JPS5391577A - Manufacture of semiconductor device of resinsealing type - Google Patents

Manufacture of semiconductor device of resinsealing type

Info

Publication number
JPS5391577A
JPS5391577A JP625577A JP625577A JPS5391577A JP S5391577 A JPS5391577 A JP S5391577A JP 625577 A JP625577 A JP 625577A JP 625577 A JP625577 A JP 625577A JP S5391577 A JPS5391577 A JP S5391577A
Authority
JP
Japan
Prior art keywords
type
resinsealing
manufacture
semiconductor device
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP625577A
Other languages
Japanese (ja)
Inventor
Masaharu Takeuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP625577A priority Critical patent/JPS5391577A/en
Publication of JPS5391577A publication Critical patent/JPS5391577A/en
Pending legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To make it possible to use a flat lead frame by forming the difference in level between an external lead surface and dipad surface during the formation of a resin-sealed part in the resin-sealing process in the manufacturing method of a semiconductor of the resin-sealing type.
COPYRIGHT: (C)1978,JPO&Japio
JP625577A 1977-01-21 1977-01-21 Manufacture of semiconductor device of resinsealing type Pending JPS5391577A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP625577A JPS5391577A (en) 1977-01-21 1977-01-21 Manufacture of semiconductor device of resinsealing type

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP625577A JPS5391577A (en) 1977-01-21 1977-01-21 Manufacture of semiconductor device of resinsealing type

Publications (1)

Publication Number Publication Date
JPS5391577A true JPS5391577A (en) 1978-08-11

Family

ID=11633366

Family Applications (1)

Application Number Title Priority Date Filing Date
JP625577A Pending JPS5391577A (en) 1977-01-21 1977-01-21 Manufacture of semiconductor device of resinsealing type

Country Status (1)

Country Link
JP (1) JPS5391577A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5735358A (en) * 1980-08-13 1982-02-25 Hitachi Ltd Lead frame and semiconductor device using said frame
JPS6055647A (en) * 1983-09-07 1985-03-30 Nec Corp Semiconductor device
JPS6080262A (en) * 1983-10-07 1985-05-08 Nec Corp Semiconductor device
JPH04748A (en) * 1990-04-17 1992-01-06 Mitsubishi Electric Corp Semiconductor device
JPH09307046A (en) * 1996-05-15 1997-11-28 Nec Corp Molding die and tie-bar cutting method using molding die

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5735358A (en) * 1980-08-13 1982-02-25 Hitachi Ltd Lead frame and semiconductor device using said frame
JPS6055647A (en) * 1983-09-07 1985-03-30 Nec Corp Semiconductor device
JPS6080262A (en) * 1983-10-07 1985-05-08 Nec Corp Semiconductor device
JPH04748A (en) * 1990-04-17 1992-01-06 Mitsubishi Electric Corp Semiconductor device
JPH09307046A (en) * 1996-05-15 1997-11-28 Nec Corp Molding die and tie-bar cutting method using molding die

Similar Documents

Publication Publication Date Title
JPS5391577A (en) Manufacture of semiconductor device of resinsealing type
JPS5427772A (en) Production of semiconductor devices
JPS52117066A (en) Semiconductor device
JPS51121272A (en) Manufacturing method for semiconductor devices
JPS5419652A (en) Lead bonding method
JPS5219975A (en) Semiconductor device
JPS5423466A (en) Manufacture for semiconductor device
JPS51146194A (en) Diode device fabrication method
JPS52179A (en) Method of fabricating semiconductor
JPS51151081A (en) Mos type semiconductor apparatus and that manufacturing method
JPS5363866A (en) Production of semiconductor device
JPS5287982A (en) Resin molding method of semiconductor elements
JPS51123073A (en) Insulated gate (type) semiconductor device
JPS51112292A (en) Semiconductor device
JPS51112279A (en) Semiconductor device
JPS5251872A (en) Production of semiconductor device
JPS51138166A (en) Production method of semiconductor device
JPS5285465A (en) Production of semiconductor device
JPS52143767A (en) Production of semiconductor device
JPS5261956A (en) Production of semiconductor device
JPS51124378A (en) Semiconductor manufacture method and lead frame used
JPS5370671A (en) Production of semiconductor device
JPS52142976A (en) Production of semiconductor integrated circuit device
JPS51120688A (en) Manufacturing method for semiconductor apparatus
JPS5267580A (en) Semiconductor integrated circuit and manufacturing method thereof