JPS5632737A - Manufacture of electronic equipment - Google Patents
Manufacture of electronic equipmentInfo
- Publication number
- JPS5632737A JPS5632737A JP10845879A JP10845879A JPS5632737A JP S5632737 A JPS5632737 A JP S5632737A JP 10845879 A JP10845879 A JP 10845879A JP 10845879 A JP10845879 A JP 10845879A JP S5632737 A JPS5632737 A JP S5632737A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- substrate
- resin
- external terminals
- electronic equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 7
- 239000011347 resin Substances 0.000 abstract 5
- 229920005989 resin Polymers 0.000 abstract 5
- 238000007789 sealing Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE:To stably seal a wired substrate by fixing external terminals to the substrate, inserting the small-diameter portion thereof at the idle end side into the hole of a mold, engage the stepped portion thereof with the mold and making the other mold contact with a part of the back surface of the substrate, and filling resin in the space of the mold. CONSTITUTION:The small-diameter portions 14 of an external terminals 12 are inserted into the holes 18 of a mold 16, stepped portion 15 is engaged with the inside surface of the mold, the projecting piece 19 of the mold 17 is made contact with the edges 21, 22 of the wired substrate 10, and the substrate 10 and the terminal 12 are interposed between the projecting piece 19 and the inside surface 20 of the mold. Resin 24 is filled in the space 23 of the mold, and an enclosure 25 for internally containing the substrate 10, the part 11 and the large-diameter portions 13 of the terminals 12 is formed. The molds are then separated, and a predetermined electronic equipment can be thus fabricated. According to this configuration, the wired substrate is not floated by the resin nor inclined even at the time of sealing the resin, and no projected resin portion is produced on the external terminals.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10845879A JPS5632737A (en) | 1979-08-24 | 1979-08-24 | Manufacture of electronic equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10845879A JPS5632737A (en) | 1979-08-24 | 1979-08-24 | Manufacture of electronic equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5632737A true JPS5632737A (en) | 1981-04-02 |
JPS5725975B2 JPS5725975B2 (en) | 1982-06-02 |
Family
ID=14485273
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10845879A Granted JPS5632737A (en) | 1979-08-24 | 1979-08-24 | Manufacture of electronic equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5632737A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998008251A1 (en) * | 1996-08-20 | 1998-02-26 | Hitachi, Ltd. | Semiconductor and method for manufacturing the same |
JP2022070001A (en) * | 2020-10-26 | 2022-05-12 | 株式会社デンソー | Electric component and manufacturing method of electric component |
-
1979
- 1979-08-24 JP JP10845879A patent/JPS5632737A/en active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998008251A1 (en) * | 1996-08-20 | 1998-02-26 | Hitachi, Ltd. | Semiconductor and method for manufacturing the same |
EP1119037A3 (en) * | 1996-08-20 | 2001-10-10 | Hitachi, Ltd. | Semiconductor device and method of manufacturing thereof |
JP2022070001A (en) * | 2020-10-26 | 2022-05-12 | 株式会社デンソー | Electric component and manufacturing method of electric component |
Also Published As
Publication number | Publication date |
---|---|
JPS5725975B2 (en) | 1982-06-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS52116074A (en) | Electronic part | |
JPS5553450A (en) | Semiconductor device with resin enclosure | |
JPS5632737A (en) | Manufacture of electronic equipment | |
JPS5558557A (en) | Resin mold type electronic component and lead frame used therefor | |
JPS53124075A (en) | Manufacture of resin sealing type semiconductor device and metal mold used for said manufacture | |
JPS54107967A (en) | Mold | |
JPS649696A (en) | Resin molding with circuit | |
JPS5275180A (en) | Package for integrated circuits | |
JPS6425610A (en) | Electronic component | |
JPS55107252A (en) | Manufacture of semiconductor device | |
JPS5769762A (en) | Sealing method of hybrid integrated circuit | |
JPS51137377A (en) | Manufacturing method for plastic seal type semi conductor | |
JPS5745264A (en) | Manufacture of electronic part molded with resin | |
JPS51117575A (en) | Electronic circuit and its manufacturing method | |
JPS649695A (en) | Electronic circuit | |
JPS5397370A (en) | Trasfer mold device for semiconductor device | |
JPS5369581A (en) | Manufacture for resin sealed type semiconductor device | |
JPS5387173A (en) | Molding mold | |
JPS57178389A (en) | Resin sealing type hall element | |
JPS56158462A (en) | Lead frame for single inline semiconductor device | |
JPS548438A (en) | Electronic parts using ceramic resonator | |
JPS6465861A (en) | Lead frame for semiconductor device | |
JPS57168207A (en) | Manufacture of optical fiber device | |
JPS5242767A (en) | Electronic watch | |
JPS5713667A (en) | Manufacture of storage battery |