JPS57117253A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS57117253A
JPS57117253A JP314181A JP314181A JPS57117253A JP S57117253 A JPS57117253 A JP S57117253A JP 314181 A JP314181 A JP 314181A JP 314181 A JP314181 A JP 314181A JP S57117253 A JPS57117253 A JP S57117253A
Authority
JP
Japan
Prior art keywords
dicing
region
high density
substrate
density impurity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP314181A
Other languages
Japanese (ja)
Inventor
Takao Fujizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP314181A priority Critical patent/JPS57117253A/en
Publication of JPS57117253A publication Critical patent/JPS57117253A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)

Abstract

PURPOSE:To eliminate propagation of dicing strain in a substrate layer by previously forming a high density impurity layer separated from semiconductor element region, surrounding the center of a prospective dicing line. CONSTITUTION:A conductive type high density impurity region is formed in the center of a dicing region and under a scribe line. The dicing region 13 comprises a scribe line 13a, the exposed part of the substrate 13b in the dicing region and a high density impurity region 13c. Mechanical damages on the substrate produced by the dicing 13 is absorbed in the high density impurity region and the dicing strain propagation is prevented by a part of the substrate in the element region.
JP314181A 1981-01-14 1981-01-14 Manufacture of semiconductor device Pending JPS57117253A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP314181A JPS57117253A (en) 1981-01-14 1981-01-14 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP314181A JPS57117253A (en) 1981-01-14 1981-01-14 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS57117253A true JPS57117253A (en) 1982-07-21

Family

ID=11549069

Family Applications (1)

Application Number Title Priority Date Filing Date
JP314181A Pending JPS57117253A (en) 1981-01-14 1981-01-14 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS57117253A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61251148A (en) * 1985-04-30 1986-11-08 Oki Electric Ind Co Ltd Division of semiconductor wafer into chips

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS48102975A (en) * 1972-04-07 1973-12-24

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS48102975A (en) * 1972-04-07 1973-12-24

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61251148A (en) * 1985-04-30 1986-11-08 Oki Electric Ind Co Ltd Division of semiconductor wafer into chips

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