JPS5646526A - Wafer supporting and pushing apparatus in ion implantation - Google Patents
Wafer supporting and pushing apparatus in ion implantationInfo
- Publication number
- JPS5646526A JPS5646526A JP12336979A JP12336979A JPS5646526A JP S5646526 A JPS5646526 A JP S5646526A JP 12336979 A JP12336979 A JP 12336979A JP 12336979 A JP12336979 A JP 12336979A JP S5646526 A JPS5646526 A JP S5646526A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- pushing
- rotated
- ion implantation
- rotating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005468 ion implantation Methods 0.000 title abstract 2
- 235000012431 wafers Nutrition 0.000 abstract 6
- 230000001133 acceleration Effects 0.000 abstract 1
- 238000013459 approach Methods 0.000 abstract 1
- 238000002513 implantation Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
Landscapes
- Physics & Mathematics (AREA)
- High Energy & Nuclear Physics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
PURPOSE:To smoothly send out wafers by rotating a support member downward, contacting said member to a contact portion, rotating a pushing member, and giving an initail sliding velocity to the wafer by the pushing portion. CONSTITUTION:A wafer 41 that is put in a pre-exhausting chamber is received and supported by a supporting member 51 which is standing-by at a portion A. Then, the member 51 is rotated to a position B, and the wafer 41 is subjected to the ion implantation. When the implantation has been finished, the member 51 is rotated to a position C. When the member 51 approaches the position C, the lower portion of the member 51 contacts with a contact portion 53b of a pushing member 53, thereby the member 53 is rotated. A puhsing wheel 33 is pushed by a pushing portion 53a, thereby very small initial velocity is given. The pusing action of the pushing portion 53a does not give abrupt acceleration to the wafer 41 which is characterized by the normal movement, but gives only slight initial velocity at the initial period of sliding. Therefore, the cracks are seldom generated in the wafer 41 in a processing tank.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12336979A JPS6057656B2 (en) | 1979-09-25 | 1979-09-25 | Wafer support extrusion equipment for ion implantation treatment tank |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12336979A JPS6057656B2 (en) | 1979-09-25 | 1979-09-25 | Wafer support extrusion equipment for ion implantation treatment tank |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5646526A true JPS5646526A (en) | 1981-04-27 |
JPS6057656B2 JPS6057656B2 (en) | 1985-12-16 |
Family
ID=14858871
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12336979A Expired JPS6057656B2 (en) | 1979-09-25 | 1979-09-25 | Wafer support extrusion equipment for ion implantation treatment tank |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6057656B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5898941A (en) * | 1981-11-30 | 1983-06-13 | テンコ−・インストルメンツ | Wafer chuck |
-
1979
- 1979-09-25 JP JP12336979A patent/JPS6057656B2/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5898941A (en) * | 1981-11-30 | 1983-06-13 | テンコ−・インストルメンツ | Wafer chuck |
Also Published As
Publication number | Publication date |
---|---|
JPS6057656B2 (en) | 1985-12-16 |
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