JPS55166935A - Automatic wireless bonding device - Google Patents

Automatic wireless bonding device

Info

Publication number
JPS55166935A
JPS55166935A JP7488779A JP7488779A JPS55166935A JP S55166935 A JPS55166935 A JP S55166935A JP 7488779 A JP7488779 A JP 7488779A JP 7488779 A JP7488779 A JP 7488779A JP S55166935 A JPS55166935 A JP S55166935A
Authority
JP
Japan
Prior art keywords
tool
chip
bonding
tray
selection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7488779A
Other languages
Japanese (ja)
Other versions
JPS5917975B2 (en
Inventor
Ryukichi Matsumura
Fumikazu Tateishi
Sachinori Yamazoe
Masayuki Shibano
Masaharu Noyori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP54074887A priority Critical patent/JPS5917975B2/en
Publication of JPS55166935A publication Critical patent/JPS55166935A/en
Publication of JPS5917975B2 publication Critical patent/JPS5917975B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
    • H01L2224/75822—Rotational mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To increase working efficiency by automating the selection of an IC and a resister etc., the feed to a bonding tool, a rough positioning and selection of the tool which fits to the chip size, and by having a manual operation for a precision positioning only. CONSTITUTION:Various data are input to a microcomputor by a data input operating section 31, a bonder is automatically operated, a desired tool is selected by rotating a rotary bonding tool 16 and a tray 12 having a prescribed chip 11 is moved below the tool moving the tray 12 to XY direction. Then the chip is adsorbed by lowering an axis 19 with a motor 22 and the prescribed location of a film substrate 9 is set right under the tool after the axis has been raised. Then the chip and the bonding position of the film substrate are placed so that they are reflected to a monitor television 30 through a transparent placing plate 10 and a microscope 28, a precision positioning is made by manual operation, and then a bonding is performed. As a result, manufacturing process is simplified and the number of defective products can be reduced.
JP54074887A 1979-06-13 1979-06-13 automatic wireless bonding equipment Expired JPS5917975B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP54074887A JPS5917975B2 (en) 1979-06-13 1979-06-13 automatic wireless bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54074887A JPS5917975B2 (en) 1979-06-13 1979-06-13 automatic wireless bonding equipment

Publications (2)

Publication Number Publication Date
JPS55166935A true JPS55166935A (en) 1980-12-26
JPS5917975B2 JPS5917975B2 (en) 1984-04-24

Family

ID=13560320

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54074887A Expired JPS5917975B2 (en) 1979-06-13 1979-06-13 automatic wireless bonding equipment

Country Status (1)

Country Link
JP (1) JPS5917975B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5666093A (en) * 1979-11-02 1981-06-04 Hitachi Ltd Method and device for positioning electronic part on printed board
JPS5995700U (en) * 1982-12-17 1984-06-28 三洋電機株式会社 Electronic component mounting device
JPS6025199U (en) * 1983-07-27 1985-02-20 信越ポリマ−株式会社 Chip-shaped electronic component storage container
JPS62291199A (en) * 1986-06-11 1987-12-17 松下電器産業株式会社 Arranging appearance inspection of chip parts
JPH02303043A (en) * 1989-04-26 1990-12-17 Commiss Energ Atom Method and machine for connecting electric parts by welding member
US6908776B2 (en) 1998-07-31 2005-06-21 Seiko Epson Corporation Semiconductor device and method of manufacturing the same, apparatus for manufacturing semiconductor device, circuit boa and electronic instrument

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5666093A (en) * 1979-11-02 1981-06-04 Hitachi Ltd Method and device for positioning electronic part on printed board
JPS6227760B2 (en) * 1979-11-02 1987-06-16 Hitachi Seisakusho Kk
JPS5995700U (en) * 1982-12-17 1984-06-28 三洋電機株式会社 Electronic component mounting device
JPS6025199U (en) * 1983-07-27 1985-02-20 信越ポリマ−株式会社 Chip-shaped electronic component storage container
JPS62291199A (en) * 1986-06-11 1987-12-17 松下電器産業株式会社 Arranging appearance inspection of chip parts
JPH02303043A (en) * 1989-04-26 1990-12-17 Commiss Energ Atom Method and machine for connecting electric parts by welding member
US6908776B2 (en) 1998-07-31 2005-06-21 Seiko Epson Corporation Semiconductor device and method of manufacturing the same, apparatus for manufacturing semiconductor device, circuit boa and electronic instrument

Also Published As

Publication number Publication date
JPS5917975B2 (en) 1984-04-24

Similar Documents

Publication Publication Date Title
JPH0247119B2 (en)
CN110213906A (en) A kind of chip shooter machine
DE102019206887B4 (en) WAFER PROCESSING PROCESS
CN104551430B (en) Intelligent navigation welding table and control method thereof
CN207020326U (en) A kind of automatic ink coating machine and its automatic charging device for optical lens
CN209626184U (en) A kind of automatic cutting device
US3843036A (en) Apparatus for bonding a beam-lead device to a substrate
JPS55166935A (en) Automatic wireless bonding device
CN105228366A (en) Automatic placement machine
CN105537468B (en) A kind of electronic component foot cut device
TW349253B (en) Semiconductor wafer testing apparatus equipped with optical character recognizer
CN107132595A (en) A kind of automatic ink coating machine for optical lens
DE102019209925A1 (en) WAFER PROCESSING PROCEDURES
CN217196196U (en) Glass processing center equipment with visual positioning function
CN107914196A (en) Sole grinding apparatus
DE102019211538A1 (en) Wafer processing method
DE102019215998B4 (en) WAFER PROCESSING PROCESS
CN208375025U (en) A kind of hydraulically operated fixture suitable for oil distribution casing honing process multistation honing
CN208727877U (en) A kind of novel silicon wafer automatic dropping glue equipment
CN207057856U (en) A kind of LED down lamp automatic laser etching mechanism
JPS6163089A (en) Automatic electronic part mounting device
CN108214616B (en) Processing equipment for V-shaped groove
CN110026876A (en) Processing unit (plant) and the installation method for processing unit
CN220260407U (en) Silicon wafer polishing device
CN210412948U (en) Automatic tin dipping machine