JPS62291199A - Arranging appearance inspection of chip parts - Google Patents
Arranging appearance inspection of chip partsInfo
- Publication number
- JPS62291199A JPS62291199A JP61135699A JP13569986A JPS62291199A JP S62291199 A JPS62291199 A JP S62291199A JP 61135699 A JP61135699 A JP 61135699A JP 13569986 A JP13569986 A JP 13569986A JP S62291199 A JPS62291199 A JP S62291199A
- Authority
- JP
- Japan
- Prior art keywords
- aligned
- chip
- chip parts
- jig
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007689 inspection Methods 0.000 title description 8
- 238000000034 method Methods 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 7
- 239000012790 adhesive layer Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000011179 visual inspection Methods 0.000 description 5
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Landscapes
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
３、発明の詳細な説明
産業上の利用分野
本発明は方向性を有する微小なチップ部品の整列外観検
査方法に関するものである。Detailed Description of the Invention 3. Detailed Description of the Invention Field of Industrial Application The present invention relates to a method for inspecting the alignment and visual appearance of minute chip components having directionality.
従来の技術
従来独立完成した状態まで加工されたチップ部品は、バ
ラバラに取り出され１個ずつ回転させ外観検査を行った
後、次工程でパーツフィーダによシ方向を揃え再整列さ
せて供給を行っている。Conventional technology Conventionally, chip parts that have been independently processed to a completed state are taken out in pieces, rotated one by one, and inspected for appearance.In the next process, they are fed to a parts feeder after being aligned in the same direction and realigned. ing.
発明が解決しようとする問題点
２ベー／
しかじ、チップ部品の小形化により、−個ずつの回転に
よる６方向以上の外観検査では検査時間が大幅に増大し
、またパーツフィーダによる整列もしだいに困難塵を増
し、安定した供給がむずかしいという問題があった。Problems to be Solved by the Invention: 2. However, due to the miniaturization of chip components, the inspection time for visual inspection in more than 6 directions by rotating each component has increased significantly, and alignment using a parts feeder has also become increasingly difficult. The problem was that it was difficult to maintain a stable supply due to the increasing amount of dust.
つまり、−次加工工程と二次加工工程が直結していれば
整列状態での移替えが可能であるが、工程間に６方向以
上の外観検査を行うためバラバラに取り出していたので
ある。In other words, if the secondary processing step and the secondary processing step were directly connected, it would be possible to transfer them in an aligned state, but in order to perform visual inspection in six or more directions between the steps, they were taken out separately.
そこで本発明は整列性を維持したまま一次加工程より取
り出して治具に整列装着して外観検査を行い、二次加工
工程に整列供給を可能にしたものである。Therefore, the present invention makes it possible to take out the materials from the primary processing step while maintaining alignment, align and mount them on a jig, perform an appearance inspection, and then supply them in an aligned manner to the secondary processing step.
問題点を解決するだめの手段
上記問題点を解決するために本発明は、チップ部品を粘
着固定し、さらに粘着固定したチップ部品音引き剥がず
ことが可能な粘着力のある粘着層を表面に有した貼り付
は面も目視可能な透明なシート基板の治具を利用して、
チップ部品を整列して貼り付け、６方向からの外観検査
全行い次工程３′ゝ−・
に整列供給する方法としたものである。Means for Solving the Problems In order to solve the above problems, the present invention adhesively fixes chip components, and furthermore, has an adhesive layer on the surface of the adhesively fixed chip components that has an adhesive force that can be peeled off. For pasting, we used a jig made of a transparent sheet substrate that allows the surface to be seen.
In this method, the chip parts are aligned and pasted, the appearance is inspected from all six directions, and the chips are aligned and supplied to the next process 3'--.
作用
すなわち、−次加工工程で整列状態となっているチップ
部品をそのままの状態で貼り付け、この治具ごと回転さ
せることにより、整列状態で６方向以上の外観検査が可
能となり、貼り付は時とほぼ同様の方法でシート基板か
ら引き剥がすことにより、−次加工の整列状態のまま二
次加工工程に供給できるようになる。In other words, by pasting the chip parts that have been aligned in the next processing process as they are and rotating the entire jig, it is possible to inspect the appearance in more than 6 directions while the chip parts are aligned, and the pasting can be done in a timely manner. By peeling it off from the sheet substrate in substantially the same manner as above, it becomes possible to supply it to the secondary processing step in the aligned state for secondary processing.
実施例 以下本発明の一実施例を添付図面に基づいて説明する。Example An embodiment of the present invention will be described below based on the accompanying drawings.
第１図において、上下運動と揺動運動をする揺動アーム
２は、先端に装着された取出しチャック１′ｆｆ：有し
、矢印方向から整列した状態で送られる一次加工済みチ
ップ部品３を複数個整列しだま＼取り上げ、９ｏ０旋回
した後スライドテーブル４の上に位置決めされて置かれ
ている透明シート基板からなる治具６に粘着させる。上
記透明シート基板から治具６は、上面にチップ部品３を
粘着固定するとともに引き剥すことが可能な粘着層をも
ち、この粘着層も透明な材料によって形成されている。In FIG. 1, a swinging arm 2 that moves up and down and swings has a take-out chuck 1'ff attached to its tip, and a plurality of primarily processed chip parts 3 are sent in an aligned state from the direction of the arrow. The aligned strips were picked up, rotated 9o0, and then adhered to a jig 6 made of a transparent sheet substrate positioned and placed on the slide table 4. The jig 6 has an adhesive layer on the upper surface of which the chip component 3 is adhesively fixed and can be peeled off from the transparent sheet substrate, and this adhesive layer is also formed of a transparent material.
また、との治具５は一列貼り付ける毎にパルスモータ等
によりスライドテーブル４が定ピツチ横送りを行い治具
５上に等間隔にチップ部品３を貼り付ける。Furthermore, every time a row of jig 5 is pasted, the slide table 4 is moved horizontally at a fixed pitch by a pulse motor or the like, and the chip parts 3 are pasted on the jig 5 at equal intervals.
整列状態で多数個貼り付けられた透明シート基板の治具
５は治具６ごと回転させることにより、６方向以上から
外観検査を行うことができる。By rotating a large number of transparent sheet substrate jigs 5 attached in an aligned state together with the jigs 6, appearance inspection can be performed from six or more directions.
また、二次加工工程において、チップ部品３を取り出す
場合は第１図と同じ構成で、取出しチャック１を治具６
からの剥ぎ取りチャックに交換することにより、スライ
ドテーブル４上の治具６より整列状態でチップ部品３を
剥ぎ取り、揺動アーム２が９００旋回した位置に整列供
給することができる。In addition, in the secondary processing process, when taking out the chip component 3, use the same configuration as shown in FIG.
By replacing the chip parts 3 with a peeling chuck from the above, the chip parts 3 can be peeled off in an aligned state from the jig 6 on the slide table 4, and the chip parts 3 can be aligned and supplied to the position where the swing arm 2 has rotated 900 degrees.
発明の効果
以上のように本発明は、完成品の状態になったチップ部
品全整列状態の１ま６方向の外観検査が行え、検査後そ
の整列状態を維持した１５次工程に５べ−７
簡単に供給することができ外観検査に対する時間が大幅
に短縮できるとともに再び整列させる必要もなくきわめ
て作業性に富んだものとすることができる。Effects of the Invention As described above, the present invention can perform visual inspection in 1 to 6 directions of all aligned chip components in the state of a finished product, and can perform 5-7 inspections in the 15th step in which the aligned condition is maintained after inspection. It can be easily supplied, the time for visual inspection can be significantly shortened, and there is no need to re-align it, making it extremely easy to work.
また、透明シート基板を治具に使用することで微小チッ
プ部品等の外観検査を行う場合、多数個同時に全方向目
視可能となり外観検査時間を大幅に短縮可能となる。Furthermore, when performing an external appearance inspection of microchip parts or the like by using a transparent sheet substrate as a jig, it becomes possible to visually inspect a large number of microchip parts in all directions at the same time, thereby significantly shortening the appearance inspection time.
第１図は本発明のチップ部品の整列外観検査方法の一実
施例を示すチップ部品の治具への整列供給状態の斜視図
、第２図は治具に整列貼付されたチップ部品の斜視図で
ある。
１・・・・・・取出しチャック、２・・・・・・揺動ア
ーム、３・・・・・・テップ部品、４・・・・・・スラ
イドテーブル、５・・・・・・治具。FIG. 1 is a perspective view of chip components aligned and supplied to a jig, showing an embodiment of the chip component alignment visual inspection method of the present invention, and FIG. 2 is a perspective view of chip components aligned and pasted on the jig. It is. 1... Takeout chuck, 2... Swing arm, 3... Tip parts, 4... Slide table, 5... Jig. .
Claims (1)
部品を粘着固定し引き剥すことが可能な粘着力のある粘
着層を表面に有する透明なシート基板よりなる治具に装
着し、装着状態で外観検査を行い、次工程に整列供給す
るチップ部品の整列外観検査方法。The chip components with directionality are aligned and taken out, and the chip components are fixed with adhesive and mounted on a jig made of a transparent sheet substrate with a removable adhesive layer on the surface, and the appearance is inspected in the mounted state. A method for inspecting the alignment and appearance of chip parts that are aligned and supplied to the next process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61135699A JPH071839B2 (en) | 1986-06-11 | 1986-06-11 | Alignment appearance inspection method for chip parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61135699A JPH071839B2 (en) | 1986-06-11 | 1986-06-11 | Alignment appearance inspection method for chip parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62291199A true JPS62291199A (en) | 1987-12-17 |
| JPH071839B2 JPH071839B2 (en) | 1995-01-11 |
Family
ID=15157830
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61135699A Expired - Fee Related JPH071839B2 (en) | 1986-06-11 | 1986-06-11 | Alignment appearance inspection method for chip parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH071839B2 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS547575A (en) * | 1977-06-20 | 1979-01-20 | Tdk Electronics Co Ltd | Way of mounting electronic parts |
| JPS55166935A (en) * | 1979-06-13 | 1980-12-26 | Matsushita Electric Ind Co Ltd | Automatic wireless bonding device |
| JPS5946635U (en) * | 1982-09-16 | 1984-03-28 | 日東工業株式会社 | Jig board chip loading inspection device |
| JPS6058000A (en) * | 1983-09-09 | 1985-04-03 | 日立電子株式会社 | External appearance inspecting device |
-
1986
- 1986-06-11 JP JP61135699A patent/JPH071839B2/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS547575A (en) * | 1977-06-20 | 1979-01-20 | Tdk Electronics Co Ltd | Way of mounting electronic parts |
| JPS55166935A (en) * | 1979-06-13 | 1980-12-26 | Matsushita Electric Ind Co Ltd | Automatic wireless bonding device |
| JPS5946635U (en) * | 1982-09-16 | 1984-03-28 | 日東工業株式会社 | Jig board chip loading inspection device |
| JPS6058000A (en) * | 1983-09-09 | 1985-04-03 | 日立電子株式会社 | External appearance inspecting device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH071839B2 (en) | 1995-01-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |