JPS5558541A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5558541A JPS5558541A JP13137878A JP13137878A JPS5558541A JP S5558541 A JPS5558541 A JP S5558541A JP 13137878 A JP13137878 A JP 13137878A JP 13137878 A JP13137878 A JP 13137878A JP S5558541 A JPS5558541 A JP S5558541A
- Authority
- JP
- Japan
- Prior art keywords
- fitted
- insulating
- electrode
- flange
- ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Die Bonding (AREA)
Abstract
PURPOSE: To reduce cost and improve reliability, by surrounding both surfaces of a semiconductor element, which is sandwiched by an anode and a cathode, with an insulating elastic body and an insulating cylindrical body.
CONSTITUTION: Cathode external electrode 1 and anode external electrode 5 are fixed to both surfaces of semiconductor element 4, which is a planar diode. Both sides of element 4 are fitted with guide ring 9 made of heat resisting rubber, such as silicone rubber or fluoric rubber. By this, ring 9 is spread by element 4 and is fitted around element 4 by its own elastic force. Next, insulating cylindrical body 2 is fitted to the outer surface of ring 9. On the upper side of these is fitted flange 8, which projects from the end of electrode 1. On the lower surface is fitted flange 6, which projects from the end of electrode 5, via flange 7. By this, the clearance between element and insulating body can be absorbed and positioning can be operated with high precision.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13137878A JPS5558541A (en) | 1978-10-24 | 1978-10-24 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13137878A JPS5558541A (en) | 1978-10-24 | 1978-10-24 | Semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5558541A true JPS5558541A (en) | 1980-05-01 |
JPS6211498B2 JPS6211498B2 (en) | 1987-03-12 |
Family
ID=15056537
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13137878A Granted JPS5558541A (en) | 1978-10-24 | 1978-10-24 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5558541A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5837928A (en) * | 1981-08-31 | 1983-03-05 | Toshiba Corp | Semiconductor device |
-
1978
- 1978-10-24 JP JP13137878A patent/JPS5558541A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5837928A (en) * | 1981-08-31 | 1983-03-05 | Toshiba Corp | Semiconductor device |
JPH0213813B2 (en) * | 1981-08-31 | 1990-04-05 | Tokyo Shibaura Electric Co |
Also Published As
Publication number | Publication date |
---|---|
JPS6211498B2 (en) | 1987-03-12 |
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