JPS57107074A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS57107074A
JPS57107074A JP18458080A JP18458080A JPS57107074A JP S57107074 A JPS57107074 A JP S57107074A JP 18458080 A JP18458080 A JP 18458080A JP 18458080 A JP18458080 A JP 18458080A JP S57107074 A JPS57107074 A JP S57107074A
Authority
JP
Japan
Prior art keywords
layer
depletion layer
lattice defects
substrate
hcl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18458080A
Other languages
Japanese (ja)
Inventor
Yasuaki Hokari
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP18458080A priority Critical patent/JPS57107074A/en
Publication of JPS57107074A publication Critical patent/JPS57107074A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Bipolar Transistors (AREA)

Abstract

PURPOSE:To prevent false functioning caused by diffusion of minor carriers by providing highly concentrated lattice defects of the same type as the semiconductor substrate and of conductive type at the end of a depletion layer. CONSTITUTION:False functioning takes place by alpha rays when an MOS FET and a dynamic memory cell are formed on a silicon substrate 1. Therefore, lattice defects 15 of 10<6>-10<8>/cm<3> are created at a depth of about 5 to 50mum from the surface by oxidation treatment at 750 deg.C for several tens of hours after the silicon substrate 1 oxidized by HCl at 1,150 deg.C for a few hours. The oxidation by HCl is to be carried out in a manner that a depletion layer is formed at such a depth as the depletion layer does not reach the layer 15. As rebonding speed of minor carriers is about 1/100 of that of normal silicon substrates in a region having high density lattice defects, false functioning caused by alpha rays can remarkably be reduced. It is very effective to compensate reduction in surface concentration resulting from high temperature treatment by ion implantation for prevention of characteristic variation and to provide a layer 16 of the same type as the substrate, of concentration of 10<19>-10<20>/cm<3> and of 10mum thick in contact with the layer 15 for making the depletion layer come into contact when voltage applied to an electrode 5 or impurity layer 4.
JP18458080A 1980-12-25 1980-12-25 Semiconductor device Pending JPS57107074A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18458080A JPS57107074A (en) 1980-12-25 1980-12-25 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18458080A JPS57107074A (en) 1980-12-25 1980-12-25 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS57107074A true JPS57107074A (en) 1982-07-03

Family

ID=16155689

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18458080A Pending JPS57107074A (en) 1980-12-25 1980-12-25 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57107074A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5988832A (en) * 1982-11-12 1984-05-22 Fujitsu Ltd Semiconductor device
JPS59182559A (en) * 1983-04-01 1984-10-17 Hitachi Ltd Semiconductor device and manufacture thereof
JPS6015963A (en) * 1983-07-06 1985-01-26 Toshiba Corp Metal oxide semiconductor type integrated circuit

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5515237A (en) * 1978-07-19 1980-02-02 Toshiba Corp Semiconductor device
JPS55156358A (en) * 1979-05-25 1980-12-05 Hitachi Ltd Semiconductor memory device
JPS55162258A (en) * 1979-06-05 1980-12-17 Fujitsu Ltd Semiconductor memory device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5515237A (en) * 1978-07-19 1980-02-02 Toshiba Corp Semiconductor device
JPS55156358A (en) * 1979-05-25 1980-12-05 Hitachi Ltd Semiconductor memory device
JPS55162258A (en) * 1979-06-05 1980-12-17 Fujitsu Ltd Semiconductor memory device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5988832A (en) * 1982-11-12 1984-05-22 Fujitsu Ltd Semiconductor device
JPS59182559A (en) * 1983-04-01 1984-10-17 Hitachi Ltd Semiconductor device and manufacture thereof
JPS6015963A (en) * 1983-07-06 1985-01-26 Toshiba Corp Metal oxide semiconductor type integrated circuit

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