JPS5649534A - Bonding wire for semiconductor device - Google Patents

Bonding wire for semiconductor device

Info

Publication number
JPS5649534A
JPS5649534A JP12494879A JP12494879A JPS5649534A JP S5649534 A JPS5649534 A JP S5649534A JP 12494879 A JP12494879 A JP 12494879A JP 12494879 A JP12494879 A JP 12494879A JP S5649534 A JPS5649534 A JP S5649534A
Authority
JP
Japan
Prior art keywords
bonding wire
purity
bonding
strength
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12494879A
Other languages
Japanese (ja)
Other versions
JPS6223454B2 (en
Inventor
Norimasa Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP12494879A priority Critical patent/JPS5649534A/en
Publication of JPS5649534A publication Critical patent/JPS5649534A/en
Publication of JPS6223454B2 publication Critical patent/JPS6223454B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45015—Cross-sectional shape being circular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To improve the mechanical strength and bonding strength of an Si chip to a pad by a constitution wherein a bonding wire contains Au and Pt with the predetermined purity and composition and a very small amount of at least one of Be, Ca and Ge with a predetermined content. CONSTITUTION:A bonding wire for a semiconductor device is formed by adding 1-30W/O of high purity Pt with the purity not less than 99.9W/O to high purity Au with the purity not less than 99.99W/O. Then, at least one of Be, Ca and Ge is added to thus obtained Au and Pt by 0.0003-0.05W/O in total amount, as required. By so doing, it becomes possible to obtain the bonding wire superior in the mechanical strength, particularly in the fructure strength at the bonding time, and increase the tensile strength in the state after an Si chip is bonded to a pad. Thus, a diameter of the bonding wire can be reduced to several tens mum to form a very fine wire and the size of the pad can be also reduced.
JP12494879A 1979-09-28 1979-09-28 Bonding wire for semiconductor device Granted JPS5649534A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12494879A JPS5649534A (en) 1979-09-28 1979-09-28 Bonding wire for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12494879A JPS5649534A (en) 1979-09-28 1979-09-28 Bonding wire for semiconductor device

Publications (2)

Publication Number Publication Date
JPS5649534A true JPS5649534A (en) 1981-05-06
JPS6223454B2 JPS6223454B2 (en) 1987-05-22

Family

ID=14898159

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12494879A Granted JPS5649534A (en) 1979-09-28 1979-09-28 Bonding wire for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5649534A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1989011161A1 (en) * 1988-05-02 1989-11-16 Nippon Steel Corporation Bonding wire for semiconductor elements
US4885135A (en) * 1981-12-04 1989-12-05 Mitsubishi Kinzoku Kabushiki Kaisha Fine gold alloy wire for bonding of a semi-conductor device
JPH03259044A (en) * 1990-03-06 1991-11-19 Fuji Oil Co Ltd Production of soybean protein film
AT407830B (en) * 1999-09-10 2001-06-25 Degussa Huels Cee Gmbh HIGH GOLDEN YELLOW DENTAL ALLOY
SG87207A1 (en) * 2000-06-19 2002-03-19 Tanaka Electronics Ind Gold wire for semiconductor element bonding
JP5582484B1 (en) * 2013-12-20 2014-09-03 田中貴金属工業株式会社 Medical alloy and method for producing the same

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4885135A (en) * 1981-12-04 1989-12-05 Mitsubishi Kinzoku Kabushiki Kaisha Fine gold alloy wire for bonding of a semi-conductor device
US5071619A (en) * 1981-12-04 1991-12-10 Mitsubishi Kinzoku Kabushiki Kaisha Fine gold alloy wire for bonding of a semiconductor device
WO1989011161A1 (en) * 1988-05-02 1989-11-16 Nippon Steel Corporation Bonding wire for semiconductor elements
JPH02119148A (en) * 1988-05-02 1990-05-07 Nippon Steel Corp Bonding wire for semiconductor element
JPH03259044A (en) * 1990-03-06 1991-11-19 Fuji Oil Co Ltd Production of soybean protein film
AT407830B (en) * 1999-09-10 2001-06-25 Degussa Huels Cee Gmbh HIGH GOLDEN YELLOW DENTAL ALLOY
SG87207A1 (en) * 2000-06-19 2002-03-19 Tanaka Electronics Ind Gold wire for semiconductor element bonding
JP5582484B1 (en) * 2013-12-20 2014-09-03 田中貴金属工業株式会社 Medical alloy and method for producing the same
WO2015093064A1 (en) * 2013-12-20 2015-06-25 田中貴金属工業株式会社 Alloy for medical use, and method for producing same
CN105917012A (en) * 2013-12-20 2016-08-31 田中贵金属工业株式会社 Alloy for medical use, and method for producing same
US10883162B2 (en) 2013-12-20 2021-01-05 Tanaka Kikinzoku Kogyo K.K. Alloy for medical use, and method for producing same
US11345986B2 (en) 2013-12-20 2022-05-31 Tanaka Kikinzoku Kogyo K.K. Alloy for medical use, and method for producing same

Also Published As

Publication number Publication date
JPS6223454B2 (en) 1987-05-22

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