JPS57130435A - Annealing method of matter by light beam - Google Patents

Annealing method of matter by light beam

Info

Publication number
JPS57130435A
JPS57130435A JP1654481A JP1654481A JPS57130435A JP S57130435 A JPS57130435 A JP S57130435A JP 1654481 A JP1654481 A JP 1654481A JP 1654481 A JP1654481 A JP 1654481A JP S57130435 A JPS57130435 A JP S57130435A
Authority
JP
Japan
Prior art keywords
matter
vessel
film
scarcely
irradiate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1654481A
Other languages
Japanese (ja)
Other versions
JPS628011B2 (en
Inventor
Yoichi Akasaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1654481A priority Critical patent/JPS57130435A/en
Publication of JPS57130435A publication Critical patent/JPS57130435A/en
Publication of JPS628011B2 publication Critical patent/JPS628011B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26Bombardment with radiation
    • H01L21/263Bombardment with radiation with high-energy radiation
    • H01L21/268Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Recrystallisation Techniques (AREA)

Abstract

PURPOSE:To unify a radiating beam when an oxide or a nitride adhered on the surface of a semiconductor is made to be irradiated with light beam to be annealed by a method wherein the beam is made to irradiate through a matter having the same refractive index with the oxide or the nitride and being sufficiently thicker than wave length of the beam and being scarcely absorbent of the beam. CONSTITUTION:When annealing is to be performed by irradiating laser beam 11 on an SiO2 or Si3N4 film 21 formed in the prescribed shape on a semiconductor substrate 20, a transparent vessel 40 is arranged on the substrate 20, and the beam 11 is made to irradiate passing through the prescribed matter filled up in the vessel. In this constitution, the matter having nearly the same refractive index with the film 21, being sufficiently thicker than wave length of the beam and being scarcely absorbent of the beam is selected as the matter to be filled up in the vessel 40. As the matter to be used for that purpose, any of ethylbenzene, ethyldiamine, benzene, toluene, glycerin, chloroform, etc., is selected. Accordingly uniform irradiation of the beam can be attained on the whole surface irrelevant to thickness of the film 21.
JP1654481A 1981-02-05 1981-02-05 Annealing method of matter by light beam Granted JPS57130435A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1654481A JPS57130435A (en) 1981-02-05 1981-02-05 Annealing method of matter by light beam

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1654481A JPS57130435A (en) 1981-02-05 1981-02-05 Annealing method of matter by light beam

Publications (2)

Publication Number Publication Date
JPS57130435A true JPS57130435A (en) 1982-08-12
JPS628011B2 JPS628011B2 (en) 1987-02-20

Family

ID=11919200

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1654481A Granted JPS57130435A (en) 1981-02-05 1981-02-05 Annealing method of matter by light beam

Country Status (1)

Country Link
JP (1) JPS57130435A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62149881A (en) * 1985-12-24 1987-07-03 Canon Inc Apparatus for forming deposited film

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02130708U (en) * 1989-03-31 1990-10-29
JPH0340007U (en) * 1989-08-28 1991-04-17
JP5326183B2 (en) * 2005-10-14 2013-10-30 澁谷工業株式会社 Laser annealing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62149881A (en) * 1985-12-24 1987-07-03 Canon Inc Apparatus for forming deposited film

Also Published As

Publication number Publication date
JPS628011B2 (en) 1987-02-20

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