JPS5632737A - Manufacture of electronic equipment - Google Patents

Manufacture of electronic equipment

Info

Publication number
JPS5632737A
JPS5632737A JP10845879A JP10845879A JPS5632737A JP S5632737 A JPS5632737 A JP S5632737A JP 10845879 A JP10845879 A JP 10845879A JP 10845879 A JP10845879 A JP 10845879A JP S5632737 A JPS5632737 A JP S5632737A
Authority
JP
Japan
Prior art keywords
mold
substrate
resin
external terminals
electronic equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10845879A
Other languages
Japanese (ja)
Other versions
JPS5725975B2 (en
Inventor
Tsutomu Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co
Priority to JP10845879A priority Critical patent/JPS5632737A/en
Publication of JPS5632737A publication Critical patent/JPS5632737A/en
Publication of JPS5725975B2 publication Critical patent/JPS5725975B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To stably seal a wired substrate by fixing external terminals to the substrate, inserting the small-diameter portion thereof at the idle end side into the hole of a mold, engage the stepped portion thereof with the mold and making the other mold contact with a part of the back surface of the substrate, and filling resin in the space of the mold. CONSTITUTION:The small-diameter portions 14 of an external terminals 12 are inserted into the holes 18 of a mold 16, stepped portion 15 is engaged with the inside surface of the mold, the projecting piece 19 of the mold 17 is made contact with the edges 21, 22 of the wired substrate 10, and the substrate 10 and the terminal 12 are interposed between the projecting piece 19 and the inside surface 20 of the mold. Resin 24 is filled in the space 23 of the mold, and an enclosure 25 for internally containing the substrate 10, the part 11 and the large-diameter portions 13 of the terminals 12 is formed. The molds are then separated, and a predetermined electronic equipment can be thus fabricated. According to this configuration, the wired substrate is not floated by the resin nor inclined even at the time of sealing the resin, and no projected resin portion is produced on the external terminals.
JP10845879A 1979-08-24 1979-08-24 Manufacture of electronic equipment Granted JPS5632737A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10845879A JPS5632737A (en) 1979-08-24 1979-08-24 Manufacture of electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10845879A JPS5632737A (en) 1979-08-24 1979-08-24 Manufacture of electronic equipment

Publications (2)

Publication Number Publication Date
JPS5632737A true JPS5632737A (en) 1981-04-02
JPS5725975B2 JPS5725975B2 (en) 1982-06-02

Family

ID=14485273

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10845879A Granted JPS5632737A (en) 1979-08-24 1979-08-24 Manufacture of electronic equipment

Country Status (1)

Country Link
JP (1) JPS5632737A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998008251A1 (en) * 1996-08-20 1998-02-26 Hitachi, Ltd. Semiconductor and method for manufacturing the same
JP2022070001A (en) * 2020-10-26 2022-05-12 株式会社デンソー Electric component and manufacturing method of electric component

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998008251A1 (en) * 1996-08-20 1998-02-26 Hitachi, Ltd. Semiconductor and method for manufacturing the same
EP1119037A3 (en) * 1996-08-20 2001-10-10 Hitachi, Ltd. Semiconductor device and method of manufacturing thereof
JP2022070001A (en) * 2020-10-26 2022-05-12 株式会社デンソー Electric component and manufacturing method of electric component

Also Published As

Publication number Publication date
JPS5725975B2 (en) 1982-06-02

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