JPS5521106A - Method of forming ohmic electrode - Google Patents
Method of forming ohmic electrodeInfo
- Publication number
- JPS5521106A JPS5521106A JP9349078A JP9349078A JPS5521106A JP S5521106 A JPS5521106 A JP S5521106A JP 9349078 A JP9349078 A JP 9349078A JP 9349078 A JP9349078 A JP 9349078A JP S5521106 A JPS5521106 A JP S5521106A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- solder
- wafer
- ohmic electrode
- evaporated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
- H01L2924/10158—Shape being other than a cuboid at the passive surface
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9349078A JPS5521106A (en) | 1978-07-31 | 1978-07-31 | Method of forming ohmic electrode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9349078A JPS5521106A (en) | 1978-07-31 | 1978-07-31 | Method of forming ohmic electrode |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5521106A true JPS5521106A (en) | 1980-02-15 |
Family
ID=14083775
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9349078A Pending JPS5521106A (en) | 1978-07-31 | 1978-07-31 | Method of forming ohmic electrode |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5521106A (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5778144A (en) * | 1980-11-04 | 1982-05-15 | Hitachi Ltd | Semiconductor device |
JPS59193036A (ja) * | 1983-04-16 | 1984-11-01 | Toshiba Corp | 半導体装置の製造方法 |
JPS63142640A (ja) * | 1986-12-05 | 1988-06-15 | Sumitomo Electric Ind Ltd | 半導体装置の製造方法 |
JP2015026857A (ja) * | 2009-09-11 | 2015-02-05 | ローム株式会社 | 半導体装置およびその製造方法 |
-
1978
- 1978-07-31 JP JP9349078A patent/JPS5521106A/ja active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5778144A (en) * | 1980-11-04 | 1982-05-15 | Hitachi Ltd | Semiconductor device |
JPS59193036A (ja) * | 1983-04-16 | 1984-11-01 | Toshiba Corp | 半導体装置の製造方法 |
JPH0226376B2 (ja) * | 1983-04-16 | 1990-06-08 | Tokyo Shibaura Electric Co | |
JPS63142640A (ja) * | 1986-12-05 | 1988-06-15 | Sumitomo Electric Ind Ltd | 半導体装置の製造方法 |
JP2015026857A (ja) * | 2009-09-11 | 2015-02-05 | ローム株式会社 | 半導体装置およびその製造方法 |
US9543239B2 (en) | 2009-09-11 | 2017-01-10 | Rohm Co., Ltd. | Semiconductor device and production method therefor |
US9837373B2 (en) | 2009-09-11 | 2017-12-05 | Rohm Co., Ltd. | Semiconductor device and production method therefor |
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