JPS5522838A - Manufacturing method of semiconductor strain gauge type pressure senser chip - Google Patents
Manufacturing method of semiconductor strain gauge type pressure senser chipInfo
- Publication number
- JPS5522838A JPS5522838A JP9545978A JP9545978A JPS5522838A JP S5522838 A JPS5522838 A JP S5522838A JP 9545978 A JP9545978 A JP 9545978A JP 9545978 A JP9545978 A JP 9545978A JP S5522838 A JPS5522838 A JP S5522838A
- Authority
- JP
- Japan
- Prior art keywords
- diaphragm
- silicon wafer
- bonding process
- chip
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Abstract
PURPOSE: To raise a mass productivity and stabilize a quality by cutting the intermediate portion of an adjacent diaphragm after bonding a sup port member having a thermal expansion coefficient similar to that of a silicon wafer by an anode bonding process to the side face of the silicon wafer comprising a multiplicity of diaphragms.
CONSTITUTION: A multiplicity of strain gauges is formed by a difusion on the side face of a silicon wafer 6, a pressure sensitive diaphragm chamber 5 is provided by an etching on the back face, and a thin film portion produced is used for a diaphragm 1. Successively, a support member 7 having a through-hole 8 of a predetermined size is provided in a position corresponding to the diaphragm chamber 5 and the wafer 6 and member 7 are bonded together by utilizing a non-organic adhesive or the anode bonding process while aligning the diaphragm chamber 5 to the through hole 8. If a borosilicate glass is used for the member 7, the anode bonding process should be adoped. Thereafter, the intermediate portion of the adjacent diaphragm is cut down by a laser or a wire saw to obtain a bellet 20.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9545978A JPS5522838A (en) | 1978-08-07 | 1978-08-07 | Manufacturing method of semiconductor strain gauge type pressure senser chip |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9545978A JPS5522838A (en) | 1978-08-07 | 1978-08-07 | Manufacturing method of semiconductor strain gauge type pressure senser chip |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5522838A true JPS5522838A (en) | 1980-02-18 |
Family
ID=14138251
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9545978A Pending JPS5522838A (en) | 1978-08-07 | 1978-08-07 | Manufacturing method of semiconductor strain gauge type pressure senser chip |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5522838A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6285470A (en) * | 1985-10-09 | 1987-04-18 | Hitachi Ltd | Pressure sensor |
JPH01172725A (en) * | 1987-12-28 | 1989-07-07 | Matsushita Electric Ind Co Ltd | Semiconductor pressure sensor |
JPH01172724A (en) * | 1987-12-28 | 1989-07-07 | Matsushita Electric Ind Co Ltd | Semiconductor pressure sensor |
JPH01503001A (en) * | 1986-06-23 | 1989-10-12 | ローズマウント インコ | Capacitor type pressure sensor and pressure sensor group |
JPH03150435A (en) * | 1989-11-08 | 1991-06-26 | Masaki Esashi | Manufacture of relative pressure sensor |
-
1978
- 1978-08-07 JP JP9545978A patent/JPS5522838A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6285470A (en) * | 1985-10-09 | 1987-04-18 | Hitachi Ltd | Pressure sensor |
JPH01503001A (en) * | 1986-06-23 | 1989-10-12 | ローズマウント インコ | Capacitor type pressure sensor and pressure sensor group |
JPH01172725A (en) * | 1987-12-28 | 1989-07-07 | Matsushita Electric Ind Co Ltd | Semiconductor pressure sensor |
JPH01172724A (en) * | 1987-12-28 | 1989-07-07 | Matsushita Electric Ind Co Ltd | Semiconductor pressure sensor |
JPH03150435A (en) * | 1989-11-08 | 1991-06-26 | Masaki Esashi | Manufacture of relative pressure sensor |
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