JPS5512736A - Semiconductor device manufacturing method - Google Patents
Semiconductor device manufacturing methodInfo
- Publication number
- JPS5512736A JPS5512736A JP8536278A JP8536278A JPS5512736A JP S5512736 A JPS5512736 A JP S5512736A JP 8536278 A JP8536278 A JP 8536278A JP 8536278 A JP8536278 A JP 8536278A JP S5512736 A JPS5512736 A JP S5512736A
- Authority
- JP
- Japan
- Prior art keywords
- silver
- main body
- gold
- heat
- soldering member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
Landscapes
- Die Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
PURPOSE: To enable a semiconductor to be better adhered to a heat radiating plate and improve its heat dissipating performance by forming a bold or a silver film of 0.7W2.0μ in thickness on a soldering member surface so as to protect it from being oxidized.
CONSTITUTION: A tape-like soldering member 3, forming a 0.7W2.0μ thick gold or silver covering layer 2 which is activating the surface of a gold-tin system or a silver-tin system solder main body 1, is cut to a required length. Now, thus cut soldering member 3a is placed on the top of a heat-radiating plate 4. If the heat- radiating palte 4 is heated up to melting point of the soldering material 3 or to a higher temperature, the solder main body 1 starts being melted. And, at the same time, gold or silver constituting the covering layer 2 is dispersed onto the solder main body 1, and a soldering member 3 consisting of gold or silver and the solder main body 1 is formed in a molten state. The semiconductor element 5 is sucked and held by a collet having an indentation on its bottom surface, and it is placed onto the member 3a.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8536278A JPS5512736A (en) | 1978-07-13 | 1978-07-13 | Semiconductor device manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8536278A JPS5512736A (en) | 1978-07-13 | 1978-07-13 | Semiconductor device manufacturing method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5512736A true JPS5512736A (en) | 1980-01-29 |
Family
ID=13856593
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8536278A Pending JPS5512736A (en) | 1978-07-13 | 1978-07-13 | Semiconductor device manufacturing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5512736A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5851584A (en) * | 1981-09-24 | 1983-03-26 | Hitachi Ltd | Mounting structure of compound semiconductor element |
-
1978
- 1978-07-13 JP JP8536278A patent/JPS5512736A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5851584A (en) * | 1981-09-24 | 1983-03-26 | Hitachi Ltd | Mounting structure of compound semiconductor element |
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