JPS5710956A - Tape carrier - Google Patents

Tape carrier

Info

Publication number
JPS5710956A
JPS5710956A JP8546880A JP8546880A JPS5710956A JP S5710956 A JPS5710956 A JP S5710956A JP 8546880 A JP8546880 A JP 8546880A JP 8546880 A JP8546880 A JP 8546880A JP S5710956 A JPS5710956 A JP S5710956A
Authority
JP
Japan
Prior art keywords
film
conductor
chip
opening
input
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8546880A
Other languages
Japanese (ja)
Inventor
Yasuhiko Takamatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ricoh Co Ltd
Original Assignee
Ricoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ricoh Co Ltd filed Critical Ricoh Co Ltd
Priority to JP8546880A priority Critical patent/JPS5710956A/en
Publication of JPS5710956A publication Critical patent/JPS5710956A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5384—Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Abstract

PURPOSE:To obtain a tape carrier without any through hole, by providing the output-side conductor passage on the upper surface of a film and the input-side conductor passage on the lower surface thereof, and connecting an IC chip and the respective conductor passages through an opening formed in the center of the film. CONSTITUTION:On the upper surface 11 of a film 10, a conductor passage 12 on the output side is formed, while on the lower surface 13 thereof, a conductor passage 14 on the input side is formed. These conductor passages 12 and 14 are connected to both inner leads 16 and 17 formed facing to an opening in the center of the film and outer leads 18 and 19 formed at the outer end of the film. Said inner leads 16 and 17 are so constituted as to contact with input and output electrode projections 2A and 2B on an IC chip 1 when the IC chip 1 is mounted at the opening 15. Thereby, the conductor passages on both surfaces of the film can be connected to an electronic part without forming any through hole.
JP8546880A 1980-06-24 1980-06-24 Tape carrier Pending JPS5710956A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8546880A JPS5710956A (en) 1980-06-24 1980-06-24 Tape carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8546880A JPS5710956A (en) 1980-06-24 1980-06-24 Tape carrier

Publications (1)

Publication Number Publication Date
JPS5710956A true JPS5710956A (en) 1982-01-20

Family

ID=13859716

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8546880A Pending JPS5710956A (en) 1980-06-24 1980-06-24 Tape carrier

Country Status (1)

Country Link
JP (1) JPS5710956A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01170028A (en) * 1987-12-25 1989-07-05 Hitachi Ltd Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01170028A (en) * 1987-12-25 1989-07-05 Hitachi Ltd Semiconductor device

Similar Documents

Publication Publication Date Title
JPS5710956A (en) Tape carrier
JPS56114361A (en) Semiconductor container
JPS5432085A (en) Semiconductor intergrated circuit
JPS56133857A (en) Manufacture of hybrid ic
JPS5793559A (en) Semiconductor device
JPS5688345A (en) Semiconductor device
JPS5732655A (en) Semiconductor integrated circuit device
JPS52116073A (en) Hermetic structure in which integrated circuit element is sealed up ai rtightly
JPS57201050A (en) Multilayer wiring structure
JPS5763851A (en) Tape carrier
JPS56155553A (en) Package for semiconductor device
JPS57187955A (en) Sealing structure of semiconductor element
JPS5524478A (en) Integrated circuit
JPS5591861A (en) Cmos logic circuit
JPS5360170A (en) Input/output pads of ic chip
JPS5740945A (en) Integrated circuit device
JPS6421945A (en) Electronic element mounting module
JPS55157254A (en) Digital-to-analog converter
JPS57111048A (en) Integrated circuit device
JPS57204167A (en) Semiconductor integrated circuit
JPS5687350A (en) Semiconductor device
JPS5376728A (en) Microwave circuit
JPS6489701A (en) Balun device
JPS5696846A (en) Semiconductor device
JPS55148450A (en) Semiconductor device