JPS5391577A - Manufacture of semiconductor device of resinsealing type - Google Patents
Manufacture of semiconductor device of resinsealing typeInfo
- Publication number
- JPS5391577A JPS5391577A JP625577A JP625577A JPS5391577A JP S5391577 A JPS5391577 A JP S5391577A JP 625577 A JP625577 A JP 625577A JP 625577 A JP625577 A JP 625577A JP S5391577 A JPS5391577 A JP S5391577A
- Authority
- JP
- Japan
- Prior art keywords
- type
- resinsealing
- manufacture
- semiconductor device
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To make it possible to use a flat lead frame by forming the difference in level between an external lead surface and dipad surface during the formation of a resin-sealed part in the resin-sealing process in the manufacturing method of a semiconductor of the resin-sealing type.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP625577A JPS5391577A (en) | 1977-01-21 | 1977-01-21 | Manufacture of semiconductor device of resinsealing type |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP625577A JPS5391577A (en) | 1977-01-21 | 1977-01-21 | Manufacture of semiconductor device of resinsealing type |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5391577A true JPS5391577A (en) | 1978-08-11 |
Family
ID=11633366
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP625577A Pending JPS5391577A (en) | 1977-01-21 | 1977-01-21 | Manufacture of semiconductor device of resinsealing type |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5391577A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5735358A (en) * | 1980-08-13 | 1982-02-25 | Hitachi Ltd | Lead frame and semiconductor device using said frame |
JPS6055647A (en) * | 1983-09-07 | 1985-03-30 | Nec Corp | Semiconductor device |
JPS6080262A (en) * | 1983-10-07 | 1985-05-08 | Nec Corp | Semiconductor device |
JPH04748A (en) * | 1990-04-17 | 1992-01-06 | Mitsubishi Electric Corp | Semiconductor device |
JPH09307046A (en) * | 1996-05-15 | 1997-11-28 | Nec Corp | Molding die and tie-bar cutting method using molding die |
-
1977
- 1977-01-21 JP JP625577A patent/JPS5391577A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5735358A (en) * | 1980-08-13 | 1982-02-25 | Hitachi Ltd | Lead frame and semiconductor device using said frame |
JPS6055647A (en) * | 1983-09-07 | 1985-03-30 | Nec Corp | Semiconductor device |
JPS6080262A (en) * | 1983-10-07 | 1985-05-08 | Nec Corp | Semiconductor device |
JPH04748A (en) * | 1990-04-17 | 1992-01-06 | Mitsubishi Electric Corp | Semiconductor device |
JPH09307046A (en) * | 1996-05-15 | 1997-11-28 | Nec Corp | Molding die and tie-bar cutting method using molding die |
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