JPS5610947A - Semiconductor sealing resin composition - Google Patents

Semiconductor sealing resin composition

Info

Publication number
JPS5610947A
JPS5610947A JP8647779A JP8647779A JPS5610947A JP S5610947 A JPS5610947 A JP S5610947A JP 8647779 A JP8647779 A JP 8647779A JP 8647779 A JP8647779 A JP 8647779A JP S5610947 A JPS5610947 A JP S5610947A
Authority
JP
Japan
Prior art keywords
powder
particle size
less
specified
crystalline
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8647779A
Other languages
Japanese (ja)
Inventor
Kazutaka Matsumoto
Akira Yoshizumi
Michiya Azuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP8647779A priority Critical patent/JPS5610947A/en
Publication of JPS5610947A publication Critical patent/JPS5610947A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To obtain a composition having preferable moisture resistance and heat dissipating property by employing inorganic filler powder containing crystalline and molten silica powder of specified particle size and mixture ratio, epoxy, phenolic novolak resin and curing accelerator o specified weight. CONSTITUTION:A mixture of crystalline and molten silica powder is used as a filler powder forming a sealing resin composition. That is, there are used as a crystalline powder 55-90wt% of powder having at least 50wt% of powder including a particle size of higher than 19mum as a particle size of lower than 48mum and a powder including a mean particle size of 4-10mum and less than 0.5wt% of powder of higher than 149mum. The molten powder contains at least 40wt% of powder including a particle size of less than 3mum, a particle size of less than 19mum and mean particle size of 1-4mum, and a content of 90-99wt%. There are selected the epoxy and the phenol novolak resin contaning softening points of 60-120 deg.C and 70-130 deg.C respectively, 19.0-39.9wt%. The weight of the curing accelerator is specified at 0.1-1.0%.
JP8647779A 1979-07-10 1979-07-10 Semiconductor sealing resin composition Pending JPS5610947A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8647779A JPS5610947A (en) 1979-07-10 1979-07-10 Semiconductor sealing resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8647779A JPS5610947A (en) 1979-07-10 1979-07-10 Semiconductor sealing resin composition

Publications (1)

Publication Number Publication Date
JPS5610947A true JPS5610947A (en) 1981-02-03

Family

ID=13888044

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8647779A Pending JPS5610947A (en) 1979-07-10 1979-07-10 Semiconductor sealing resin composition

Country Status (1)

Country Link
JP (1) JPS5610947A (en)

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57195151A (en) * 1981-05-27 1982-11-30 Denki Kagaku Kogyo Kk Low-radioactive resin composition
JPS57212224A (en) * 1981-06-24 1982-12-27 Nitto Electric Ind Co Ltd Epoxy resin composition for encapsulation of semiconductor
JPS57212225A (en) * 1981-06-24 1982-12-27 Nitto Electric Ind Co Ltd Epoxy resin composition for encapsulation of semiconductor
JPS582322A (en) * 1981-06-30 1983-01-07 Nitto Electric Ind Co Ltd Epoxy resin composition for encapsulation of semiconductor
JPS58164250A (en) * 1982-03-24 1983-09-29 Nitto Electric Ind Co Ltd Resin composition for sealing semiconductor
JPS5947744A (en) * 1982-09-10 1984-03-17 Toshiba Ceramics Co Ltd Filler material for ic package
JPS6018519A (en) * 1983-07-09 1985-01-30 Matsushita Electric Works Ltd Epoxy resin composition
JPS6031522A (en) * 1983-07-29 1985-02-18 Toshiba Chem Corp Sealing resin composition
JPS60180911A (en) * 1984-02-27 1985-09-14 Nippon Chem Ind Co Ltd:The High-purity silica and its manufacture
JPS60191016A (en) * 1984-03-12 1985-09-28 Nippon Chem Ind Co Ltd:The High-purity silica and its manufacture
JPS6140811A (en) * 1984-07-31 1986-02-27 Nippon Chem Ind Co Ltd:The Hydrated silica for melting and manufacture of melted silica by using it
JPS6148422A (en) * 1984-08-17 1986-03-10 Nippon Chem Ind Co Ltd:The High purity silica and its preparation
JPS6148421A (en) * 1984-08-17 1986-03-10 Nippon Chem Ind Co Ltd:The Silica with high purity and its preparation
JPS6164145A (en) * 1984-09-05 1986-04-02 Mitsubishi Electric Corp Resin sealed semiconductor device
JPS6181422A (en) * 1984-09-28 1986-04-25 Toshiba Corp Epoxy resin composition for casting
JPS61243853A (en) * 1985-04-19 1986-10-30 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS6259626A (en) * 1985-09-10 1987-03-16 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS6315449A (en) * 1986-07-07 1988-01-22 Nitto Electric Ind Co Ltd Semiconductor device
JPS6422967A (en) * 1987-07-17 1989-01-25 Shinetsu Chemical Co Curable liquid silicone rubber composition
SG103883A1 (en) * 2002-07-29 2004-05-26 Sumitomo Bakelite Singapore Pt Epoxy resin composition
US6844633B2 (en) 2001-08-02 2005-01-18 Nec Electronics Corporation Sealing resin, resin-sealed semiconductor and system-in-package

Cited By (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57195151A (en) * 1981-05-27 1982-11-30 Denki Kagaku Kogyo Kk Low-radioactive resin composition
JPS57212224A (en) * 1981-06-24 1982-12-27 Nitto Electric Ind Co Ltd Epoxy resin composition for encapsulation of semiconductor
JPS57212225A (en) * 1981-06-24 1982-12-27 Nitto Electric Ind Co Ltd Epoxy resin composition for encapsulation of semiconductor
JPS627211B2 (en) * 1981-06-24 1987-02-16 Nitto Electric Ind Co
JPS627212B2 (en) * 1981-06-24 1987-02-16 Nitto Electric Ind Co
JPS582322A (en) * 1981-06-30 1983-01-07 Nitto Electric Ind Co Ltd Epoxy resin composition for encapsulation of semiconductor
JPS6217604B2 (en) * 1981-06-30 1987-04-18 Nitto Electric Ind Co
JPS58164250A (en) * 1982-03-24 1983-09-29 Nitto Electric Ind Co Ltd Resin composition for sealing semiconductor
JPH0343784B2 (en) * 1982-03-24 1991-07-03 Nitto Denko Corp
JPS6332268B2 (en) * 1982-09-10 1988-06-29 Toshiba Ceramics Co
JPS5947744A (en) * 1982-09-10 1984-03-17 Toshiba Ceramics Co Ltd Filler material for ic package
JPS6018519A (en) * 1983-07-09 1985-01-30 Matsushita Electric Works Ltd Epoxy resin composition
JPS6244013B2 (en) * 1983-07-09 1987-09-17 Matsushita Electric Works Ltd
JPS6031522A (en) * 1983-07-29 1985-02-18 Toshiba Chem Corp Sealing resin composition
JPH0121091B2 (en) * 1984-02-27 1989-04-19 Nippon Chemical Ind
JPS60180911A (en) * 1984-02-27 1985-09-14 Nippon Chem Ind Co Ltd:The High-purity silica and its manufacture
JPH05339B2 (en) * 1984-03-12 1993-01-05 Nippon Chemical Ind
JPS60191016A (en) * 1984-03-12 1985-09-28 Nippon Chem Ind Co Ltd:The High-purity silica and its manufacture
JPH0127003B2 (en) * 1984-07-31 1989-05-26 Nippon Chemical Ind
JPS6140811A (en) * 1984-07-31 1986-02-27 Nippon Chem Ind Co Ltd:The Hydrated silica for melting and manufacture of melted silica by using it
JPH0121092B2 (en) * 1984-08-17 1989-04-19 Nippon Chemical Ind
JPH0124729B2 (en) * 1984-08-17 1989-05-12 Nippon Chemical Ind
JPS6148422A (en) * 1984-08-17 1986-03-10 Nippon Chem Ind Co Ltd:The High purity silica and its preparation
JPS6148421A (en) * 1984-08-17 1986-03-10 Nippon Chem Ind Co Ltd:The Silica with high purity and its preparation
JPS6164145A (en) * 1984-09-05 1986-04-02 Mitsubishi Electric Corp Resin sealed semiconductor device
JPS6181422A (en) * 1984-09-28 1986-04-25 Toshiba Corp Epoxy resin composition for casting
JPH056582B2 (en) * 1984-09-28 1993-01-26 Tokyo Shibaura Electric Co
JPS61243853A (en) * 1985-04-19 1986-10-30 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS6337127B2 (en) * 1985-04-19 1988-07-22 Shinetsu Chem Ind Co
JPS6259626A (en) * 1985-09-10 1987-03-16 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS6325012B2 (en) * 1985-09-10 1988-05-24 Shinetsu Chem Ind Co
JPS6315449A (en) * 1986-07-07 1988-01-22 Nitto Electric Ind Co Ltd Semiconductor device
JPS6422967A (en) * 1987-07-17 1989-01-25 Shinetsu Chemical Co Curable liquid silicone rubber composition
JPH0528738B2 (en) * 1987-07-17 1993-04-27 Shinetsu Chem Ind Co
US6844633B2 (en) 2001-08-02 2005-01-18 Nec Electronics Corporation Sealing resin, resin-sealed semiconductor and system-in-package
SG103883A1 (en) * 2002-07-29 2004-05-26 Sumitomo Bakelite Singapore Pt Epoxy resin composition

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