JPS57121025A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS57121025A JPS57121025A JP649681A JP649681A JPS57121025A JP S57121025 A JPS57121025 A JP S57121025A JP 649681 A JP649681 A JP 649681A JP 649681 A JP649681 A JP 649681A JP S57121025 A JPS57121025 A JP S57121025A
- Authority
- JP
- Japan
- Prior art keywords
- compound
- resin composition
- epoxy resin
- formamide
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Epoxy Resins (AREA)
Abstract
PURPOSE: To prepare the titled resin composition curable easily even at a low temperature and giving a cured product having excellent electrical and mechanical characteristics, by using an epoxy compound, a formamide compound and a maleimide compound as essential components.
CONSTITUTION: The objective resin composition is prepared by compounding (A) an epoxy compound (e.g. bisphenol A-type epoxy resin), (B) a formamide compound (e.g. N,N'-dimethyl-4,4'-diaminophenylmethane-bisformamide) and (C) a maleimide compound (e.g. N,N'-phenylenebismaleimide), and adding a cure accelerator (e.g. triethylamine) to the mixture. The weight ratios of the components (A), (B) and (C) are pref. 5W80%, 5W85% and 10W85%, respectively.
EFFECT: Excellent affinity and adhesivity to various materials.
USE: For various adhesives and coating materials.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP649681A JPS57121025A (en) | 1981-01-21 | 1981-01-21 | Epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP649681A JPS57121025A (en) | 1981-01-21 | 1981-01-21 | Epoxy resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57121025A true JPS57121025A (en) | 1982-07-28 |
Family
ID=11640060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP649681A Pending JPS57121025A (en) | 1981-01-21 | 1981-01-21 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57121025A (en) |
-
1981
- 1981-01-21 JP JP649681A patent/JPS57121025A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS57143320A (en) | Novel curable resin composition | |
| JPS52139199A (en) | Novel epoxy resin compositions | |
| JPS56141310A (en) | Curable resin composition | |
| JPS5426000A (en) | Epoxy resin composition | |
| JPS5569616A (en) | Epoxy resin composition for carbon fiber-reinforcement | |
| JPS57121025A (en) | Epoxy resin composition | |
| JPS57121026A (en) | Epoxy resin composition | |
| JPS5653119A (en) | Curable resin composition | |
| JPS5356284A (en) | Ultraviolet-curing resin compositions | |
| JPS5464597A (en) | Heat resistant epoxy resin composition | |
| JPS557861A (en) | Thermosetting resin composition | |
| JPS5398400A (en) | Epoxy resin composition | |
| JPS5723624A (en) | Epoxy resin composition | |
| JPS5467000A (en) | Transparent thermosetting resin composition | |
| JPS5747323A (en) | Epoxy resin composition having improved resistance to hot water at high temperature | |
| JPS5486599A (en) | Thermosetting epoxy resin composition | |
| JPS5643369A (en) | Composition for powder paint | |
| JPS5647445A (en) | Epoxy resin composition | |
| JPS5749646A (en) | Epoxy resin composition | |
| JPS5433587A (en) | Preparation of thermosetting resin molding composition | |
| JPS5418838A (en) | Preparation of water-dilutive coating composition | |
| JPS5725322A (en) | Epoxy resin composition | |
| JPS5565217A (en) | Preparation of heat-resistant resin | |
| JPS5266600A (en) | Epoxy resin compositions | |
| JPS6433118A (en) | Epoxy resin composition and its cured product |