JPS55138264A - Microwave integrated circuit package - Google Patents

Microwave integrated circuit package

Info

Publication number
JPS55138264A
JPS55138264A JP4396579A JP4396579A JPS55138264A JP S55138264 A JPS55138264 A JP S55138264A JP 4396579 A JP4396579 A JP 4396579A JP 4396579 A JP4396579 A JP 4396579A JP S55138264 A JPS55138264 A JP S55138264A
Authority
JP
Japan
Prior art keywords
input
output terminals
line ends
microwave
impedance matching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4396579A
Other languages
Japanese (ja)
Other versions
JPS5931217B2 (en
Inventor
Akira Izumi
Yoshiaki Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP54043965A priority Critical patent/JPS5931217B2/en
Publication of JPS55138264A publication Critical patent/JPS55138264A/en
Publication of JPS5931217B2 publication Critical patent/JPS5931217B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To facilitate impedance matching by a method wherein a substrate which has integrated circuits for microwave is built perpendicular to a supporting board which has input and output terminals and line ends of integrated circuits are connected with input and output terminals, respectively, which protrude toward the direction of integrated circuit ends. CONSTITUTION:Input and output terminals 2, 3 and outer lead wires 4 are extended, being insulated with insulator 5 and vertically from a metal base, and characteristic impedance of terminals 2, 3 are adjusted to the specified value by arranging them. The ceramic substrate 6 has microwave integrated circuits 7, and also has input and output line ends 7, 8, line ends 10 for bias voltage circuit and a conductive film 11. According to this constitution input and output line ends 8, 9 have direct connections with input and output terminals 2, 3, respectively, not having intervening bends, and impedance matching for connecting parts is facilitated. Thus because line ends 8, 9 of microwave circuits and input and output terminals 2, 3 are protruded in the same or parallel direction, impedance matching is facilitated and package size can be reduced.
JP54043965A 1979-04-11 1979-04-11 Microwave integrated circuit package Expired JPS5931217B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP54043965A JPS5931217B2 (en) 1979-04-11 1979-04-11 Microwave integrated circuit package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54043965A JPS5931217B2 (en) 1979-04-11 1979-04-11 Microwave integrated circuit package

Publications (2)

Publication Number Publication Date
JPS55138264A true JPS55138264A (en) 1980-10-28
JPS5931217B2 JPS5931217B2 (en) 1984-07-31

Family

ID=12678412

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54043965A Expired JPS5931217B2 (en) 1979-04-11 1979-04-11 Microwave integrated circuit package

Country Status (1)

Country Link
JP (1) JPS5931217B2 (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60103842U (en) * 1983-12-20 1985-07-15 ティーディーケイ株式会社 Package structure of hybrid integrated circuit
JPS6221301A (en) * 1985-07-22 1987-01-29 Nec Corp Dielectric resonator filter
EP0333374A2 (en) * 1988-03-14 1989-09-20 Texas Instruments Incorporated Edge-mounted, surface-mount package for semiconductor integrated circuit devices
US5198318A (en) * 1989-06-06 1993-03-30 Fuji Electric Co., Ltd. Bisazo photoconductor for electrophotography
US5275898A (en) * 1989-06-06 1994-01-04 Fuji Electric Co., Ltd. Bisazo photoconductor for electrophotography
US5316881A (en) * 1991-12-27 1994-05-31 Fuji Electric Co., Ltd. Photoconductor for electrophotgraphy containing benzidine derivative
US5393627A (en) * 1992-02-12 1995-02-28 Fuji Electric Co., Ltd. Photoconductor for electrophotography
US6002589A (en) * 1997-07-21 1999-12-14 Rambus Inc. Integrated circuit package for coupling to a printed circuit board
US6007357A (en) * 1995-05-26 1999-12-28 Rambus Inc. Chip socket assembly and chip file assembly for semiconductor chips
US6234820B1 (en) 1997-07-21 2001-05-22 Rambus Inc. Method and apparatus for joining printed circuit boards
US8096812B2 (en) 1995-05-26 2012-01-17 Rambus Inc. Chip socket assembly and chip file assembly for semiconductor chips

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4811349U (en) * 1971-06-18 1973-02-08
JPS5224542U (en) * 1975-08-12 1977-02-21

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4811349B1 (en) * 1967-10-09 1973-04-12
JPS5224542B2 (en) * 1973-12-19 1977-07-01

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4811349U (en) * 1971-06-18 1973-02-08
JPS5224542U (en) * 1975-08-12 1977-02-21

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6334278Y2 (en) * 1983-12-20 1988-09-12
JPS60103842U (en) * 1983-12-20 1985-07-15 ティーディーケイ株式会社 Package structure of hybrid integrated circuit
JPS6221301A (en) * 1985-07-22 1987-01-29 Nec Corp Dielectric resonator filter
EP0333374B1 (en) * 1988-03-14 1997-09-17 Texas Instruments Incorporated Edge-mounted, surface-mount package for semiconductor integrated circuit devices
EP0333374A2 (en) * 1988-03-14 1989-09-20 Texas Instruments Incorporated Edge-mounted, surface-mount package for semiconductor integrated circuit devices
US4975763A (en) * 1988-03-14 1990-12-04 Texas Instruments Incorporated Edge-mounted, surface-mount package for semiconductor integrated circuit devices
US5198318A (en) * 1989-06-06 1993-03-30 Fuji Electric Co., Ltd. Bisazo photoconductor for electrophotography
US5275898A (en) * 1989-06-06 1994-01-04 Fuji Electric Co., Ltd. Bisazo photoconductor for electrophotography
US5286590A (en) * 1989-06-06 1994-02-15 Fuji Electric Co., Ltd. Bisazo photoconductor for electrophotography
US5292602A (en) * 1989-06-06 1994-03-08 Fugi Electric Co., Ltd. Bisazo photoconductor for electrophotography
US5292608A (en) * 1989-06-06 1994-03-08 Fugi Electric Co., Ltd. Bisazo photoconductor for electrophotography
US5316881A (en) * 1991-12-27 1994-05-31 Fuji Electric Co., Ltd. Photoconductor for electrophotgraphy containing benzidine derivative
US5393627A (en) * 1992-02-12 1995-02-28 Fuji Electric Co., Ltd. Photoconductor for electrophotography
US6007357A (en) * 1995-05-26 1999-12-28 Rambus Inc. Chip socket assembly and chip file assembly for semiconductor chips
US6352435B1 (en) 1995-05-26 2002-03-05 Rambus, Inc. Chip socket assembly and chip file assembly for semiconductor chips
US6589059B2 (en) 1995-05-26 2003-07-08 Rambus, Inc. Chip socket assembly and chip file assembly for semiconductor chips
US6619973B2 (en) 1995-05-26 2003-09-16 Rambus, Inc. Chip socket assembly and chip file assembly for semiconductor chips
US8096812B2 (en) 1995-05-26 2012-01-17 Rambus Inc. Chip socket assembly and chip file assembly for semiconductor chips
US6002589A (en) * 1997-07-21 1999-12-14 Rambus Inc. Integrated circuit package for coupling to a printed circuit board
US6234820B1 (en) 1997-07-21 2001-05-22 Rambus Inc. Method and apparatus for joining printed circuit boards
US6447321B1 (en) 1997-07-21 2002-09-10 Rambus, Inc. Socket for coupling an integrated circuit package to a printed circuit board

Also Published As

Publication number Publication date
JPS5931217B2 (en) 1984-07-31

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