JPH0682953B2 - Method for manufacturing hybrid integrated circuit - Google Patents

Method for manufacturing hybrid integrated circuit

Info

Publication number
JPH0682953B2
JPH0682953B2 JP54059914A JP5991479A JPH0682953B2 JP H0682953 B2 JPH0682953 B2 JP H0682953B2 JP 54059914 A JP54059914 A JP 54059914A JP 5991479 A JP5991479 A JP 5991479A JP H0682953 B2 JPH0682953 B2 JP H0682953B2
Authority
JP
Japan
Prior art keywords
predetermined
chip
hybrid integrated
shaped
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP54059914A
Other languages
Japanese (ja)
Other versions
JPS55151340A (en
Inventor
光男 大沢
照嘉 野田
岩夫 市川
克己 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP54059914A priority Critical patent/JPH0682953B2/en
Priority to US06/135,670 priority patent/US4345371A/en
Priority to CA000348985A priority patent/CA1137651A/en
Publication of JPS55151340A publication Critical patent/JPS55151340A/en
Publication of JPH0682953B2 publication Critical patent/JPH0682953B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10583—Cylindrically shaped component; Fixing means therefore
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0173—Template for holding a PCB having mounted components thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Description

【発明の詳細な説明】 本発明は、チップ状部品を収納するためのホッパと、こ
のホッパからのチップ状部品の供給を制御するシャッタ
と、このシャッタの開放に伴って上記ホッパから供給さ
れるチップ状部品を所定位置に案内する案内手段と、前
記所定位置に対応する位置に部品収納部が形成されてい
るテンプレートとをそれぞれ備えた混成集積回路の製造
装置を用いて、各種のチップ状部品を回路基板上の所定
位置にそれぞれマウントして混成集積回路を製造するよ
うにした混成集積回路の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention provides a hopper for accommodating chip-shaped components, a shutter for controlling the supply of chip-shaped components from the hopper, and the hopper supplied with the opening of the shutter. Various chip-shaped components are manufactured by using a hybrid integrated circuit manufacturing apparatus including guide means for guiding the chip-shaped components to a predetermined position, and a template having a component storage portion formed at a position corresponding to the predetermined position. The present invention relates to a method for manufacturing a hybrid integrated circuit, in which each is mounted at a predetermined position on a circuit board to manufacture the hybrid integrated circuit.

チツプ状部品によつて混成集積回路を得る場合には、チ
ツプ状部品を回路基板上に直接配置するか、あるいは中
間の配置手段の所定の位置に配置する必要がある。この
ようなチツプ状部品の配置は、従来はエアチヤツク等に
よつてチツプ状部品を１個ずつ回路基板あるいは配置手
段上におくようにしていた。この場合に回路基板あるい
は配置手段は数値制御装置によつてＸ方向およびＹ方向
に移動するようになつており、これによつてチツプ状部
品が所定の位置に配置されることになる。しかしこのよ
うな装置によると、チツプ状部品を１つずつマウントす
るようにしているために、生産性に劣り、またマウント
位置の精度も比較的悪い。またエアチヤツクによつてチ
ツプ状部品を保持するようにするには、予め一定の姿勢
に制御された部品を待機させておく必要があり、マウン
トされるチツプ状部品をマガジン等によつて供給する必
要がある。このために、部品のコストが上昇する。さら
にロツトの変更に伴う機械の変更が非常に面倒であり、
ロツトの変更に対するフレキシビリテイに欠けるという
問題点がある。When the hybrid integrated circuit is obtained by the chip-shaped components, it is necessary to dispose the chip-shaped components directly on the circuit board or at a predetermined position of the intermediate disposing means. Conventionally, such chip-shaped components are arranged by placing them one by one on the circuit board or the arranging means by an air check or the like. In this case, the circuit board or the arranging means is moved in the X direction and the Y direction by the numerical control device, so that the chip-shaped component is arranged at a predetermined position. However, according to such an apparatus, since the chip-shaped parts are mounted one by one, the productivity is poor and the mounting position accuracy is relatively poor. Further, in order to hold the chip-shaped parts by the air check, it is necessary to put the parts controlled in a certain posture in standby in advance, and it is necessary to supply the mounted chip-shaped parts by a magazine or the like. There is. This increases the cost of the parts. Furthermore, the change of machine due to the change of the lot is very troublesome,
There is a problem of lack of flexibility in changing the lot.

本発明は、このような問題点に鑑みてなされたものであ
って、冒頭に述べた混成集積回路の製造方法において、
製造すべき複数種類の混成集積回路にそれぞれ対応して
複数の部品収納部をそれぞれ有し装置本体に対してそれ
ぞれ着脱自在である複数種類のテンプレートを用意し、
これら複数種類のテンプレートの前記複数の部品収納部
にそれぞれ対応した所定位置に各種のチップ状部品をそ
れぞれ配送することができ装置本体に対してそれぞれ着
脱自在である複数種類の配置用マガジンをそれぞれ用意
し、各ホッパには同一種類のチップ状部品が収納される
ように、前記各種のチップ状部品を複数のホッパに収納
し、前記複数種類の混成集積回路のうちからこれから製
造すべき所定の混成集積回路を選定し、この所定の混成
集積回路に対応して複数の部品収納部を有する所定のテ
ンプレートを前記複数種類のテンプレートのうちから選
択して、この所定のテンプレートを装置本体に装着し、
この所定のテンプレートの複数の部品収納部にそれぞれ
対応した所定位置に各種のチップ状部品をそれぞれ配送
し得る所定の配置用マガジンを前記複数種類の配置用マ
ガジンのうちから選択して、この所定の配置用マガジン
を前記案内手段として装置本体に装着し、前記複数のホ
ッパのそれぞれから前記所定の配置用マガジンの一端に
一度に同時に供給されるチップ状部品の数とその供給位
置とを、これら複数のホッパにそれぞれ対応して設けら
れたシャッタの開閉動作を前記所定の混成集積回路に対
応して制御することにより選定し、前記所定の配置用マ
ガジンの一端に供給された各種のチップ状部品をこの所
定の配置用マガジンの他端まで配送して前記所定のテン
プレートの複数の部品収納部にそれぞれ収納させ、これ
ら複数の部品収納部にそれぞれ収納された各種のチップ
状部品を前記回路基板に移してマウントするようにした
ことを特徴とする混成集積回路の製造方法に係るもので
ある。The present invention has been made in view of such problems, and in the method of manufacturing a hybrid integrated circuit described at the beginning,
Prepare a plurality of types of templates, each of which has a plurality of component storage parts corresponding to each of a plurality of types of hybrid integrated circuits to be manufactured, and is detachable from the device body,
Various types of placement magazines are prepared, each of which can deliver various chip-shaped components to a predetermined position corresponding to each of the plurality of component storage parts of these multiple types of templates, and which can be detachably attached to the apparatus main body. However, the various chip-shaped components are stored in a plurality of hoppers so that the same type of chip-shaped components are stored in each hopper, and a predetermined hybrid to be manufactured from the plurality of types of hybrid integrated circuits is to be manufactured. An integrated circuit is selected, a predetermined template having a plurality of component storage parts corresponding to the predetermined hybrid integrated circuit is selected from the plurality of types of templates, and the predetermined template is attached to the apparatus main body.
A predetermined placement magazine capable of delivering various chip-shaped components to a predetermined position corresponding to each of the plurality of component storage portions of the predetermined template is selected from the plurality of types of placement magazines, and the predetermined placement magazine is selected. A placement magazine is attached to the main body of the apparatus as the guiding means, and the number of chip-like parts and the feed position thereof simultaneously supplied from one of the plurality of hoppers to one end of the predetermined placement magazine at the same time are indicated by a plurality of these. The opening and closing operations of the shutters provided corresponding to the respective hoppers are selected by controlling corresponding to the predetermined hybrid integrated circuit, and various chip-shaped parts supplied to one end of the predetermined placement magazine are selected. The predetermined placement magazine is delivered to the other end and stored in the plurality of component storage parts of the predetermined template, respectively. In which according to the method of manufacturing a hybrid integrated circuit, characterized in that as each housed various chip-shaped component mounting transferred to the circuit board.

従って、本発明によると、生産性に優れ、また、チップ
状部品を予め一定の姿勢に保っておく必要もなくなる。Therefore, according to the present invention, the productivity is excellent, and it is not necessary to keep the chip-shaped component in a certain posture in advance.

さらに、本発明によると、複数種類の混成集積回路を共
通の製造装置により製造することができるから、きわめ
て能率的であり、また、ロットの変更に伴う製造装置の
機械的な変更が非常に簡単である。Further, according to the present invention, a plurality of types of hybrid integrated circuits can be manufactured by a common manufacturing apparatus, which is extremely efficient, and the mechanical change of the manufacturing apparatus accompanying a lot change is very simple. Is.

以下本発明の一実施例を図面につき説明する。An embodiment of the present invention will be described below with reference to the drawings.

まず第１図によつて全体の工程を順次説明すると、一定
の形状に統一されたチツプ状をなす各種の部品（１）、
例えばコンデンサ、抵抗、ジヤンパ用クロスコンダク
タ、ダイオード等の部品（１）はそれぞればらばらな状
態で複数のホツパの容器（２）内にそれぞれ収納されて
いる。これらの部品（１）はシヤツタ装置（３）の作用
によつて間欠的に供給され、部品移送パイプ（４）を通
つて配置用マガジン（５）の一端（図では上端）に導か
れる。そしてこの配置用マガジン（５）は、各種の上記
部品（１）をそれぞれその他端（図では下端）内の予め
定められた所定位置へと導く。またこの他端に配送され
たチツプ状部品（１）はさらに配置板（６）に導かれ、
この配置板（６）に設けられた横転機構によつて円柱状
をなし垂直な姿勢で送られて来たチツプ状部品（１）が
横転される。そしてこの配置板（６）の下部に配された
シヤツタが開放されると、チツプ状部品（１）は配置板
（６）の下部に配されたテンプレート（７）の部品収納
用凹部（８）内にそれぞれ落下して収納される。First, referring to FIG. 1, the whole process will be described in sequence. Various parts (1) having a chip shape unified into a certain shape,
For example, parts (1) such as capacitors, resistors, jumper cross conductors, diodes, etc. are individually housed in a plurality of hopper containers (2). These parts (1) are intermittently supplied by the action of the shutter device (3) and guided to one end (upper end in the figure) of the placement magazine (5) through the part transfer pipe (4). Then, the placement magazine (5) guides each of the above-mentioned various components (1) to a predetermined position in the other end (lower end in the figure). Further, the chip-shaped component (1) delivered to the other end is further guided to the arrangement plate (6),
The chip-shaped component (1) which has a columnar shape and has been sent in a vertical posture is tumbled by a tumbling mechanism provided on the arrangement plate (6). Then, when the shutter arranged at the lower part of the arrangement plate (6) is opened, the chip-shaped component (1) is provided with the component accommodating recess (8) of the template (7) arranged at the lower part of the arrangement plate (6). They are dropped inside and stored.

一方プリント基板（10）は、その表面すなわちパターン
面のチツプ状部品マウント位置に、スクリーン印刷の手
法によつて、接着用樹脂（９）が塗布される。樹脂
（９）が塗布されたプリント基板（10）は、この樹脂
（９）の塗布された面をテンプレート（７）に対向させ
て、チツプ状部品（１）をその凹部（８）に収納してい
るテンプレート（７）の上に重ね合されるとともに軽く
加圧される。次いでテンプレート（７）とプリント基板
（10）とを重ね合せたままで両者は反転され、上下が逆
になされる。これによつてテンプレート（７）がプリン
ト基板（10）の上面に位置するようになる。次いでテン
プレート（７）とプリント基板（10）とが加圧手段によ
つて互に圧着され、テンプレート（７）の凹部（８）に
保持されているチツプ状部品（１）はプリント基板（1
0）の導電性パターンに完全に密着されるとともに、こ
のチツプ状部品（１）はその長さ方向のほぼ中央の胴の
部分が接着用樹脂（９）と確実に接触することになる。On the other hand, the printed circuit board (10) is coated with the adhesive resin (9) at the chip-shaped component mounting position on its surface, that is, the pattern surface, by a screen printing method. The printed circuit board (10) coated with the resin (9) is placed in the recess (8) of the chip-shaped component (1) with the surface coated with the resin (9) facing the template (7). It is superposed on the template (7) on which it is attached and is lightly pressed. Next, the template (7) and the printed circuit board (10) are turned over while the template (7) and the printed circuit board (10) are overlapped with each other. As a result, the template (7) is located on the upper surface of the printed circuit board (10). Next, the template (7) and the printed circuit board (10) are pressure-bonded to each other by a pressing means, and the chip-shaped component (1) held in the recess (8) of the template (7) is printed on the printed circuit board (1).
The chip-shaped component (1) is in close contact with the conductive pattern (0), and the central portion of the chip-shaped component (1) in the lengthwise direction is surely in contact with the adhesive resin (9).

この後にプリント基板（10）上に載置されているテンプ
レート（７）が静かに取除かれて、チツプ状部品（１）
はプリント基板（10）上に完全に移されることになる。
しかしこの段階ではまだ接着用樹脂（９）は硬化してい
ない。そこでこのプリント基板（10）をベルトコンベア
（11）によつてまず光硬化炉（12）に導く。すると接着
用樹脂（９）の表面の部分が紫外線によつてまず硬化す
る。さらにプリント基板（10）はコンベア（11）によつ
て移動されて熱硬化炉（13）に導かれ、ここで接着用樹
脂（９）が内部まで完全に硬化する。このように接着用
樹脂（９）を光硬化炉（12）と熱硬化炉（13）とによつ
て硬化させるようにしたために、接着用樹脂（９）の硬
化に要する時間が短縮される。またいきなり熱硬化炉
（13）に入れて加熱すると、樹脂（９）の粘性の低下に
よつて樹脂（９）の流動が起つて接着不良を起したり、
あるいは流動した樹脂がプリント基板（10）の導電性パ
ターンを覆つて接触不良の原因をなす。しかし光硬化炉
（12）で紫外線により樹脂の外表面を硬化させているた
めに、樹脂（９）の流動は効果的に防止される。After this, the template (7) placed on the printed circuit board (10) is gently removed, and the chip-shaped component (1) is removed.
Will be completely transferred onto the printed circuit board (10).
However, at this stage, the adhesive resin (9) is not yet cured. Therefore, the printed board (10) is first guided to the photocuring furnace (12) by the belt conveyor (11). Then, the surface portion of the adhesive resin (9) is first cured by ultraviolet rays. Further, the printed circuit board (10) is moved by the conveyor (11) and guided to the heat curing furnace (13), where the adhesive resin (9) is completely cured to the inside. Since the adhesive resin (9) is thus cured by the photo-curing furnace (12) and the heat curing furnace (13), the time required for curing the adhesive resin (9) is shortened. If the resin is placed in a thermosetting furnace (13) and heated suddenly, the viscosity of the resin (9) will decrease and the resin (9) will flow, resulting in poor adhesion.
Alternatively, the fluidized resin covers the conductive pattern of the printed circuit board (10) and causes contact failure. However, since the outer surface of the resin is cured by ultraviolet rays in the photocuring furnace (12), the flow of the resin (9) is effectively prevented.

このようにして硬化された樹脂（９）によつて、チツプ
状部品（１）はプリント基板（10）に完全に仮止めされ
ることになる。次いでこのプリント基板（10）の裏面、
すなわちチツプ状部品（１）がマウントされ、しかも導
電性パターンが形成されているパターン面とは反対側の
面には、必要なら、一般のリードのある部品（15）がマ
ウントされる。このように一般の部品（15）とチツプ状
部品（１）とをプリント基板（10）の両面にマウントす
るようにしているために、この回路は部品の実装密度が
高く、回路の小型化が可能となる。次にこのプリント基
板（10）のパターン面を下側に向けて半田デイツプ槽
（14）に導いて上記部品（１）（15）をプリント基板
（10）の導電性パターンと電気的に接続する。すなわち
チツプ状部品（１）はその両端のキヤツプ状のリードの
部分が半田によつてプリント基板（10）の導電性パター
ンと接続され、またリードのある一般の部品（15）はこ
のリードの部分が導電性パターンと半田によつて接続さ
れることになる。これによつて混成集積回路が得られる
ことになる。なおリードのある通常の部品（15）は必ず
しもマウントする必要がなく、チツプ状部品（１）のみ
によつても混成集積回路を得ることは可能である。The chip-shaped component (1) is completely temporarily fixed to the printed circuit board (10) by the resin (9) thus cured. Then, the back side of this printed circuit board (10),
That is, the chip-shaped component (1) is mounted, and if necessary, the component (15) having a general lead is mounted on the surface opposite to the pattern surface on which the conductive pattern is formed. Since the general component (15) and the chip-shaped component (1) are mounted on both sides of the printed circuit board (10) as described above, this circuit has a high component mounting density and can be miniaturized. It will be possible. Next, the pattern surface of the printed board (10) is directed downward to the solder dip bath (14) to electrically connect the parts (1) and (15) to the conductive pattern of the printed board (10). . That is, in the chip-shaped component (1), the cap-shaped lead portions at both ends thereof are connected to the conductive pattern of the printed circuit board (10) by soldering, and the general component (15) having the lead has the lead portion. Will be connected to the conductive pattern by solder. This will result in a hybrid integrated circuit. Note that it is not always necessary to mount the normal component (15) having leads, and it is possible to obtain a hybrid integrated circuit only by the chip-shaped component (1).

以上に述べたようにこの実施例に係る方法によると、テ
ンプレート（７）には、シヤツタの開放に伴つて一度に
多数の部品（１）を配置板（６）から落下させ、次にこ
のテンプレート（７）をプリント基板（10）と重ね合せ
て、チツプ状部品（１）を一度にプリント基板（10）に
移すことができるために、非常に生産性が高くなる。実
際に最高600個の部品（１）を30秒以内でプリント基板
（10）にマウントすることが可能となる。As described above, according to the method of this embodiment, the template (7) is caused to drop a large number of components (1) from the arrangement plate (6) at a time when the shutter is opened, and then the template (7) is dropped. Since the chip-shaped component (1) can be transferred to the printed circuit board (10) at a time by superimposing the (7) on the printed circuit board (10), the productivity is very high. In fact, up to 600 parts (1) can be mounted on a printed circuit board (10) within 30 seconds.

またテンプレート（７）の部品収納用凹部（８）に一た
んチツプ状部品（１）を収納し、次いでこの部品（１）
をプリント基板（10）に移すように構成されているため
に、プリント基板（10）にマウントされる部品（１）の
配置の精度が非常に高くなり、不良品の発生率が著しく
減少する。Further, the chip-shaped component (1) is simply stored in the component storing recess (8) of the template (7), and then this component (1) is stored.
Is configured to be transferred to the printed circuit board (10), the accuracy of arrangement of the component (1) mounted on the printed circuit board (10) becomes very high, and the incidence of defective products is significantly reduced.

なお小型の回路をつくる場合には、所定の大きさのプリ
ント基板（10）に多数複合化し、マウント後にプリント
基板（10）を分割すれば一度に複数の集積回路を得るこ
とが可能となり、生産性がさらに向上する。When making a small circuit, it is possible to obtain multiple integrated circuits at a time by combining multiple printed circuit boards (10) of a predetermined size and dividing the printed circuit board (10) after mounting. The property is further improved.

次に第２図によつてテンプレート（７）に部品（１）を
配置する装置をさらに詳細に説明すると、各種の部品を
それぞれ収容した円筒状のホッパの容器（２）の底部に
はキヤプチヤ（18）が摺動可能に貫通している。容器
（２）に対してこのキヤプチヤ（18）が相対的に上下動
すると、キヤプチヤ（18）に形成されている３つの貫通
孔（19）によつて容器（２）内の部品（１）が捕えられ
るようになつている。なお１つの容器（２）のキヤプチ
ヤ（18）によつて同時に３つの部品（１）が捕えられ
る。そしてこれらの部品（１）は分離パイプ（20）を経
てパーツホルダ（17）の貫通孔（21）に導かれる。Next, referring to FIG. 2, a device for arranging the component (1) on the template (7) will be described in more detail. A capper (2) is provided at the bottom of a container (2) of a cylindrical hopper accommodating various components. 18) is slidably penetrated. When the capper (18) moves up and down relative to the container (2), the part (1) in the container (2) is moved by the three through holes (19) formed in the capper (18). It is getting caught. Note that three parts (1) can be simultaneously captured by the capper (18) of one container (2). Then, these parts (1) are guided to the through hole (21) of the parts holder (17) through the separation pipe (20).

パーツホルダ（17）の下部には上記シヤツタ装置（３）
を構成するシヤツタ（22）が設けられており、このシヤ
ツタ（22）の開放によつて、パーツホルダ（17）内の部
品（１）が落下するようになつている。なおシヤツタ
（22）は第３図に示すように、その前縁に切欠き（23）
が設けられており、しかも第３図においてＸ方向に移動
調整可能になつている。従つてＸ方向への移動量を予め
調整しておくことによつて、このシヤツタ（22）をＹ方
向に開放するときの、部品（１）の供給個数を０個から
３個の間で任意に調整できるようになつている。第３図
に示すようにシヤツタ（22）がＸ方向に調整された場合
には、このシヤツタ（22）がＹ方向に開放されると、３
つの貫通孔（21）の内の右側の１個の貫通孔（21）のみ
からしかチツプ状部品（１）は供給されないようになつ
ている。Below the parts holder (17) is the shutter device (3).
The shutter (22) constituting the above is provided, and the part (1) in the part holder (17) is made to drop by opening the shutter (22). The shutter (22) has a notch (23) at its front edge as shown in FIG.
Is provided and the movement is adjustable in the X direction in FIG. Therefore, by adjusting the amount of movement in the X direction in advance, when the shutter (22) is opened in the Y direction, the number of parts (1) supplied can be arbitrarily set between 0 and 3. It can be adjusted to. When the shutter (22) is adjusted in the X direction as shown in FIG. 3, when the shutter (22) is opened in the Y direction, 3
The chip-shaped component (1) is supplied only from one of the through holes (21) on the right side of the through holes (21).

またこのシヤツタ装置によると、各貫通孔（21）からは
シヤツタ（22）の開放に伴つて１個ずつしか部品（１）
が供給されないようになつている。すなわち第４図に示
すように、パーツホルダ（17）の貫通孔（21）と直角に
交差するようにこのパーツホルダ（17）には貫通孔（2
4）が形成されている。そしてこの貫通孔（24）にはピ
ン（25）が嵌装されている。従つてこのピン（25）の先
端は貫通孔（21）に臨んでいる。そしてシヤツタ（22）
の開放に伴つて押圧板（26）が第４図において左方に移
動すると、この押圧板（26）はコイルばね（27）を介し
てピン（25）を押圧する。従つてこのピン（25）の先端
は貫通孔（21）内において、シヤツタ（22）から数えて
２番目の部品（１）を保持する。このためにシヤツタ
（22）の開放に伴つて落下するのは、シヤツタ（22）の
すぐ上の部品（１）のみとなり、各貫通孔（21）からは
シヤツタ（22）の開放に伴つて、それぞれ１個しか部品
（１）が供給されない。Further, according to this shutter device, only one part (1) is provided from each through hole (21) as the shutter (22) is opened.
Are not being supplied. That is, as shown in FIG. 4, the through hole (2) is formed in the part holder (17) so as to intersect the through hole (21) of the part holder (17) at a right angle.
4) has been formed. A pin (25) is fitted in the through hole (24). Therefore, the tip of this pin (25) faces the through hole (21). And shyatsuta (22)
When the pressing plate (26) moves to the left in FIG. 4 due to the opening of the pin, the pressing plate (26) presses the pin (25) via the coil spring (27). Therefore, the tip of the pin (25) holds the second component (1) counted from the shutter (22) in the through hole (21). For this reason, only the part (1) immediately above the shutter (22) falls with the opening of the shutter (22), and from each through hole (21) with the opening of the shutter (22), Only one part (1) is supplied each.

このようにして供給された部品（１）は移送パイプ
（４）を通つてマガジン（５）に導かれる。なおこのマ
ガジン（５）の一端を形成する上板（28）の上側にはセ
ンサ支持板（29）が重ねて配されている。このセンサ支
持板（29）の上面には第５図に示すように、センサ支持
ブロツク（30）が設けられている。そしてこのブロツク
（30）には第６図に示すように上記パイプ（４）に対応
して貫通孔（31）が形成されている。この貫通孔（31）
は接続管（32）を介して上記パイプ（４）と接続されて
いる。さらにセンサ支持ブロツク（30）の両側には凹溝
（33）が形成されており、これらの凹溝（33）には光学
式のセンサ（34）が互に対向して取付けられている。こ
れらのセンサ（34）は小孔（35）によつて、貫通孔（3
1）内を通過するチツプ状部品（１）を検出するように
構成されている。しかもこのセンサ（34）は上記シヤツ
タ（22）のＸ方向の移動調整に連動して作動するように
なつている。すなわちシヤツタ（22）のＸ方向の調整に
よつて、通過が許容される部品（１）と対応する貫通孔
（31）の部品（１）の通過のみを検出するようになつて
いる。The component (1) thus supplied is guided to the magazine (5) through the transfer pipe (4). A sensor support plate (29) is superposed on the upper plate (28) forming one end of the magazine (5). As shown in FIG. 5, a sensor support block (30) is provided on the upper surface of the sensor support plate (29). A through hole (31) corresponding to the pipe (4) is formed in the block (30) as shown in FIG. This through hole (31)
Is connected to the pipe (4) through a connecting pipe (32). Further, concave grooves (33) are formed on both sides of the sensor support block (30), and optical sensors (34) are attached to the concave grooves (33) so as to face each other. The small holes (35) allow these sensors (34) to pass through (3
It is arranged to detect a chip-shaped component (1) passing through the inside of 1). Moreover, the sensor (34) operates in conjunction with the movement adjustment of the shutter (22) in the X direction. That is, by adjusting the shutter (22) in the X direction, only the passage of the component (1) of the through hole (31) corresponding to the component (1) of which passage is permitted is detected.

マガジン（５）は上記上板（28）と、その他端を形成す
る下板（36）とを具備し、これらの上下の板（28）（3
6）に形成された部品通過用貫通孔は第２図に示すよう
に、互に複雑に交錯している多数の部品移送パイプ（3
7）によつて連結され、これによつて各種の部品（１）
は、上記下板（36）内のかつ製造されるべき集積回路上
の所定位置と対応する位置にそれぞれ導かれるように構
成されている。すなわち配置用マガジン（５）はホツパ
の容器（２）から供給された各種のチツプ状の部品
（１）を、製造されるべき回路に応じて所望の位置に導
くためのものである。そしてこのマガジン（５）の上下
の板（28）（36）は第２図において仮想線で示すよう
に、連結部材（38）によつて連結されてマガジン（５）
が一体に組立てられるように構成され、製造されるべき
回路が決まると、この回路に合うマガジン（５）が選択
されて、第２図に示すように製造装置に組込まれる。な
おマガジン（５）の着脱は自在に行われる。The magazine (5) comprises the upper plate (28) and the lower plate (36) forming the other end, and the upper and lower plates (28) (3).
As shown in Fig. 2, the component passage through holes formed in 6) are composed of a large number of component transfer pipes (3
7) connected by means of which various parts (1)
Are respectively guided to positions in the lower plate (36) and corresponding to predetermined positions on the integrated circuit to be manufactured. That is, the placement magazine (5) is for guiding various chip-shaped parts (1) supplied from the container (2) of the hopper to a desired position according to the circuit to be manufactured. The upper and lower plates (28) (36) of the magazine (5) are connected by a connecting member (38) as shown in phantom in FIG.
When the circuit to be manufactured is determined, the magazine (5) that fits this circuit is selected and installed in the manufacturing apparatus as shown in FIG. The magazine (5) can be freely attached and detached.

従つて製造されるべき回路のロツトの変更に応じて、予
め用意されている別のマガジン（５）をこのマガジン
（５）と極めて短時間に交換することができる。すなわ
ちロツトの変更が非常に容易になされることになる。ま
たこのマガジン（５）の変更に応じて、予めプログラム
が記憶された磁気テープ等の交換によつてホツパの各容
器（２）と対応するシヤツタ（22）のＸ方向の調整と、
そして作動すべきセンサ（34）とが制御装置によつて容
易に変更される。なお作動すべきセンサ（34）はマガジ
ン（５）とは独立に、このマガジン（５）よりもホツパ
側に設けられているために、センサ（34）の機械的な変
更は全く必要でなく、このことがロツト変更の容易性を
一層高めることになる。Accordingly, another magazine (5) prepared in advance can be exchanged for this magazine (5) in a very short time in response to a change in the lot of the circuit to be manufactured. That is, it is very easy to change the lot. Also, in accordance with the change of the magazine (5), by adjusting the magnetic tape or the like in which the program is stored in advance, adjustment of the shutter (22) corresponding to each container (2) of the hopper in the X direction,
Then, the sensor (34) to be operated is easily changed by the control device. Since the sensor (34) to be activated is provided independently of the magazine (5) and closer to the hopper than the magazine (5), no mechanical modification of the sensor (34) is required. This further improves the ease of changing the lot.

マガジン（５）によつて所定の位置に導かれたチツプ状
部品（１）は上述の如く配置板（６）で横転され、次い
でシヤツタ（39）の開放によつてテンプレート（７）の
部品収納用凹部（８）に導かれるように構成されてい
る。なお上記テンプレート（７）は、その複数の中から
製造されるべき回路に応じて選択されかつ使用される
が、このテンプレート（７）に設けられた上記部品収納
用凹部（８）の位置は、上記マガジン（５）の下板（3
6）の場合と全く同様に、製造されるべき回路に使用す
る各種の部品の位置と対応して設けられている。The chip-shaped component (1) guided to a predetermined position by the magazine (5) is turned over by the arrangement plate (6) as described above, and then the components of the template (7) are accommodated by opening the shutter (39). It is configured to be guided to the recess (8) for use. The template (7) is selected and used according to the circuit to be manufactured from a plurality of the templates, and the position of the component storing recess (8) provided in the template (7) is as follows. Lower plate of the magazine (5) (3
Just like in the case of 6), it is provided corresponding to the positions of various parts used in the circuit to be manufactured.

以上に述べたように本発明によると、チツプ状部品は一
度にテンプレート上に配置されるために、生産性が非常
に高くなる。また本発明によると部品の配置精度はテン
プレートの部品収納部によつて決定されるために、部品
の配置精度を比較的簡単に向上させることができる。ま
た本発明によると、チツプ状部品はばらばらな状態で容
器に入れておけばよいために、部品のコストを安くでき
る。As described above, according to the present invention, since the chip-shaped parts are arranged on the template at one time, the productivity is very high. Further, according to the present invention, since the placement accuracy of the component is determined by the component storage portion of the template, the placement accuracy of the component can be improved relatively easily. Further, according to the present invention, since the chip-shaped parts may be put in the container in a disassembled state, the cost of the parts can be reduced.

さらに、本発明によると、複数種類の混成集積回路を共
通の製造装置により製造することができるから、きわめ
て能率的である。また、本発明によると、ロットの変更
によりこれまで製造していたのとは別の種類の混成集積
回路を製造する場合でも、これまで装置本体に装着して
いたのとはそれぞれ別の種類のテンプレートおよび配置
用マガジンを装置本体にそれぞれ装着すると共に、複数
のホッパにそれぞれ対応して設けられたシャッタの開閉
動作を、新たに製造すべき混成集積回路の種類に対応し
て制御するようにすればよいから、ロットの変更に伴う
製造装置の機械的な変更が非常に簡単であり、マウント
すべきチップ状部品のそれぞれの種類の数やこれらをマ
ウントすべき位置が製造すべき混成集積回路の種類毎に
大幅に相違していても、製造装置の構造がそれ程複雑に
なることはない。Furthermore, according to the present invention, a plurality of types of hybrid integrated circuits can be manufactured by a common manufacturing apparatus, which is extremely efficient. Further, according to the present invention, even when a different type of hybrid integrated circuit is manufactured by changing the lot, a different type of integrated integrated circuit from that which has been mounted on the apparatus main body until now is manufactured. The template and the placement magazine are mounted on the apparatus main body, and the opening / closing operation of the shutters provided corresponding to the plurality of hoppers is controlled according to the type of hybrid integrated circuit to be newly manufactured. Therefore, it is very easy to mechanically change the manufacturing equipment according to the lot change, and the number of each type of chip-like component to be mounted and the position where these are to be mounted depend on the hybrid integrated circuit to be manufactured. The structure of the manufacturing apparatus does not become so complicated even if the type is significantly different.

【図面の簡単な説明】[Brief description of drawings]

図面は本発明の一実施例を示すものであつて、第１図は
この実施例の全体の工程を示すフローチヤート、第２図
は部品の配置装置の要部拡大正面図、第３図は第２図に
おけるIII-III線矢視図、第４図は第２図におけるIV-IV
線断面図、第５図は部品の通過を検出するセンサを示す
要部斜視図、第６図は第５図におけるVI-VI線断面図で
ある。 なお図面に用いた符号において、 （１）……チツプ状部品 （２）……ホツパの容器 （５）……配置用マガジン （７）……テンプレート （８）……部品収納用凹部 （10）……プリント基板 （22）……シヤツタ である。FIG. 1 shows an embodiment of the present invention. FIG. 1 is a flow chart showing the whole process of this embodiment, FIG. 2 is an enlarged front view of the essential parts of a component placement device, and FIG. Fig. 2 is a view taken along the line III-III, and Fig. 4 is IV-IV in Fig. 2.
5 is a sectional view taken along line VI-VI in FIG. 5, and FIG. 5 is a perspective view of a main part showing a sensor for detecting passage of parts. In addition, in the reference numerals used in the drawings, (1) -chip-shaped parts (2) -hopper container (5) -placement magazine (7) -template (8) -component storage recess (10) …… Printed circuit board (22) …… It is a shatter.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 市川 岩夫 東京都港区港南１丁目７番４号 ソニー株 式会社芝浦工場内 (72)発明者 山本 克己 東京都品川区北品川６丁目７番35号 ソニ ー株式会社内 (56)参考文献 特開 昭48−6273（ＪＰ，Ａ) 実開 昭52−16086（ＪＰ，Ｕ) 特公 昭44−20657（ＪＰ，Ｂ１) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Iwao Ichikawa 1-7 Konan, Minato-ku, Tokyo 1-7-4 Sony Shibaura factory (72) Inventor Katsumi Yamamoto 6-7 35 Kitashinagawa, Shinagawa-ku, Tokyo No. Sony Corporation (56) References JP-A-48-6273 (JP, A) Actually-made Shou 52-16086 (JP, U) JP-B-44-20657 (JP, B1)

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】チップ状部品を収納するためのホッパと、
このホッパからのチップ状部品の供給を制御するシャッ
タと、このシャッタの開放に伴って上記ホッパから供給
されるチップ状部品を所定位置に案内する案内手段と、
前記所定位置に対応する位置に部品収納部が形成されて
いるテンプレートとをそれぞれ備えた混成集積回路の製
造装置を用いて、各種のチップ状部品を回路基板上の所
定位置にそれぞれマウントして混成集積回路を製造する
ようにした混成集積回路の製造方法において、 製造すべき複数種類の混成集積回路にそれぞれ対応して
複数の部品収納部をそれぞれ有し装置本体に対してそれ
ぞれ着脱自在である複数種類のテンプレートを用意し、 これら複数種類のテンプレートの前記複数の部品収納部
にそれぞれ対応した所定位置に各種のチップ状部品をそ
れぞれ配送することができ装置本体に対してそれぞれ着
脱自在である複数種類の配置用マガジンをそれぞれ用意
し、 各ホッパには同一種類のチップ状部品が収納されるよう
に、前記各種のチップ状部品を複数のホッパに収納し、 前記複数種類の混成集積回路のうちからこれから製造す
べき所定の混成集積回路を選定し、 この所定の混成集積回路に対応して複数の部品収納部を
有する所定のテンプレートを前記複数種類のテンプレー
トのうちから選択して、この所定のテンプレートを装置
本体に装着し、 この所定のテンプレートの複数の部品収納部にそれぞれ
対応した所定位置に各種のチップ状部品をそれぞれ配送
し得る所定の配置用マガジンを前記複数種類の配置用マ
ガジンのうちから選択して、この所定の配置用マガジン
を前記案内手段として装置本体に装着し、 前記複数のホッパのそれぞれから前記所定の配置用マガ
ジンの一端に一度に同時に供給されるチップ状部品の数
とその供給位置とを、これら複数のホッパにそれぞれ対
応して設けられたシャッタの開閉動作を前記所定の混成
集積回路に対応して制御することにより選定し、 前記所定の配置用マガジンの一端に供給された各種のチ
ップ状部品をこの所定の配置用マガジンの他端まで配送
して前記所定のテンプレートの複数の部品収納部にそれ
ぞれ収納させ、 これら複数の部品収納部にそれぞれ収納された各種のチ
ップ状部品を前記回路基板に移してマウントするように
したことを特徴とする混成集積回路の製造方法。1. A hopper for accommodating chip-shaped parts,
A shutter for controlling the supply of the chip-shaped component from the hopper, and a guide means for guiding the chip-shaped component supplied from the hopper to a predetermined position when the shutter is opened,
By using a hybrid integrated circuit manufacturing apparatus each including a template in which a component storage portion is formed at a position corresponding to the predetermined position, various chip-shaped components are mounted at predetermined positions on a circuit board and hybridized. In a method of manufacturing a hybrid integrated circuit for manufacturing an integrated circuit, a plurality of component accommodating portions respectively corresponding to a plurality of types of hybrid integrated circuits to be manufactured, each of which is detachable from an apparatus main body. Multiple types of templates are prepared, and various chip-shaped components can be delivered to predetermined positions corresponding to the plurality of component storage parts of these multiple types of templates, respectively, and are detachable from the apparatus main body. Prepare the respective placement magazines for each of the above-mentioned chips so that the same type of chip-shaped parts can be stored in each hopper. -Shaped parts are stored in a plurality of hoppers, a predetermined hybrid integrated circuit to be manufactured is selected from the plurality of types of hybrid integrated circuits, and a plurality of component storage portions are provided corresponding to the predetermined hybrid integrated circuit. A predetermined template is selected from the plurality of types of templates, the predetermined template is mounted on the apparatus main body, and various chip-shaped parts are placed at predetermined positions respectively corresponding to the plurality of component storage parts of the predetermined template. A predetermined placement magazine that can be delivered is selected from among the plurality of types of placement magazines, and the predetermined placement magazine is attached to the apparatus main body as the guiding means, and the predetermined placement magazine is fed from each of the plurality of hoppers. The number of chip-like parts that are simultaneously supplied to one end of the arranging magazine and the position where they are supplied to each of these plural hoppers. The opening / closing operation of the corresponding shutter is selected by controlling the opening / closing operation corresponding to the predetermined hybrid integrated circuit, and various chip-shaped parts supplied to one end of the predetermined placement magazine are placed in the predetermined placement. For delivery to the other end of the magazine for storage in the plurality of component storage parts of the predetermined template, respectively, and transferring various chip-shaped components respectively stored in the plurality of component storage parts to the circuit board for mounting. A method of manufacturing a hybrid integrated circuit, comprising:
JP54059914A 1979-03-14 1979-05-16 Method for manufacturing hybrid integrated circuit Expired - Lifetime JPH0682953B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP54059914A JPH0682953B2 (en) 1979-05-16 1979-05-16 Method for manufacturing hybrid integrated circuit
US06/135,670 US4345371A (en) 1979-03-14 1980-03-31 Method and apparatus for manufacturing hybrid integrated circuits
CA000348985A CA1137651A (en) 1979-05-14 1980-04-01 Method and apparatus of manufacturing hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54059914A JPH0682953B2 (en) 1979-05-16 1979-05-16 Method for manufacturing hybrid integrated circuit

Publications (2)

Publication Number Publication Date
JPS55151340A JPS55151340A (en) 1980-11-25
JPH0682953B2 true JPH0682953B2 (en) 1994-10-19

Family

ID=13126866

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54059914A Expired - Lifetime JPH0682953B2 (en) 1979-03-14 1979-05-16 Method for manufacturing hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPH0682953B2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57100798A (en) * 1980-12-15 1982-06-23 Alps Electric Co Ltd Device for mounting chip part
JPS57100797A (en) * 1980-12-15 1982-06-23 Alps Electric Co Ltd Device for mounting chip part
JPS57100799A (en) * 1980-12-15 1982-06-23 Alps Electric Co Ltd Device for mounting chip part
JPS57168273U (en) * 1981-04-17 1982-10-23
JPH0229599U (en) * 1988-04-25 1990-02-26
JPH0738513B2 (en) * 1990-02-28 1995-04-26 太陽誘電株式会社 Chip-shaped electronic component feeder
JP2514459Y2 (en) * 1991-03-30 1996-10-16 太陽誘電株式会社 Chip circuit component mounting device
JP2581537Y2 (en) * 1992-12-19 1998-09-21 太陽誘電株式会社 Electronic component supply device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4517377Y1 (en) * 1966-05-30 1970-07-17
JPS5538599Y2 (en) * 1975-07-24 1980-09-09
JPS5433677A (en) * 1977-08-22 1979-03-12 Hitachi Ltd Peliet supplying unit
JPS5856277B2 (en) * 1978-06-30 1983-12-14 太陽誘電株式会社 How to install electronic components

Also Published As

Publication number Publication date
JPS55151340A (en) 1980-11-25

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