JPS53299A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS53299A
JPS53299A JP7430176A JP7430176A JPS53299A JP S53299 A JPS53299 A JP S53299A JP 7430176 A JP7430176 A JP 7430176A JP 7430176 A JP7430176 A JP 7430176A JP S53299 A JPS53299 A JP S53299A
Authority
JP
Japan
Prior art keywords
resin composition
epoxy resin
glass transition
semiconductor elements
transition temperatures
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7430176A
Other languages
Japanese (ja)
Inventor
Masahiro Kitamura
Hiroshi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7430176A priority Critical patent/JPS53299A/en
Publication of JPS53299A publication Critical patent/JPS53299A/en
Pending legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE: To provide epoxy resin composition for encapsulating semiconductor elements having improved hardening characteristics and capable of forming cured products of higher glass transition temperatures, by the use of a hardening agent free from unreacted phenol.
COPYRIGHT: (C)1978,JPO&Japio
JP7430176A 1976-06-25 1976-06-25 Epoxy resin composition Pending JPS53299A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7430176A JPS53299A (en) 1976-06-25 1976-06-25 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7430176A JPS53299A (en) 1976-06-25 1976-06-25 Epoxy resin composition

Publications (1)

Publication Number Publication Date
JPS53299A true JPS53299A (en) 1978-01-05

Family

ID=13543161

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7430176A Pending JPS53299A (en) 1976-06-25 1976-06-25 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS53299A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5529532A (en) * 1978-08-23 1980-03-01 Toshiba Corp Epoxy resin composition
JPS59105018A (en) * 1982-12-07 1984-06-18 Toshiba Chem Corp Sealing resin composition
JPS6053526A (en) * 1983-09-02 1985-03-27 Hitachi Chem Co Ltd Epoxy resin composition for sealing semiconductor
JPH01121352A (en) * 1987-11-04 1989-05-15 Hitachi Ltd Epoxy resin composition, sealant for semiconductor device and material for laminated board
US5298548A (en) * 1991-05-21 1994-03-29 Shin-Etsu Chemical Co., Ltd. Epoxy resin composition and semiconductor devices encapsulated therewith
US5418266A (en) * 1991-03-29 1995-05-23 Shin-Etsu Chemical Co., Ltd. Epoxy resin compositions and semiconductor devices encapsulated therewith

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5529532A (en) * 1978-08-23 1980-03-01 Toshiba Corp Epoxy resin composition
JPS59105018A (en) * 1982-12-07 1984-06-18 Toshiba Chem Corp Sealing resin composition
JPH0249329B2 (en) * 1982-12-07 1990-10-29 Toshiba Chem Prod
JPS6053526A (en) * 1983-09-02 1985-03-27 Hitachi Chem Co Ltd Epoxy resin composition for sealing semiconductor
JPH01121352A (en) * 1987-11-04 1989-05-15 Hitachi Ltd Epoxy resin composition, sealant for semiconductor device and material for laminated board
US5418266A (en) * 1991-03-29 1995-05-23 Shin-Etsu Chemical Co., Ltd. Epoxy resin compositions and semiconductor devices encapsulated therewith
US5298548A (en) * 1991-05-21 1994-03-29 Shin-Etsu Chemical Co., Ltd. Epoxy resin composition and semiconductor devices encapsulated therewith

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