 deg. and the short sides of the substrate 12 is ground to finish the circumference of the substrate 12 symmetrically in all the directions against the axial line a, and the center point of the substrate 12 is made to coincide with the axial line a. Then print processing is performed on the surface of the substrate 12 with the ordinary method. By this way, the center positioning and the finish processing are performed at the same time, and the integrated circuit can be manufactured conveniently and rapidly.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10534279A JPS5627932A (en) | 1979-08-16 | 1979-08-16 | Manufacture of integrated circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10534279A JPS5627932A (en) | 1979-08-16 | 1979-08-16 | Manufacture of integrated circuit |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5627932A true JPS5627932A (en) | 1981-03-18 |
JPS5757861B2 JPS5757861B2 (en) | 1982-12-07 |
Family
ID=14405055
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10534279A Granted JPS5627932A (en) | 1979-08-16 | 1979-08-16 | Manufacture of integrated circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5627932A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63249945A (en) * | 1987-04-07 | 1988-10-17 | Canon Inc | Optical pickup |
JPS63269340A (en) * | 1987-04-28 | 1988-11-07 | Pioneer Electronic Corp | Optical pickup |
JPH04349238A (en) * | 1990-12-20 | 1992-12-03 | Omron Corp | Optical pick-up device |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6071240U (en) * | 1983-10-25 | 1985-05-20 | 加納 忠雄 | fire extinguisher storage box |
JPS60168845U (en) * | 1984-04-19 | 1985-11-09 | 株式会社 初田製作所 | fire extinguisher box |
JPS61177661U (en) * | 1985-04-26 | 1986-11-06 |
-
1979
- 1979-08-16 JP JP10534279A patent/JPS5627932A/en active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63249945A (en) * | 1987-04-07 | 1988-10-17 | Canon Inc | Optical pickup |
JPS63269340A (en) * | 1987-04-28 | 1988-11-07 | Pioneer Electronic Corp | Optical pickup |
JPH04349238A (en) * | 1990-12-20 | 1992-12-03 | Omron Corp | Optical pick-up device |
Also Published As
Publication number | Publication date |
---|---|
JPS5757861B2 (en) | 1982-12-07 |
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