JPS5627932A - Manufacture of integrated circuit - Google Patents

Manufacture of integrated circuit

Info

Publication number
JPS5627932A
JPS5627932A JP10534279A JP10534279A JPS5627932A JP S5627932 A JPS5627932 A JP S5627932A JP 10534279 A JP10534279 A JP 10534279A JP 10534279 A JP10534279 A JP 10534279A JP S5627932 A JPS5627932 A JP S5627932A
Authority
JP
Japan
Prior art keywords
substrate
chuck
integrated circuit
axial line
ground
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10534279A
Other languages
Japanese (ja)
Other versions
JPS5757861B2 (en
Inventor
Yoshiaki Nagaura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP10534279A priority Critical patent/JPS5627932A/en
Publication of JPS5627932A publication Critical patent/JPS5627932A/en
Publication of JPS5757861B2 publication Critical patent/JPS5757861B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3046—Mechanical treatment, e.g. grinding, polishing, cutting using blasting, e.g. sand-blasting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

PURPOSE:To enable the convenient and rapid manufacture of an integrated circuit by a method wherein a substrate is absorbed to a suction chuck, the circumference of the substrate is ground to make the axial line of chuck to coincide with the center of substrate and the integrated circuit is provided on the surface of substrate. CONSTITUTION:When a printed wiring processing, for example, is to be performed on a blank substrate like ceramics, silicon, etc., the substrate 12 is made to be absorbed to a suction chuck 7' making the central point to be nearly coincide with an axial line a of the chuck 7'. The long sides of the substrate 12 is ground with grinding machines or abrasive machines 13, then the chuck 7' is made to rotate at 90 deg. and the short sides of the substrate 12 is ground to finish the circumference of the substrate 12 symmetrically in all the directions against the axial line a, and the center point of the substrate 12 is made to coincide with the axial line a. Then print processing is performed on the surface of the substrate 12 with the ordinary method. By this way, the center positioning and the finish processing are performed at the same time, and the integrated circuit can be manufactured conveniently and rapidly.
JP10534279A 1979-08-16 1979-08-16 Manufacture of integrated circuit Granted JPS5627932A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10534279A JPS5627932A (en) 1979-08-16 1979-08-16 Manufacture of integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10534279A JPS5627932A (en) 1979-08-16 1979-08-16 Manufacture of integrated circuit

Publications (2)

Publication Number Publication Date
JPS5627932A true JPS5627932A (en) 1981-03-18
JPS5757861B2 JPS5757861B2 (en) 1982-12-07

Family

ID=14405055

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10534279A Granted JPS5627932A (en) 1979-08-16 1979-08-16 Manufacture of integrated circuit

Country Status (1)

Country Link
JP (1) JPS5627932A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63249945A (en) * 1987-04-07 1988-10-17 Canon Inc Optical pickup
JPS63269340A (en) * 1987-04-28 1988-11-07 Pioneer Electronic Corp Optical pickup
JPH04349238A (en) * 1990-12-20 1992-12-03 Omron Corp Optical pick-up device

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6071240U (en) * 1983-10-25 1985-05-20 加納　忠雄 fire extinguisher storage box
JPS60168845U (en) * 1984-04-19 1985-11-09 株式会社　初田製作所 fire extinguisher box
JPS61177661U (en) * 1985-04-26 1986-11-06

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63249945A (en) * 1987-04-07 1988-10-17 Canon Inc Optical pickup
JPS63269340A (en) * 1987-04-28 1988-11-07 Pioneer Electronic Corp Optical pickup
JPH04349238A (en) * 1990-12-20 1992-12-03 Omron Corp Optical pick-up device

Also Published As

Publication number Publication date
JPS5757861B2 (en) 1982-12-07

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