JPS5572062A - Semiconductor device and preparation thereof - Google Patents
Semiconductor device and preparation thereofInfo
- Publication number
- JPS5572062A JPS5572062A JP14618078A JP14618078A JPS5572062A JP S5572062 A JPS5572062 A JP S5572062A JP 14618078 A JP14618078 A JP 14618078A JP 14618078 A JP14618078 A JP 14618078A JP S5572062 A JPS5572062 A JP S5572062A
- Authority
- JP
- Japan
- Prior art keywords
- metallic layer
- electrodes
- bump electrodes
- wire
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
PURPOSE: To prevent attaching section of a semiconductor from occurrence of crack, by providing an electrically isolated metallic layer on the surrounding area of an electrodes when attaching on outside lead, which is composed of metallic pieces, to bump electrodes arranged in surrounding area on a semiconductor pellet.
CONSTITUTION: An Al wire 3 is attached onto a semiconductor pellet 1 through an oxide film 2, and the surface is enclosed with a thick surface protecting film 4 except the region where a bump electrodes 5 are attached, which region is left exposed. And then, the bump electrodes 5 are attached onto the exposed wire 3 by thermal pressing or brazing through a metallic layer 6 for improving adhesion to aluminum and a metallic layer 7 for prevention of dispersion of metal which is composing the bump electrodes 5. In this mechanism, a metallic layer 8 is provided on the film 2 located between the electrode 5, and the top surface is covered with protecting film 4 so as to be electrically isolated from the electrodes 5. By doing so, the pellets surfaces temperature distribution becomes gradual when the wire is attached by thermal pressing, and moreover, by providing the metallic layer 8 for enclosing the electrodes 5, the effect can be further improved.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14618078A JPS5572062A (en) | 1978-11-27 | 1978-11-27 | Semiconductor device and preparation thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14618078A JPS5572062A (en) | 1978-11-27 | 1978-11-27 | Semiconductor device and preparation thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5572062A true JPS5572062A (en) | 1980-05-30 |
Family
ID=15401936
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14618078A Pending JPS5572062A (en) | 1978-11-27 | 1978-11-27 | Semiconductor device and preparation thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5572062A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5752391A (en) * | 1996-01-23 | 1998-05-19 | Nippon Soken, Inc. | Refrigerating system |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5339084A (en) * | 1976-09-22 | 1978-04-10 | Hitachi Ltd | Silicon gate mis semiconductor device |
JPS53105967A (en) * | 1977-02-28 | 1978-09-14 | Nec Corp | Semiconductor device |
-
1978
- 1978-11-27 JP JP14618078A patent/JPS5572062A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5339084A (en) * | 1976-09-22 | 1978-04-10 | Hitachi Ltd | Silicon gate mis semiconductor device |
JPS53105967A (en) * | 1977-02-28 | 1978-09-14 | Nec Corp | Semiconductor device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5752391A (en) * | 1996-01-23 | 1998-05-19 | Nippon Soken, Inc. | Refrigerating system |
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