JPS5630725A - Electronic exposing device - Google Patents

Electronic exposing device

Info

Publication number
JPS5630725A
JPS5630725A JP10690479A JP10690479A JPS5630725A JP S5630725 A JPS5630725 A JP S5630725A JP 10690479 A JP10690479 A JP 10690479A JP 10690479 A JP10690479 A JP 10690479A JP S5630725 A JPS5630725 A JP S5630725A
Authority
JP
Japan
Prior art keywords
temperature
chamber
sub
exposure
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10690479A
Other languages
Japanese (ja)
Inventor
Takeari Uema
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP10690479A priority Critical patent/JPS5630725A/en
Publication of JPS5630725A publication Critical patent/JPS5630725A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/16—Vessels; Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/002—Cooling arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/2001—Maintaining constant desired temperature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Plasma & Fusion (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Electron Beam Exposure (AREA)

Abstract

PURPOSE:To sharply reduce an exposure processing time and to improve in luminance of an exposure pattern by a method wherein a temperature in a sub-chamber is controlled so that it is equal to the temperature of a sample board located in an electronic exposure device. CONSTITUTION:A sample and a mask, which will be given an electronic exposure in the electronic exposing device 1, are placed in the sub-chamber 12 in advance. A temperature detector 22 attached to the sample board 21 detects the temperature in a main chamber 11 and it is sent to a comparison circuit 41 of a temperature adjusting device 13. On the other hand, a temperature detector 31 attached in the sub- chamber 12 detects the temperature in the sub-chamber 12 and the detected temperature is sent to the circuit 41. The circuit 41 adjusts the temperature in the sub- chamber 12 in order to have the temperature inside the sub-chamber 12 coincide with the temperature of the detector 22 with a temperature adjusting section 42. As a result, the sample, the mask, etc. stored in the sub-chamber 12 can be taken out for immediate use, the exposure time is sharply reduced and the accuracy of the exposure pattern is increased.
JP10690479A 1979-08-22 1979-08-22 Electronic exposing device Pending JPS5630725A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10690479A JPS5630725A (en) 1979-08-22 1979-08-22 Electronic exposing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10690479A JPS5630725A (en) 1979-08-22 1979-08-22 Electronic exposing device

Publications (1)

Publication Number Publication Date
JPS5630725A true JPS5630725A (en) 1981-03-27

Family

ID=14445435

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10690479A Pending JPS5630725A (en) 1979-08-22 1979-08-22 Electronic exposing device

Country Status (1)

Country Link
JP (1) JPS5630725A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59130111U (en) * 1983-02-18 1984-09-01 日本電子株式会社 Temperature control device for materials in charged particle beam exposure equipment, etc.
JPS60171725A (en) * 1984-02-17 1985-09-05 Toshiba Corp Charged beam exposure unit
JPS61239624A (en) * 1985-04-16 1986-10-24 Toshiba Mach Co Ltd Apparatus and process of loading

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54100668A (en) * 1978-01-26 1979-08-08 Toshiba Corp Electron-beam exposure unit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54100668A (en) * 1978-01-26 1979-08-08 Toshiba Corp Electron-beam exposure unit

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59130111U (en) * 1983-02-18 1984-09-01 日本電子株式会社 Temperature control device for materials in charged particle beam exposure equipment, etc.
JPS60171725A (en) * 1984-02-17 1985-09-05 Toshiba Corp Charged beam exposure unit
JPS61239624A (en) * 1985-04-16 1986-10-24 Toshiba Mach Co Ltd Apparatus and process of loading

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