JPS5610938A - Press-fit type semiconductor device - Google Patents

Press-fit type semiconductor device

Info

Publication number
JPS5610938A
JPS5610938A JP8600179A JP8600179A JPS5610938A JP S5610938 A JPS5610938 A JP S5610938A JP 8600179 A JP8600179 A JP 8600179A JP 8600179 A JP8600179 A JP 8600179A JP S5610938 A JPS5610938 A JP S5610938A
Authority
JP
Japan
Prior art keywords
chip
lead wire
case
press
flat portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8600179A
Other languages
Japanese (ja)
Other versions
JPS6321340B2 (en
Inventor
Motoji Nakajima
Tadashi Sakagami
Kazutoyo Narita
Noboru Kawasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi Power Semiconductor Device Ltd
Original Assignee
Hitachi Ltd
Hitachi Haramachi Electronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Haramachi Electronics Ltd filed Critical Hitachi Ltd
Priority to JP8600179A priority Critical patent/JPS5610938A/en
Publication of JPS5610938A publication Critical patent/JPS5610938A/en
Publication of JPS6321340B2 publication Critical patent/JPS6321340B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To eliminate the rupture of a substantially square silicon chip even when press-fitted into a heat dissipating plate by trimming the four corners of the chip internally inserted into a press-fit type semiconductor device internally containing the chip. CONSTITUTION:A bottom plate flat portion 11 and an escapa groove 8 surrounding the flat portion 11 are formed on a case 2 carying a substantially square silicon chip 1, and the chip 1 is fixed through a solder 3A onto the flat portion 11. A lead wire 4 is connected with solder 3A to the chip 1. Silicone rubber 5 is filled in the recess in the case 2 including the lead wire 4, a base ring 9 is formed on the upper peripheral edge of the case 2, and a projection ring 10 is disposed on the base ring 9. Thereafter, the lead wire 4 is connected to the external lead wire shielding pipe 12, and glass shield 6 is filled in the ring 10. Thereafter, when the case 2 is engaged with the hole 7A formed at the heat dissipating plate 7, the chip 1 is trimmed as designated by R at the four corners to eliminate the rupture of the chip 1.
JP8600179A 1979-07-09 1979-07-09 Press-fit type semiconductor device Granted JPS5610938A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8600179A JPS5610938A (en) 1979-07-09 1979-07-09 Press-fit type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8600179A JPS5610938A (en) 1979-07-09 1979-07-09 Press-fit type semiconductor device

Publications (2)

Publication Number Publication Date
JPS5610938A true JPS5610938A (en) 1981-02-03
JPS6321340B2 JPS6321340B2 (en) 1988-05-06

Family

ID=13874415

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8600179A Granted JPS5610938A (en) 1979-07-09 1979-07-09 Press-fit type semiconductor device

Country Status (1)

Country Link
JP (1) JPS5610938A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61133652A (en) * 1984-11-30 1986-06-20 Hitachi Ltd Semiconductor rectifier
EP0757423A1 (en) * 1995-08-02 1997-02-05 Valeo Equipements Electriques Moteur Alternator comprising parts for adapting rectifying diodes, especially for car alternators, and adaptor parts for this alternator
EP0901167A1 (en) * 1997-09-08 1999-03-10 Valeo Equipements Electriques Moteur Base for power diode of vehicle alternator
JP2009077617A (en) * 2007-08-31 2009-04-09 Denso Corp Rectifier
US7855480B2 (en) 2007-08-31 2010-12-21 Denso Corporation Rectifier device for automotive alternator

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0260136U (en) * 1988-10-26 1990-05-02

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4947711A (en) * 1972-05-08 1974-05-09

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4947711A (en) * 1972-05-08 1974-05-09

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61133652A (en) * 1984-11-30 1986-06-20 Hitachi Ltd Semiconductor rectifier
EP0757423A1 (en) * 1995-08-02 1997-02-05 Valeo Equipements Electriques Moteur Alternator comprising parts for adapting rectifying diodes, especially for car alternators, and adaptor parts for this alternator
FR2737618A1 (en) * 1995-08-02 1997-02-07 Valeo Equip Electr Moteur ALTERNATOR COMPRISING ADAPTER PARTS FOR BRIDGE RECTIFIER DIODES, IN PARTICULAR FOR A MOTOR VEHICLE, AND ADAPTATION PART FOR SUCH ALTERNATOR
US5982062A (en) * 1995-08-02 1999-11-09 Valeo Equipements Electriques Moteur Alternator including adaptors for rectifier bridge diodes, in particular for a motor vehicle, and an adaptor for such an alternator
EP0901167A1 (en) * 1997-09-08 1999-03-10 Valeo Equipements Electriques Moteur Base for power diode of vehicle alternator
FR2768261A1 (en) * 1997-09-08 1999-03-12 Valeo Equip Electr Moteur BASE FOR MOTOR VEHICLE ALTERNATOR POWER DIODE
JP2009077617A (en) * 2007-08-31 2009-04-09 Denso Corp Rectifier
US7855480B2 (en) 2007-08-31 2010-12-21 Denso Corporation Rectifier device for automotive alternator
JP4626665B2 (en) * 2007-08-31 2011-02-09 株式会社デンソー Rectifier

Also Published As

Publication number Publication date
JPS6321340B2 (en) 1988-05-06

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