JPS55110051A - Lead frame and semiconductor device - Google Patents

Lead frame and semiconductor device

Info

Publication number
JPS55110051A
JPS55110051A JP1649179A JP1649179A JPS55110051A JP S55110051 A JPS55110051 A JP S55110051A JP 1649179 A JP1649179 A JP 1649179A JP 1649179 A JP1649179 A JP 1649179A JP S55110051 A JPS55110051 A JP S55110051A
Authority
JP
Japan
Prior art keywords
semiconductor device
lead frame
connection
lead
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1649179A
Other languages
Japanese (ja)
Inventor
Manabu Bonshihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP1649179A priority Critical patent/JPS55110051A/en
Publication of JPS55110051A publication Critical patent/JPS55110051A/en
Pending legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To obtain a stable lead frame by bending the end of each lead in the direction approaching the substrate electrode.
CONSTITUTION: By press forming, the areas of ends 15 of inner leads 14, 16 of the lead frame are made smaller than the area of electrode 5 of semiconductor device 4, and further, these ends are pressed downward and their surfaces of contact are made nearly parallel to each other. By this, connection between the semiconductor device and the lead frame is made easy, and further, when the lead frane is given a desired plating, connection is further facilitated, so that connection can be made without impairing the characteristics of the semiconductor device.
COPYRIGHT: (C)1980,JPO&Japio
JP1649179A 1979-02-15 1979-02-15 Lead frame and semiconductor device Pending JPS55110051A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1649179A JPS55110051A (en) 1979-02-15 1979-02-15 Lead frame and semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1649179A JPS55110051A (en) 1979-02-15 1979-02-15 Lead frame and semiconductor device

Publications (1)

Publication Number Publication Date
JPS55110051A true JPS55110051A (en) 1980-08-25

Family

ID=11917753

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1649179A Pending JPS55110051A (en) 1979-02-15 1979-02-15 Lead frame and semiconductor device

Country Status (1)

Country Link
JP (1) JPS55110051A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61234061A (en) * 1985-04-10 1986-10-18 Kyushu Hitachi Maxell Ltd Manufacture of lead frame of semiconductor device
JPS61234060A (en) * 1985-04-10 1986-10-18 Kyushu Hitachi Maxell Ltd Manufacture of lead frame of semiconductor device
JPS63232360A (en) * 1987-03-20 1988-09-28 Hitachi Ltd Semiconductor device and manufacture thereof
JPH0396050U (en) * 1990-01-23 1991-10-01

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS534248B2 (en) * 1972-03-11 1978-02-15
JPS5330873A (en) * 1976-09-03 1978-03-23 Citizen Watch Co Ltd Packaging structure of ic
JPS542662A (en) * 1977-06-08 1979-01-10 Seiko Epson Corp Semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS534248B2 (en) * 1972-03-11 1978-02-15
JPS5330873A (en) * 1976-09-03 1978-03-23 Citizen Watch Co Ltd Packaging structure of ic
JPS542662A (en) * 1977-06-08 1979-01-10 Seiko Epson Corp Semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61234061A (en) * 1985-04-10 1986-10-18 Kyushu Hitachi Maxell Ltd Manufacture of lead frame of semiconductor device
JPS61234060A (en) * 1985-04-10 1986-10-18 Kyushu Hitachi Maxell Ltd Manufacture of lead frame of semiconductor device
JPS63232360A (en) * 1987-03-20 1988-09-28 Hitachi Ltd Semiconductor device and manufacture thereof
JPH0396050U (en) * 1990-01-23 1991-10-01

Similar Documents

Publication Publication Date Title
JPS5713777A (en) Semiconductor device and manufacture thereof
JPS55110051A (en) Lead frame and semiconductor device
JPS5417666A (en) Lead frame
JPS53115187A (en) Semiconductor device
JPS51151069A (en) Electrode forming method of a semiconductor element
JPS5362471A (en) Semiconductor device
JPS5333057A (en) Bump type semiconductor device
JPS5395575A (en) Pressing contact type semiconductor device and its manufacture
JPS5258391A (en) Piezo electric element
JPS544568A (en) Semiconductor device and production of the same
JPS5416979A (en) Production of semiconuctor device
JPS5386184A (en) Semiconductor device and its production
JPS53124975A (en) Semiconductor device
JPS5353965A (en) Semiconductor device and its production
JPS5419375A (en) Semiconductor device
JPS5418289A (en) Manufacture of semiconductor device with radiator
JPS5285468A (en) Production of semiconductor device
JPS5329680A (en) Superhigh frequency open type diode device
JPS54973A (en) Semiconductor element
JPS547865A (en) Semiconductor device
JPS53139974A (en) Semiconductor device
JPS5417669A (en) Semiconductor device
JPS5428582A (en) Semiconductor device
JPS5384679A (en) Production of semiconductor device
JPS5276877A (en) Semiconductor device