JPS5545731A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS5545731A
JPS5545731A JP11878578A JP11878578A JPS5545731A JP S5545731 A JPS5545731 A JP S5545731A JP 11878578 A JP11878578 A JP 11878578A JP 11878578 A JP11878578 A JP 11878578A JP S5545731 A JPS5545731 A JP S5545731A
Authority
JP
Japan
Prior art keywords
epoxy resin
isocyanate
resin composition
parts
piperidine complex
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11878578A
Other languages
Japanese (ja)
Inventor
Michio Futakuchi
Yasuhiro Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP11878578A priority Critical patent/JPS5545731A/en
Publication of JPS5545731A publication Critical patent/JPS5545731A/en
Pending legal-status Critical Current

Links

Landscapes

  • Polyurethanes Or Polyureas (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE: The title resin composition capable of giving cured articles having improved mechanical and electrical properties, with a long pot life, and quick curability even at a relatively low temperature, comprising an epoxy resin, an isocyanate, and BF3-piperidine complex.
CONSTITUTION: A composition comprising (A) 100 parts by wt. of an epoxy resin, e.g. vinyl-cyclohexene diepoxide or limonene diepoxide, (B) 1W50 parts by wt. of (a) an isocyanate, e.g. phenyl or benzyl isocyanate, and (b) BF3-piperidine complex of the formula at a molar rotio of (a) to (b) of 0.05W5:1 as a curing agent.
COPYRIGHT: (C)1980,JPO&Japio
JP11878578A 1978-09-26 1978-09-26 Epoxy resin composition Pending JPS5545731A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11878578A JPS5545731A (en) 1978-09-26 1978-09-26 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11878578A JPS5545731A (en) 1978-09-26 1978-09-26 Epoxy resin composition

Publications (1)

Publication Number Publication Date
JPS5545731A true JPS5545731A (en) 1980-03-31

Family

ID=14745017

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11878578A Pending JPS5545731A (en) 1978-09-26 1978-09-26 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS5545731A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022102467A1 (en) * 2020-11-16 2022-05-19 東レ株式会社 Thermosetting epoxy resin composition, molded article of same, fiber-reinforced composite material, molding material for fiber-reinforced composite materials, and method for producing fiber-reinforced composite material

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022102467A1 (en) * 2020-11-16 2022-05-19 東レ株式会社 Thermosetting epoxy resin composition, molded article of same, fiber-reinforced composite material, molding material for fiber-reinforced composite materials, and method for producing fiber-reinforced composite material

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