JPS551101A - Method and device for detecting position of semiconductor pellet - Google Patents

Method and device for detecting position of semiconductor pellet

Info

Publication number
JPS551101A
JPS551101A JP13552777A JP13552777A JPS551101A JP S551101 A JPS551101 A JP S551101A JP 13552777 A JP13552777 A JP 13552777A JP 13552777 A JP13552777 A JP 13552777A JP S551101 A JPS551101 A JP S551101A
Authority
JP
Japan
Prior art keywords
safe
periphery
pellet
fully automatic
pellets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13552777A
Other languages
Japanese (ja)
Inventor
Masayuki Naruse
Yasuo Sakagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP13552777A priority Critical patent/JPS551101A/en
Publication of JPS551101A publication Critical patent/JPS551101A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10161—Shape being a cuboid with a rectangular active surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Control Of Position Or Direction (AREA)

Abstract

PURPOSE: To enable efficient, safe and fully automatic wire bonding, by previously detecting the position of the periphery of each semiconductor pellet, separating image data from noise data and rendering a scanning zone reltively small.
CONSTITUTION: Semiconductor pellets 2, 2', 2" are die-bonded at an almost uniform spacing in a row on a lead frame 1 and sequentially bonded with wires. Before the pellets are conveyed to a bonding station, the position of the periphery of each pellet is detected by a first photoelectric scanner 3. The scanning zone 13 of an electrode detection scanner at the bonding station is controlled depending on the result of the detection. This enables efficient, safe and fully automatic wire bonding.
COPYRIGHT: (C)1980,JPO&Japio
JP13552777A 1977-11-10 1977-11-10 Method and device for detecting position of semiconductor pellet Pending JPS551101A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13552777A JPS551101A (en) 1977-11-10 1977-11-10 Method and device for detecting position of semiconductor pellet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13552777A JPS551101A (en) 1977-11-10 1977-11-10 Method and device for detecting position of semiconductor pellet

Publications (1)

Publication Number Publication Date
JPS551101A true JPS551101A (en) 1980-01-07

Family

ID=15153847

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13552777A Pending JPS551101A (en) 1977-11-10 1977-11-10 Method and device for detecting position of semiconductor pellet

Country Status (1)

Country Link
JP (1) JPS551101A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6126116A (en) * 1984-07-16 1986-02-05 Toshiba Corp Positioning equipment
JPS6197838U (en) * 1985-11-20 1986-06-23
KR100317599B1 (en) * 2000-02-17 2001-12-24 서경석 Recognition method of wire bonding point
KR100604670B1 (en) * 1999-12-30 2006-07-25 주식회사 하이닉스반도체 Apparatus for wire bonding and method for bonding using the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6126116A (en) * 1984-07-16 1986-02-05 Toshiba Corp Positioning equipment
JPS6197838U (en) * 1985-11-20 1986-06-23
JPH0134345Y2 (en) * 1985-11-20 1989-10-19
KR100604670B1 (en) * 1999-12-30 2006-07-25 주식회사 하이닉스반도체 Apparatus for wire bonding and method for bonding using the same
KR100317599B1 (en) * 2000-02-17 2001-12-24 서경석 Recognition method of wire bonding point

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