JPS5646548A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5646548A
JPS5646548A JP12337279A JP12337279A JPS5646548A JP S5646548 A JPS5646548 A JP S5646548A JP 12337279 A JP12337279 A JP 12337279A JP 12337279 A JP12337279 A JP 12337279A JP S5646548 A JPS5646548 A JP S5646548A
Authority
JP
Japan
Prior art keywords
stepped portion
plate
shielding plate
package
periphery
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12337279A
Other languages
Japanese (ja)
Inventor
Masanobu Obara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP12337279A priority Critical patent/JPS5646548A/en
Publication of JPS5646548A publication Critical patent/JPS5646548A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H01L23/556—Protection against radiation, e.g. light or electromagnetic waves against alpha rays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Light Receiving Elements (AREA)

Abstract

PURPOSE:To obtain a semiconductor device which shields radioactive rays by forming a stepped portion on the periphery of a recess at the center of a package, inserting a radioactive rays shielding plate into the stepped portion, and thereby facilitating a fabrication. CONSTITUTION:A semiconductor element 2 is mounted on a deep recess 1a at the center of a package 1, and a stepped portion 1b is formed on the periphery thereof. When a conductive film on the stepped portion 1b is connected between conductive thin pieces 13 on the element 2 with a copper foil 12, a shielding plate 14 made of light and high purity Si crystalline plate or the like can be easily supported and can also be engaged with the stepped portion 1b. Thus, the bonding therebetween can be eliminated. The plate 14 may be improper element obtained on the way of fabricating the element. Eventually, a cover 6 is sealed. According to this configuration, the shielding plate working accuracy can be lowered, the plate can be easily mounted inexpensively.
JP12337279A 1979-09-25 1979-09-25 Semiconductor device Pending JPS5646548A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12337279A JPS5646548A (en) 1979-09-25 1979-09-25 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12337279A JPS5646548A (en) 1979-09-25 1979-09-25 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5646548A true JPS5646548A (en) 1981-04-27

Family

ID=14858945

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12337279A Pending JPS5646548A (en) 1979-09-25 1979-09-25 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5646548A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4654694A (en) * 1983-07-29 1987-03-31 Compagnie D'informatique Militaire Spatiale Et Aeronautique Electronic component box supplied with a capacitor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4654694A (en) * 1983-07-29 1987-03-31 Compagnie D'informatique Militaire Spatiale Et Aeronautique Electronic component box supplied with a capacitor

Similar Documents

Publication Publication Date Title
JPS5646548A (en) Semiconductor device
JPS56133634A (en) Pyroelectric detector
JPS53112061A (en) Wiring substrate of semiconductor chip
JPS5610938A (en) Press-fit type semiconductor device
JPS56146263A (en) Manufacture of semiconductor device
GB2022316A (en) Method of fabricating a semiconductor device by bonding together a silicon substrate and electrodes with aluminium
JPS5636145A (en) Thin semiconductor integrated circuit device and its manufacture
JPS5243364A (en) Power semiconductor device and process for production of same
JPS5575264A (en) Charge transfer element
JPS57173948A (en) Manufacture of semiconductor device
JPS5325360A (en) Production of semiconductor device
JPS6420643A (en) High heat sink semiconductor device
JPS5793536A (en) Semiconductor device
JPS5593243A (en) Semiconductor device
JPS5624961A (en) Lead frame for semiconductor device
JPS5456364A (en) Semicondutor package
JPS5418280A (en) Resin sealed semiconductor device
JPS5745960A (en) Resin-sealed semiconductor device
JPS57124455A (en) Semiconductor device
GB2089124B (en) Production of sealed semiconductor device
JPS53118992A (en) Semiconductor photo device
JPS55141053A (en) Fluorescent display tube
JPS5688383A (en) Optical coupling element
JPS57128046A (en) Semiconductor device
JPS57125511A (en) Piezoelectric oscillator