JPS5643816A - Structure of bonding pad part - Google Patents

Structure of bonding pad part

Info

Publication number
JPS5643816A
JPS5643816A JP11798079A JP11798079A JPS5643816A JP S5643816 A JPS5643816 A JP S5643816A JP 11798079 A JP11798079 A JP 11798079A JP 11798079 A JP11798079 A JP 11798079A JP S5643816 A JPS5643816 A JP S5643816A
Authority
JP
Japan
Prior art keywords
layer metal
bonding pad
piezoelectric substrate
wire
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11798079A
Other languages
Japanese (ja)
Inventor
Hideo Abe
Masaharu Ishigaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11798079A priority Critical patent/JPS5643816A/en
Publication of JPS5643816A publication Critical patent/JPS5643816A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

PURPOSE:To prevent a film breakaway between two layers in wire bonding by convering the lower-layer metal film of a bonding pad part with an upper-layer metal film and by bonding part of the upper-layer metal film direct to a piezoelectric substrate. CONSTITUTION:On piezoelectric substrate 1, comb-shaped input-output electrode parts 2 and 3 and wire-bonding pad parts 6 and 7 connected electrically to those input-output electrode parts 2 and 3 are formed. In the formation of those wire-bonding pad parts 6 and 7, lower-layer metal films 6a and 7a are formed first on piezoelectric substrate 1 and then upper-layer metal films 6b and 7b are formed covering those lower-layer metal films 6a and 7a and being bonded direct to piezoelectric substrate 1.
JP11798079A 1979-09-17 1979-09-17 Structure of bonding pad part Pending JPS5643816A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11798079A JPS5643816A (en) 1979-09-17 1979-09-17 Structure of bonding pad part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11798079A JPS5643816A (en) 1979-09-17 1979-09-17 Structure of bonding pad part

Publications (1)

Publication Number Publication Date
JPS5643816A true JPS5643816A (en) 1981-04-22

Family

ID=14725027

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11798079A Pending JPS5643816A (en) 1979-09-17 1979-09-17 Structure of bonding pad part

Country Status (1)

Country Link
JP (1) JPS5643816A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58178619A (en) * 1982-04-13 1983-10-19 Matsushita Electric Ind Co Ltd Element for surface acoustic wave
JPS6416729U (en) * 1987-07-21 1989-01-27
JPH0548371A (en) * 1991-08-12 1993-02-26 Mitsubishi Electric Corp Surface acoustic wave circuit
JPH05169173A (en) * 1991-12-16 1993-07-09 Honda Motor Co Ltd Method for forming cut shape toothed product
JP2000307373A (en) * 1999-02-18 2000-11-02 Murata Mfg Co Ltd Surface wave unit and its manufacture
WO2002082644A1 (en) * 2001-03-30 2002-10-17 Mitsubishi Denki Kabushiki Kaisha Acoustic wave device and method of manufacture thereof
GB2374993A (en) * 2000-12-26 2002-10-30 Murata Manufacturing Co Manufacturing electrode pads of a surface acoustic wave apparatus

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58178619A (en) * 1982-04-13 1983-10-19 Matsushita Electric Ind Co Ltd Element for surface acoustic wave
JPS6416729U (en) * 1987-07-21 1989-01-27
JPH0548371A (en) * 1991-08-12 1993-02-26 Mitsubishi Electric Corp Surface acoustic wave circuit
JPH05169173A (en) * 1991-12-16 1993-07-09 Honda Motor Co Ltd Method for forming cut shape toothed product
JP2000307373A (en) * 1999-02-18 2000-11-02 Murata Mfg Co Ltd Surface wave unit and its manufacture
US6414415B1 (en) 1999-02-18 2002-07-02 Murata Manufacturing Co., Ltd. Surface acoustic wave device and method for manufacturing the same
GB2374993A (en) * 2000-12-26 2002-10-30 Murata Manufacturing Co Manufacturing electrode pads of a surface acoustic wave apparatus
GB2374993B (en) * 2000-12-26 2003-04-23 Murata Manufacturing Co Surface acoustic wave apparatus and manufacturing method therefor
US6792656B2 (en) 2000-12-26 2004-09-21 Murata Manufacturing Co., Ltd. Surface acoustic wave apparatus and manufacturing method therefor
US7112913B2 (en) 2000-12-26 2006-09-26 Murata Manufacturing Co., Ltd. Surface acoustic wave apparatus and manufacturing method therefor
DE10163297B4 (en) * 2000-12-26 2010-12-16 Murata Mfg. Co., Ltd., Nagaokakyo-shi Surface acoustic wave device and method of manufacturing the same
WO2002082644A1 (en) * 2001-03-30 2002-10-17 Mitsubishi Denki Kabushiki Kaisha Acoustic wave device and method of manufacture thereof

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