JPS5577159A - Electronic part - Google Patents
Electronic partInfo
- Publication number
- JPS5577159A JPS5577159A JP15135578A JP15135578A JPS5577159A JP S5577159 A JPS5577159 A JP S5577159A JP 15135578 A JP15135578 A JP 15135578A JP 15135578 A JP15135578 A JP 15135578A JP S5577159 A JPS5577159 A JP S5577159A
- Authority
- JP
- Japan
- Prior art keywords
- salient
- proper
- hanging
- notch
- points
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
PURPOSE: To improve stability by a construction wherein a salient fixing part of elastic material is provided also on the opposite side surface to the surface with salient lead terminals so as to simply fix a print substrate to an electronic part proper at two points.
CONSTITUTION: There is a notch 4 at the center of an opposite side face 5 to the side with lead terminals 3 of the electronic part proper 1. A salient part 6 for hanging of elastic material is formed in the part of the notch. Said salient part 6 is formed en bloc in L-type from the upper surface 1a of the part proper 1 toward the under surface, having the length d about equal to the thickness of the part proper 1 and at its tip a hanging part for fixing 6a is provided. The terminals 3 are bent at a right angle to be put through the holes 7a of a print substrate while the hanging part 6a is pressed in the hole 7b to be simply fixed at two points on both sides of the part proper 1 thus for improving stability.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15135578A JPS5577159A (en) | 1978-12-06 | 1978-12-06 | Electronic part |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15135578A JPS5577159A (en) | 1978-12-06 | 1978-12-06 | Electronic part |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5577159A true JPS5577159A (en) | 1980-06-10 |
Family
ID=15516728
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15135578A Pending JPS5577159A (en) | 1978-12-06 | 1978-12-06 | Electronic part |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5577159A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57102059A (en) * | 1980-12-16 | 1982-06-24 | Mitsubishi Electric Corp | Hybrid integrated circuit device |
US4975763A (en) * | 1988-03-14 | 1990-12-04 | Texas Instruments Incorporated | Edge-mounted, surface-mount package for semiconductor integrated circuit devices |
US5352851A (en) * | 1992-09-08 | 1994-10-04 | Texas Instruments Incorporated | Edge-mounted, surface-mount integrated circuit device |
-
1978
- 1978-12-06 JP JP15135578A patent/JPS5577159A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57102059A (en) * | 1980-12-16 | 1982-06-24 | Mitsubishi Electric Corp | Hybrid integrated circuit device |
JPS6161701B2 (en) * | 1980-12-16 | 1986-12-26 | Mitsubishi Electric Corp | |
US4975763A (en) * | 1988-03-14 | 1990-12-04 | Texas Instruments Incorporated | Edge-mounted, surface-mount package for semiconductor integrated circuit devices |
US5352851A (en) * | 1992-09-08 | 1994-10-04 | Texas Instruments Incorporated | Edge-mounted, surface-mount integrated circuit device |
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