JPS5593243A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5593243A
JPS5593243A JP50779A JP50779A JPS5593243A JP S5593243 A JPS5593243 A JP S5593243A JP 50779 A JP50779 A JP 50779A JP 50779 A JP50779 A JP 50779A JP S5593243 A JPS5593243 A JP S5593243A
Authority
JP
Japan
Prior art keywords
island
site
slide
heat radiation
mold resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50779A
Other languages
Japanese (ja)
Other versions
JPS613099B2 (en
Inventor
Jiro Suma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP50779A priority Critical patent/JPS5593243A/en
Publication of JPS5593243A publication Critical patent/JPS5593243A/en
Publication of JPS613099B2 publication Critical patent/JPS613099B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To obtain a structure of satisfactory heat radiation by a method wherein the island position on which the semiconductor chip is fitted is made to slide from the mold resin case center position. CONSTITUTION:Each external lead 2 of the lead frame is arranged as in the conventional dual-in-line type, however, the inner lead shape slides from the island 4 site. The island 4 center is installed at a position approximately 1/3 length equal to the length 7 of the mold resin case fitting site 3. In this way, when the island 4 site is made to slide, the inner lead 9 coupled with the island is reduced and the heat radiation becomes extremely satisfactory.
JP50779A 1979-01-04 1979-01-04 Semiconductor device Granted JPS5593243A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50779A JPS5593243A (en) 1979-01-04 1979-01-04 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50779A JPS5593243A (en) 1979-01-04 1979-01-04 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5593243A true JPS5593243A (en) 1980-07-15
JPS613099B2 JPS613099B2 (en) 1986-01-30

Family

ID=11475673

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50779A Granted JPS5593243A (en) 1979-01-04 1979-01-04 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5593243A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58209146A (en) * 1982-05-31 1983-12-06 Nec Corp Semiconductor device
JPS61163654A (en) * 1985-01-11 1986-07-24 Mitsubishi Electric Corp Lead frame for semiconductor device and semiconductor device using said lead frame

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3544857A (en) * 1966-08-16 1970-12-01 Signetics Corp Integrated circuit assembly with lead structure and method
JPS5215265A (en) * 1975-07-24 1977-02-04 Telcon Metals Ltd Lead frame for semicoductors

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3544857A (en) * 1966-08-16 1970-12-01 Signetics Corp Integrated circuit assembly with lead structure and method
JPS5215265A (en) * 1975-07-24 1977-02-04 Telcon Metals Ltd Lead frame for semicoductors

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58209146A (en) * 1982-05-31 1983-12-06 Nec Corp Semiconductor device
JPS6250059B2 (en) * 1982-05-31 1987-10-22 Nippon Electric Co
JPS61163654A (en) * 1985-01-11 1986-07-24 Mitsubishi Electric Corp Lead frame for semiconductor device and semiconductor device using said lead frame

Also Published As

Publication number Publication date
JPS613099B2 (en) 1986-01-30

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