JPS52146558A - Production of beam lead type semiconductor device - Google Patents

Production of beam lead type semiconductor device

Info

Publication number
JPS52146558A
JPS52146558A JP6320076A JP6320076A JPS52146558A JP S52146558 A JPS52146558 A JP S52146558A JP 6320076 A JP6320076 A JP 6320076A JP 6320076 A JP6320076 A JP 6320076A JP S52146558 A JPS52146558 A JP S52146558A
Authority
JP
Japan
Prior art keywords
production
semiconductor device
type semiconductor
beam lead
lead type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6320076A
Other languages
Japanese (ja)
Inventor
Masaru Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP6320076A priority Critical patent/JPS52146558A/en
Publication of JPS52146558A publication Critical patent/JPS52146558A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Abstract

PURPOSE: To perform high-precision processing of beam lead semiconductor devices without undergoing slicing of semiconductor wafers and pelletizing and separating works from the rear of the wafers.
COPYRIGHT: (C)1977,JPO&Japio
JP6320076A 1976-05-31 1976-05-31 Production of beam lead type semiconductor device Pending JPS52146558A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6320076A JPS52146558A (en) 1976-05-31 1976-05-31 Production of beam lead type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6320076A JPS52146558A (en) 1976-05-31 1976-05-31 Production of beam lead type semiconductor device

Publications (1)

Publication Number Publication Date
JPS52146558A true JPS52146558A (en) 1977-12-06

Family

ID=13222325

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6320076A Pending JPS52146558A (en) 1976-05-31 1976-05-31 Production of beam lead type semiconductor device

Country Status (1)

Country Link
JP (1) JPS52146558A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06339403A (en) * 1992-12-02 1994-12-13 Yoshio Suginohara Necktie lock pin
US7550317B2 (en) 2002-02-13 2009-06-23 Samsung Electronics Co., Ltd. Method for manufacture of wafer level package with air pads

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06339403A (en) * 1992-12-02 1994-12-13 Yoshio Suginohara Necktie lock pin
US7550317B2 (en) 2002-02-13 2009-06-23 Samsung Electronics Co., Ltd. Method for manufacture of wafer level package with air pads

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