JPS52149070A - Locating and inspecting method for semiconductor parts and die bonding device using the same - Google Patents
Locating and inspecting method for semiconductor parts and die bonding device using the sameInfo
- Publication number
- JPS52149070A JPS52149070A JP6560876A JP6560876A JPS52149070A JP S52149070 A JPS52149070 A JP S52149070A JP 6560876 A JP6560876 A JP 6560876A JP 6560876 A JP6560876 A JP 6560876A JP S52149070 A JPS52149070 A JP S52149070A
- Authority
- JP
- Japan
- Prior art keywords
- locating
- same
- die bonding
- bonding device
- inspecting method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Die Bonding (AREA)
Abstract
PURPOSE: To perform location and inspection in good order based on the entire information obtained by scanning an optical image formed on a plane on which photo electric converting elements are arranged in the form of a matrix.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6560876A JPS52149070A (en) | 1976-06-07 | 1976-06-07 | Locating and inspecting method for semiconductor parts and die bonding device using the same |
US05/804,441 US4200393A (en) | 1976-06-07 | 1977-06-07 | Method of positioning a semiconductor member by examining it and a die bonding apparatus using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6560876A JPS52149070A (en) | 1976-06-07 | 1976-06-07 | Locating and inspecting method for semiconductor parts and die bonding device using the same |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16270379A Division JPS55108745A (en) | 1979-12-17 | 1979-12-17 | Die-bonding device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS52149070A true JPS52149070A (en) | 1977-12-10 |
JPS5520378B2 JPS5520378B2 (en) | 1980-06-02 |
Family
ID=13291885
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6560876A Granted JPS52149070A (en) | 1976-06-07 | 1976-06-07 | Locating and inspecting method for semiconductor parts and die bonding device using the same |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS52149070A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54158874A (en) * | 1978-06-06 | 1979-12-15 | Matsushita Electronics Corp | Dies bonding unit |
JPS5570041A (en) * | 1978-11-21 | 1980-05-27 | Toshiba Corp | Apparatus for fabricating semiconductor device |
JPS55165643A (en) * | 1979-06-12 | 1980-12-24 | Fujitsu Ltd | Device for bonding pellet |
JPS5823448A (en) * | 1981-08-05 | 1983-02-12 | Nec Corp | Recognition system for pellet positioning |
JPS58121637A (en) * | 1982-01-13 | 1983-07-20 | Fuji Electric Co Ltd | Tracking method for semiconductor chip |
JPS58165335A (en) * | 1982-03-26 | 1983-09-30 | Nec Corp | Method and apparatus for manufacturing semiconductor device using tape carrier system |
JPS5926245U (en) * | 1982-08-10 | 1984-02-18 | 日本電気株式会社 | Semiconductor pellet mounting equipment |
JP2007141980A (en) * | 2005-11-16 | 2007-06-07 | Nidec Tosok Corp | Bonding apparatus |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6272676B2 (en) * | 2013-11-07 | 2018-01-31 | 東レエンジニアリング株式会社 | Bonding equipment |
US11138746B2 (en) | 2017-07-03 | 2021-10-05 | Ricoh Company, Ltd. | Diagnostic support system and diagnostic support method |
-
1976
- 1976-06-07 JP JP6560876A patent/JPS52149070A/en active Granted
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54158874A (en) * | 1978-06-06 | 1979-12-15 | Matsushita Electronics Corp | Dies bonding unit |
JPS5746651B2 (en) * | 1978-06-06 | 1982-10-05 | ||
JPS5570041A (en) * | 1978-11-21 | 1980-05-27 | Toshiba Corp | Apparatus for fabricating semiconductor device |
JPS596058B2 (en) * | 1978-11-21 | 1984-02-08 | 株式会社東芝 | Semiconductor device manufacturing equipment |
JPS55165643A (en) * | 1979-06-12 | 1980-12-24 | Fujitsu Ltd | Device for bonding pellet |
JPS6318326B2 (en) * | 1979-06-12 | 1988-04-18 | Fujitsu Ltd | |
JPS5823448A (en) * | 1981-08-05 | 1983-02-12 | Nec Corp | Recognition system for pellet positioning |
JPS58121637A (en) * | 1982-01-13 | 1983-07-20 | Fuji Electric Co Ltd | Tracking method for semiconductor chip |
JPS58165335A (en) * | 1982-03-26 | 1983-09-30 | Nec Corp | Method and apparatus for manufacturing semiconductor device using tape carrier system |
JPH0131694B2 (en) * | 1982-03-26 | 1989-06-27 | Nippon Electric Co | |
JPS5926245U (en) * | 1982-08-10 | 1984-02-18 | 日本電気株式会社 | Semiconductor pellet mounting equipment |
JP2007141980A (en) * | 2005-11-16 | 2007-06-07 | Nidec Tosok Corp | Bonding apparatus |
Also Published As
Publication number | Publication date |
---|---|
JPS5520378B2 (en) | 1980-06-02 |
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