JPS55148449A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS55148449A
JPS55148449A JP5586579A JP5586579A JPS55148449A JP S55148449 A JPS55148449 A JP S55148449A JP 5586579 A JP5586579 A JP 5586579A JP 5586579 A JP5586579 A JP 5586579A JP S55148449 A JPS55148449 A JP S55148449A
Authority
JP
Japan
Prior art keywords
electrodes
substrates
chips
semiconductor device
high frequency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5586579A
Other languages
Japanese (ja)
Other versions
JPS617026B2 (en
Inventor
Takashi Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP5586579A priority Critical patent/JPS55148449A/en
Publication of JPS55148449A publication Critical patent/JPS55148449A/en
Publication of JPS617026B2 publication Critical patent/JPS617026B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6644—Packaging aspects of high-frequency amplifiers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements

Abstract

PURPOSE:To improve the high frequency operation characteristics of a semiconductor device by forming it with a plurality of chips to maintain the chip yield high and directly connecting the same polarity electrodes in high frequency between the chips. CONSTITUTION:Semiconductor substrates 13, 14 are coated on the upper portions with insulating films 17, and active regions 18, input electrodes 19 and common electrode 20 are formed on the films 17. Output electrodes are disposed in the substrates 13, 14. Connecting electrodes 21 are formed on the substrates 13, 14, and connected at one ends through bonding wires or metallized layers to the input electrodes 19, and connected at the other ends through a bonding wire 22 therebetween.
JP5586579A 1979-05-08 1979-05-08 Semiconductor device Granted JPS55148449A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5586579A JPS55148449A (en) 1979-05-08 1979-05-08 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5586579A JPS55148449A (en) 1979-05-08 1979-05-08 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS55148449A true JPS55148449A (en) 1980-11-19
JPS617026B2 JPS617026B2 (en) 1986-03-03

Family

ID=13010955

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5586579A Granted JPS55148449A (en) 1979-05-08 1979-05-08 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS55148449A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6048781A (en) * 1983-08-30 1985-03-16 株式会社高木化学研究所 Seat for automobile
US4563387A (en) * 1983-06-30 1986-01-07 Takagi Chemicals, Inc. Cushioning material
US4572430A (en) * 1983-08-17 1986-02-25 Takagi Chemicals, Inc. Air conditioner for vehicular seat

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52147973A (en) * 1976-06-03 1977-12-08 Nec Corp Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52147973A (en) * 1976-06-03 1977-12-08 Nec Corp Semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4563387A (en) * 1983-06-30 1986-01-07 Takagi Chemicals, Inc. Cushioning material
US4572430A (en) * 1983-08-17 1986-02-25 Takagi Chemicals, Inc. Air conditioner for vehicular seat
JPS6048781A (en) * 1983-08-30 1985-03-16 株式会社高木化学研究所 Seat for automobile
JPH0370519B2 (en) * 1983-08-30 1991-11-07 Takagi Kagaku Kenkyusho Kk

Also Published As

Publication number Publication date
JPS617026B2 (en) 1986-03-03

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