JPS5713164A - Paste of activating metallic material for electroless plating and plating method using said paste - Google Patents

Paste of activating metallic material for electroless plating and plating method using said paste

Info

Publication number
JPS5713164A
JPS5713164A JP8821780A JP8821780A JPS5713164A JP S5713164 A JPS5713164 A JP S5713164A JP 8821780 A JP8821780 A JP 8821780A JP 8821780 A JP8821780 A JP 8821780A JP S5713164 A JPS5713164 A JP S5713164A
Authority
JP
Japan
Prior art keywords
paste
plating
electroless plating
metallic material
electroless
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8821780A
Other languages
Japanese (ja)
Other versions
JPS5926661B2 (en
Inventor
Kusuo Kuguhara
Hiromitsu Tagi
Noriya Satou
Katsuhiko Honjo
Makoto Ogawa
Shoji Kuroda
Kenichi Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP8821780A priority Critical patent/JPS5926661B2/en
Publication of JPS5713164A publication Critical patent/JPS5713164A/en
Publication of JPS5926661B2 publication Critical patent/JPS5926661B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques

Abstract

PURPOSE: To improve the adhesive strength and electrical characteristics of a plating layer by beforehand coating and heat treating the paste of an activating metallic material of specific composition on a ceramic material then electroless plating the same at the time of electroless plating Ni or Cu on said material.
CONSTITUTION: In electroless plating Ni or Cu on the surface of a ceramic material of dielectrics, semiconductors, insulators or the like, the paste of a metallic material for activating plating parts is beforehand coated on said surface. To prepare the paste, 0.03W5.0wt% in terms of metal chloroplatinic acid, palladium chloride or compound of other platinum group metals is dissolved in water, or mineral acid, to prepare metal varnish, and this is dispersed together with 0.5W30wt% carbon powder of ≤2μ in a vehicle of one or ≥2 kinds of oil soluble, water soluble and amphoteric resins such as cellulosic, rubber base and vinyl base resins as well as their derivatives, whereby the paste is prepared. This is coated on the required parts of the ceramics. After it is heat-treated at 420W920°C, it is electroless-plated with Ni, Cu or the like.
COPYRIGHT: (C)1982,JPO&Japio
JP8821780A 1980-06-28 1980-06-28 Electroless plating active metal material paste and plating method using the same Expired JPS5926661B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8821780A JPS5926661B2 (en) 1980-06-28 1980-06-28 Electroless plating active metal material paste and plating method using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8821780A JPS5926661B2 (en) 1980-06-28 1980-06-28 Electroless plating active metal material paste and plating method using the same

Publications (2)

Publication Number Publication Date
JPS5713164A true JPS5713164A (en) 1982-01-23
JPS5926661B2 JPS5926661B2 (en) 1984-06-29

Family

ID=13936721

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8821780A Expired JPS5926661B2 (en) 1980-06-28 1980-06-28 Electroless plating active metal material paste and plating method using the same

Country Status (1)

Country Link
JP (1) JPS5926661B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5831075A (en) * 1981-08-19 1983-02-23 Matsushita Electric Ind Co Ltd Local electroless plating method
JPS5933869A (en) * 1982-08-20 1984-02-23 Hitachi Ltd Electrode material for semiconductor device
JPS5974528A (en) * 1982-10-21 1984-04-27 Seiko Epson Corp Vertical conducting agent for display panel

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5831075A (en) * 1981-08-19 1983-02-23 Matsushita Electric Ind Co Ltd Local electroless plating method
JPS6237112B2 (en) * 1981-08-19 1987-08-11 Matsushita Electric Ind Co Ltd
JPS5933869A (en) * 1982-08-20 1984-02-23 Hitachi Ltd Electrode material for semiconductor device
JPH023555B2 (en) * 1982-08-20 1990-01-24 Hitachi Ltd
JPS5974528A (en) * 1982-10-21 1984-04-27 Seiko Epson Corp Vertical conducting agent for display panel

Also Published As

Publication number Publication date
JPS5926661B2 (en) 1984-06-29

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