JPS55133549A - Probe card - Google Patents

Probe card

Info

Publication number
JPS55133549A
JPS55133549A JP4078079A JP4078079A JPS55133549A JP S55133549 A JPS55133549 A JP S55133549A JP 4078079 A JP4078079 A JP 4078079A JP 4078079 A JP4078079 A JP 4078079A JP S55133549 A JPS55133549 A JP S55133549A
Authority
JP
Japan
Prior art keywords
substrate
pores
probe
needles
needle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4078079A
Other languages
Japanese (ja)
Inventor
Yoshie Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP4078079A priority Critical patent/JPS55133549A/en
Publication of JPS55133549A publication Critical patent/JPS55133549A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To enable checking of bonding wires in high density on a probe card by forming pores vertically passing a substrate, inserting probe needles each having axial elasticity through the pores and electrically connecting the needles to a checking unit. CONSTITUTION:Pores 3 are perforated through a substrate 1 at the positions corresponding to wire bonding pads on the periphery of a portion 2 designated by broken lines where a semiconductor chip is die bonded. A probe needle 6 having a stretchable portion being elastic is inserted into each of the pores 3 of the substrate 1. Wires electrically connected to the stationary portion of the needle 6 projected on the upper surface side of the substrate 1 and to a checking unit and an electrode pattern 4 are formed on the substrate 1. A mark 5 for positioning at measuring time is also formed on the substrate 1.
JP4078079A 1979-04-03 1979-04-03 Probe card Pending JPS55133549A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4078079A JPS55133549A (en) 1979-04-03 1979-04-03 Probe card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4078079A JPS55133549A (en) 1979-04-03 1979-04-03 Probe card

Publications (1)

Publication Number Publication Date
JPS55133549A true JPS55133549A (en) 1980-10-17

Family

ID=12590132

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4078079A Pending JPS55133549A (en) 1979-04-03 1979-04-03 Probe card

Country Status (1)

Country Link
JP (1) JPS55133549A (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01123157A (en) * 1987-11-09 1989-05-16 Hitachi Ltd Probe head for semiconductor lsi inspecting apparatus and preparation thereof
JPH01295185A (en) * 1988-05-21 1989-11-28 Tokyo Electron Ltd Inspection device
US5225771A (en) * 1988-05-16 1993-07-06 Dri Technology Corp. Making and testing an integrated circuit using high density probe points
JPH085662A (en) * 1994-06-16 1996-01-12 Seiken:Kk Inspection probe
JP2001091537A (en) * 1999-09-24 2001-04-06 Isao Kimoto Contact and contact assembly using it
US6528759B2 (en) 2001-02-13 2003-03-04 Medallion Technology, Llc Pneumatic inductor and method of electrical connector delivery and organization
US6530511B2 (en) 2001-02-13 2003-03-11 Medallion Technology, Llc Wire feed mechanism and method used for fabricating electrical connectors
US6584677B2 (en) 2001-02-13 2003-07-01 Medallion Technology, Llc High-speed, high-capacity twist pin connector fabricating machine and method
US6716038B2 (en) 2002-07-31 2004-04-06 Medallion Technology, Llc Z-axis connection of multiple substrates by partial insertion of bulges of a pin
US6729026B2 (en) 2001-02-13 2004-05-04 Medallion Technology, Llc Rotational grip twist machine and method for fabricating bulges of twisted wire electrical connectors
JP2009014480A (en) * 2007-07-04 2009-01-22 Koyo Technos:Kk Inspection tool
JP2013137281A (en) * 2011-12-28 2013-07-11 Seiko Epson Corp Probe device
US8613622B2 (en) 2011-02-15 2013-12-24 Medallion Technology, Llc Interconnection interface using twist pins for testing and docking
WO2020256132A1 (en) * 2019-06-21 2020-12-24 ユナイテッド・プレシジョン・テクノロジーズ株式会社 Microfabrication device for metal product, and microfabrication method for metal product

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4816757B1 (en) * 1969-04-18 1973-05-24

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4816757B1 (en) * 1969-04-18 1973-05-24

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01123157A (en) * 1987-11-09 1989-05-16 Hitachi Ltd Probe head for semiconductor lsi inspecting apparatus and preparation thereof
JPH0640106B2 (en) * 1987-11-09 1994-05-25 株式会社日立製作所 Probe head for semiconductor LSI inspection device and manufacturing method thereof
US5225771A (en) * 1988-05-16 1993-07-06 Dri Technology Corp. Making and testing an integrated circuit using high density probe points
JPH01295185A (en) * 1988-05-21 1989-11-28 Tokyo Electron Ltd Inspection device
JPH085662A (en) * 1994-06-16 1996-01-12 Seiken:Kk Inspection probe
JP2001091537A (en) * 1999-09-24 2001-04-06 Isao Kimoto Contact and contact assembly using it
US6584677B2 (en) 2001-02-13 2003-07-01 Medallion Technology, Llc High-speed, high-capacity twist pin connector fabricating machine and method
US6530511B2 (en) 2001-02-13 2003-03-11 Medallion Technology, Llc Wire feed mechanism and method used for fabricating electrical connectors
US6528759B2 (en) 2001-02-13 2003-03-04 Medallion Technology, Llc Pneumatic inductor and method of electrical connector delivery and organization
US6729026B2 (en) 2001-02-13 2004-05-04 Medallion Technology, Llc Rotational grip twist machine and method for fabricating bulges of twisted wire electrical connectors
US6971415B2 (en) 2001-02-13 2005-12-06 Medallion Technology, Llc Rotational grip twist machine and method for fabricating bulges of twisted wire electrical connectors
US6716038B2 (en) 2002-07-31 2004-04-06 Medallion Technology, Llc Z-axis connection of multiple substrates by partial insertion of bulges of a pin
JP2009014480A (en) * 2007-07-04 2009-01-22 Koyo Technos:Kk Inspection tool
US8613622B2 (en) 2011-02-15 2013-12-24 Medallion Technology, Llc Interconnection interface using twist pins for testing and docking
JP2013137281A (en) * 2011-12-28 2013-07-11 Seiko Epson Corp Probe device
WO2020256132A1 (en) * 2019-06-21 2020-12-24 ユナイテッド・プレシジョン・テクノロジーズ株式会社 Microfabrication device for metal product, and microfabrication method for metal product

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