JPS5515292A - Method for manufacturing leadframe for semiconductor apparatus - Google Patents

Method for manufacturing leadframe for semiconductor apparatus

Info

Publication number
JPS5515292A
JPS5515292A JP8908378A JP8908378A JPS5515292A JP S5515292 A JPS5515292 A JP S5515292A JP 8908378 A JP8908378 A JP 8908378A JP 8908378 A JP8908378 A JP 8908378A JP S5515292 A JPS5515292 A JP S5515292A
Authority
JP
Japan
Prior art keywords
components
uncommon
molding
common
die set
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8908378A
Other languages
Japanese (ja)
Other versions
JPS5841781B2 (en
Inventor
Hiroyuki Matsumoto
Nobuyuki Hiramatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP8908378A priority Critical patent/JPS5841781B2/en
Publication of JPS5515292A publication Critical patent/JPS5515292A/en
Publication of JPS5841781B2 publication Critical patent/JPS5841781B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To manufacture various kinds of frame by using single molding system so as to lower the cost by composing molding for drawing leadframe in common components and uncommon components separately and attaching releasably uncommon components to press die set. CONSTITUTION:When various kinds of I.C. leadframe having 24, 22, 20 and so on of external leads are drawn from the molding, common components and uncommon components are separately manufactured and the uncommon componets are selectively assembled with the common comonents. The common components include internal lead parts 11, 12 and external lead parts 21, 22 positioned in extreme outer end, while uncommon components include the parts shown as A-H. Thus, molding for forming the common components is settled to press die set and likewise uncommon components are selectively settled to the press die set and the both components are used in unity. Such constitution evades necessity of providing each separate molding and lowers the cost.
JP8908378A 1978-07-20 1978-07-20 Method for manufacturing lead frames for semiconductor devices Expired JPS5841781B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8908378A JPS5841781B2 (en) 1978-07-20 1978-07-20 Method for manufacturing lead frames for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8908378A JPS5841781B2 (en) 1978-07-20 1978-07-20 Method for manufacturing lead frames for semiconductor devices

Publications (2)

Publication Number Publication Date
JPS5515292A true JPS5515292A (en) 1980-02-02
JPS5841781B2 JPS5841781B2 (en) 1983-09-14

Family

ID=13960962

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8908378A Expired JPS5841781B2 (en) 1978-07-20 1978-07-20 Method for manufacturing lead frames for semiconductor devices

Country Status (1)

Country Link
JP (1) JPS5841781B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57170233A (en) * 1981-04-15 1982-10-20 Japan Radio Ueda Co Ltd Ultrasonic probe for ultrasonic diagnosis

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6096364U (en) * 1983-12-06 1985-07-01 フジテツク株式会社 Man conveyor railing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57170233A (en) * 1981-04-15 1982-10-20 Japan Radio Ueda Co Ltd Ultrasonic probe for ultrasonic diagnosis

Also Published As

Publication number Publication date
JPS5841781B2 (en) 1983-09-14

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