JPS5620193A - Preparation of plated wire - Google Patents
Preparation of plated wireInfo
- Publication number
- JPS5620193A JPS5620193A JP9562479A JP9562479A JPS5620193A JP S5620193 A JPS5620193 A JP S5620193A JP 9562479 A JP9562479 A JP 9562479A JP 9562479 A JP9562479 A JP 9562479A JP S5620193 A JPS5620193 A JP S5620193A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- wire
- die
- plated
- treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Wire Processing (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
PURPOSE: To squeeze out and recover the surplus liquid taken out from plating bath, by performing stretching treatment by passing plated wire through the die immediately after plating treatment.
CONSTITUTION: The plating core wire 9 suitably pretreated preliminarily, is introduced into the plating bath 1 containing the plating liquid 2 and is plated at a fixed thickness. next, the plated wire 10 is introduced in the die 6 and then, is introduced into the flushing vessel 3 after stretching treatment. On this occasion, the plating liquid suqeezed out by the die 6, is recovered in the plating liquid recovering 8 placed just under the die 6 and is reused suitably. Then, the wire 10 washed in the vessel 3 and dried in the drier 4, is rolled round the coiler 5. On occasion demands, the plating treatment can be substituted by electroplating, displacement plating or nonelectrolytic plating. Further, stretching of the plated wire is preferably performed making slender within the range of 1W100μ diameter of the plating wire.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9562479A JPS5620193A (en) | 1979-07-25 | 1979-07-25 | Preparation of plated wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9562479A JPS5620193A (en) | 1979-07-25 | 1979-07-25 | Preparation of plated wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5620193A true JPS5620193A (en) | 1981-02-25 |
Family
ID=14142676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9562479A Pending JPS5620193A (en) | 1979-07-25 | 1979-07-25 | Preparation of plated wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5620193A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60105260A (en) * | 1983-11-11 | 1985-06-10 | Nitto Electric Ind Co Ltd | Structure of carrying body for small-sized electronic parts |
| JPS6335679A (en) * | 1986-07-30 | 1988-02-16 | Nitto Electric Ind Co Ltd | Adhesive film or sheet for surface protection |
| JPS6335680A (en) * | 1986-07-30 | 1988-02-16 | Nitto Electric Ind Co Ltd | Adhesive film or sheet for surface protection |
| JPH0661943U (en) * | 1993-02-02 | 1994-09-02 | スウ チン−ファン | Laminated sheet for pasting sheet-like articles |
| US9586388B2 (en) | 2005-12-16 | 2017-03-07 | Nichiban Co., Ltd. | Chip-resistant film |
-
1979
- 1979-07-25 JP JP9562479A patent/JPS5620193A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60105260A (en) * | 1983-11-11 | 1985-06-10 | Nitto Electric Ind Co Ltd | Structure of carrying body for small-sized electronic parts |
| JPH0337760B2 (en) * | 1983-11-11 | 1991-06-06 | Nitto Denko Corp | |
| JPS6335679A (en) * | 1986-07-30 | 1988-02-16 | Nitto Electric Ind Co Ltd | Adhesive film or sheet for surface protection |
| JPS6335680A (en) * | 1986-07-30 | 1988-02-16 | Nitto Electric Ind Co Ltd | Adhesive film or sheet for surface protection |
| JPH0661943U (en) * | 1993-02-02 | 1994-09-02 | スウ チン−ファン | Laminated sheet for pasting sheet-like articles |
| US9586388B2 (en) | 2005-12-16 | 2017-03-07 | Nichiban Co., Ltd. | Chip-resistant film |
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