JPS53299A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS53299A JPS53299A JP7430176A JP7430176A JPS53299A JP S53299 A JPS53299 A JP S53299A JP 7430176 A JP7430176 A JP 7430176A JP 7430176 A JP7430176 A JP 7430176A JP S53299 A JPS53299 A JP S53299A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- epoxy resin
- glass transition
- semiconductor elements
- transition temperatures
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
PURPOSE: To provide epoxy resin composition for encapsulating semiconductor elements having improved hardening characteristics and capable of forming cured products of higher glass transition temperatures, by the use of a hardening agent free from unreacted phenol.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7430176A JPS53299A (en) | 1976-06-25 | 1976-06-25 | Epoxy resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7430176A JPS53299A (en) | 1976-06-25 | 1976-06-25 | Epoxy resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS53299A true JPS53299A (en) | 1978-01-05 |
Family
ID=13543161
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7430176A Pending JPS53299A (en) | 1976-06-25 | 1976-06-25 | Epoxy resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS53299A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5529532A (en) * | 1978-08-23 | 1980-03-01 | Toshiba Corp | Epoxy resin composition |
JPS59105018A (en) * | 1982-12-07 | 1984-06-18 | Toshiba Chem Corp | Sealing resin composition |
JPS6053526A (en) * | 1983-09-02 | 1985-03-27 | Hitachi Chem Co Ltd | Epoxy resin composition for sealing semiconductor |
JPH01121352A (en) * | 1987-11-04 | 1989-05-15 | Hitachi Ltd | Epoxy resin composition, sealant for semiconductor device and material for laminated board |
US5298548A (en) * | 1991-05-21 | 1994-03-29 | Shin-Etsu Chemical Co., Ltd. | Epoxy resin composition and semiconductor devices encapsulated therewith |
US5418266A (en) * | 1991-03-29 | 1995-05-23 | Shin-Etsu Chemical Co., Ltd. | Epoxy resin compositions and semiconductor devices encapsulated therewith |
-
1976
- 1976-06-25 JP JP7430176A patent/JPS53299A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5529532A (en) * | 1978-08-23 | 1980-03-01 | Toshiba Corp | Epoxy resin composition |
JPS59105018A (en) * | 1982-12-07 | 1984-06-18 | Toshiba Chem Corp | Sealing resin composition |
JPH0249329B2 (en) * | 1982-12-07 | 1990-10-29 | Toshiba Chem Prod | |
JPS6053526A (en) * | 1983-09-02 | 1985-03-27 | Hitachi Chem Co Ltd | Epoxy resin composition for sealing semiconductor |
JPH01121352A (en) * | 1987-11-04 | 1989-05-15 | Hitachi Ltd | Epoxy resin composition, sealant for semiconductor device and material for laminated board |
US5418266A (en) * | 1991-03-29 | 1995-05-23 | Shin-Etsu Chemical Co., Ltd. | Epoxy resin compositions and semiconductor devices encapsulated therewith |
US5298548A (en) * | 1991-05-21 | 1994-03-29 | Shin-Etsu Chemical Co., Ltd. | Epoxy resin composition and semiconductor devices encapsulated therewith |
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