JPS53124075A - Manufacture of resin sealing type semiconductor device and metal mold used for said manufacture - Google Patents

Manufacture of resin sealing type semiconductor device and metal mold used for said manufacture

Info

Publication number
JPS53124075A
JPS53124075A JP3105178A JP3105178A JPS53124075A JP S53124075 A JPS53124075 A JP S53124075A JP 3105178 A JP3105178 A JP 3105178A JP 3105178 A JP3105178 A JP 3105178A JP S53124075 A JPS53124075 A JP S53124075A
Authority
JP
Japan
Prior art keywords
manufacture
metal mold
semiconductor device
type semiconductor
resin sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3105178A
Other languages
Japanese (ja)
Other versions
JPS5635301B2 (en
Inventor
Tetsuo Hajime
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3105178A priority Critical patent/JPS53124075A/en
Publication of JPS53124075A publication Critical patent/JPS53124075A/en
Publication of JPS5635301B2 publication Critical patent/JPS5635301B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14336—Coating a portion of the article, e.g. the edge of the article
    • B29C45/14418—Sealing means between mould and article

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To obtain a sealing device which is free from the flash by providing a projection part to the metal mold touching the metal substance near the cavity and then clamping the metal substance with the metal mold to inject the resin.
JP3105178A 1978-03-20 1978-03-20 Manufacture of resin sealing type semiconductor device and metal mold used for said manufacture Granted JPS53124075A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3105178A JPS53124075A (en) 1978-03-20 1978-03-20 Manufacture of resin sealing type semiconductor device and metal mold used for said manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3105178A JPS53124075A (en) 1978-03-20 1978-03-20 Manufacture of resin sealing type semiconductor device and metal mold used for said manufacture

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP1509071A Division JPS5549966B1 (en) 1971-03-19 1971-03-19

Publications (2)

Publication Number Publication Date
JPS53124075A true JPS53124075A (en) 1978-10-30
JPS5635301B2 JPS5635301B2 (en) 1981-08-15

Family

ID=12320676

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3105178A Granted JPS53124075A (en) 1978-03-20 1978-03-20 Manufacture of resin sealing type semiconductor device and metal mold used for said manufacture

Country Status (1)

Country Link
JP (1) JPS53124075A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4862586A (en) * 1985-02-28 1989-09-05 Michio Osada Lead frame for enclosing semiconductor chips with resin
US4965933A (en) * 1989-05-22 1990-10-30 The Cherry Corporation Process for making insert molded circuit
US5203060A (en) * 1989-05-22 1993-04-20 Mraz James E Apparatus for making insert molded circuitry
US5336272A (en) * 1988-10-13 1994-08-09 Mitsubishi Denki Kabushiki Kaisha Method for molding a semiconductor package on a continuous leadframe
US5422163A (en) * 1991-02-13 1995-06-06 Nippon Steel Corporation Flexible substrate with projections to block resin flow
US5728600A (en) * 1994-11-15 1998-03-17 Vlt Corporation Circuit encapsulation process
US5945130A (en) * 1994-11-15 1999-08-31 Vlt Corporation Apparatus for circuit encapsulation

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4862586A (en) * 1985-02-28 1989-09-05 Michio Osada Lead frame for enclosing semiconductor chips with resin
US5336272A (en) * 1988-10-13 1994-08-09 Mitsubishi Denki Kabushiki Kaisha Method for molding a semiconductor package on a continuous leadframe
US4965933A (en) * 1989-05-22 1990-10-30 The Cherry Corporation Process for making insert molded circuit
US5203060A (en) * 1989-05-22 1993-04-20 Mraz James E Apparatus for making insert molded circuitry
US5422163A (en) * 1991-02-13 1995-06-06 Nippon Steel Corporation Flexible substrate with projections to block resin flow
US5728600A (en) * 1994-11-15 1998-03-17 Vlt Corporation Circuit encapsulation process
US5945130A (en) * 1994-11-15 1999-08-31 Vlt Corporation Apparatus for circuit encapsulation
US6403009B1 (en) 1994-11-15 2002-06-11 Vlt Corporation Circuit encapsulation
US6710257B2 (en) 1994-11-15 2004-03-23 Vlt Corporation Circuit encapsulation

Also Published As

Publication number Publication date
JPS5635301B2 (en) 1981-08-15

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