JPS5561334A - Production of circuit pattern blanking die - Google Patents
Production of circuit pattern blanking dieInfo
- Publication number
- JPS5561334A JPS5561334A JP13278378A JP13278378A JPS5561334A JP S5561334 A JPS5561334 A JP S5561334A JP 13278378 A JP13278378 A JP 13278378A JP 13278378 A JP13278378 A JP 13278378A JP S5561334 A JPS5561334 A JP S5561334A
- Authority
- JP
- Japan
- Prior art keywords
- resist
- width
- photo mask
- mask
- trimming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
PURPOSE: To easily obtain dies of always stable high quality, by using trimming pattern photo mask and other one pattern photo mask capable of easily forming etching resist pattern and positioning quickly.
CONSTITUTION: A photo mask A3 has inner and outer trimming lines of width a1 subtracting the double dimension of blade width v and shallow side etching amount from a desired circuit width a, and width a2 adding deep side etching amount to the width a. By using this mask, an etching resist 23 is provided on a metal original plate 22. Next, a photo mask A4 having a trimming line of width a3 which is in the relation of a1≤a3≤a2 is laid over the resist 23 to form a resist 24, and a deep groove 29 is formed by etching deeply. The resist 24 is separated, and the metal plate on which the resist 23 is provided is etched shallowly to form a shallow groove 28. Meanwhile, the mask A3 has the trimming line formed at high precision photographically by the pin-fitting method using a register punch.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13278378A JPS5810466B2 (en) | 1978-10-27 | 1978-10-27 | Manufacturing method for circuit pattern punching mold |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13278378A JPS5810466B2 (en) | 1978-10-27 | 1978-10-27 | Manufacturing method for circuit pattern punching mold |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5561334A true JPS5561334A (en) | 1980-05-09 |
JPS5810466B2 JPS5810466B2 (en) | 1983-02-25 |
Family
ID=15089432
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13278378A Expired JPS5810466B2 (en) | 1978-10-27 | 1978-10-27 | Manufacturing method for circuit pattern punching mold |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5810466B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107442650A (en) * | 2017-08-29 | 2017-12-08 | 安徽江淮汽车集团股份有限公司 | A kind of narrow body stamping parts forming technology and set of molds |
-
1978
- 1978-10-27 JP JP13278378A patent/JPS5810466B2/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107442650A (en) * | 2017-08-29 | 2017-12-08 | 安徽江淮汽车集团股份有限公司 | A kind of narrow body stamping parts forming technology and set of molds |
CN107442650B (en) * | 2017-08-29 | 2019-04-16 | 安徽江淮汽车集团股份有限公司 | A kind of narrow body stamping parts forming technology and set of molds |
Also Published As
Publication number | Publication date |
---|---|
JPS5810466B2 (en) | 1983-02-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5284981A (en) | Production of insulated gate type semiconductor device | |
JPS5646753A (en) | Preparation of gravure lithographic plate | |
JPS5561334A (en) | Production of circuit pattern blanking die | |
JPS5713180A (en) | Etching method | |
JPS5561335A (en) | Production of circuit pattern blanking die | |
JPS54101274A (en) | Manufacture for semiconductor device | |
JPS51136289A (en) | Semi-conductor producing | |
JPS5690977A (en) | Manufacture of blanking die for pattern | |
JPS53117384A (en) | Photoetching mask | |
JPS5728637A (en) | Manufacture of die for circuit punching | |
JPS53105982A (en) | Micropattern formation method | |
JPS5513982A (en) | Producing method of microscopic pattern | |
JPS5654039A (en) | Forming method for fine pattern | |
JPS52119187A (en) | Manufacture of semiconductor | |
JPS51147261A (en) | Forming method of pattern | |
JPS5420675A (en) | Production of semiconductor device | |
JPS53113730A (en) | Metallic pattern forming method | |
JPS5348677A (en) | Electron beam exposure method | |
JPS56154232A (en) | Manufacture of punching jig | |
JPS56137623A (en) | Forming of cross pattern electrode | |
JPS5255866A (en) | Etching method | |
JPS5760640A (en) | Manufacture of compound shadow mask | |
JPS5377472A (en) | Production of semiconductor device | |
JPS5427367A (en) | Manufacture of microwave circuit pattern | |
JPS5384477A (en) | Forming method of dry etching mask |