JPS54974A - Manufacture for semiconductor device - Google Patents

Manufacture for semiconductor device

Info

Publication number
JPS54974A
JPS54974A JP6715777A JP6715777A JPS54974A JP S54974 A JPS54974 A JP S54974A JP 6715777 A JP6715777 A JP 6715777A JP 6715777 A JP6715777 A JP 6715777A JP S54974 A JPS54974 A JP S54974A
Authority
JP
Japan
Prior art keywords
manufacture
semiconductor device
photo
polymerzation
chipping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6715777A
Other languages
Japanese (ja)
Other versions
JPS6020895B2 (en
Inventor
Masaru Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP52067157A priority Critical patent/JPS6020895B2/en
Publication of JPS54974A publication Critical patent/JPS54974A/en
Publication of JPS6020895B2 publication Critical patent/JPS6020895B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
  • Dicing (AREA)

Abstract

PURPOSE: To improve the workability of chipping for semicondcutor substrate, by using thick film of dry type photo sensitive resin having adhesion and photo polymerzation.
COPYRIGHT: (C)1979,JPO&Japio
JP52067157A 1977-06-06 1977-06-06 Manufacturing method of semiconductor device Expired JPS6020895B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52067157A JPS6020895B2 (en) 1977-06-06 1977-06-06 Manufacturing method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52067157A JPS6020895B2 (en) 1977-06-06 1977-06-06 Manufacturing method of semiconductor device

Publications (2)

Publication Number Publication Date
JPS54974A true JPS54974A (en) 1979-01-06
JPS6020895B2 JPS6020895B2 (en) 1985-05-24

Family

ID=13336771

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52067157A Expired JPS6020895B2 (en) 1977-06-06 1977-06-06 Manufacturing method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS6020895B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4876221A (en) * 1988-05-03 1989-10-24 Matsushita Electric Industrial Co., Ltd. Bonding method
US5063177A (en) * 1990-10-04 1991-11-05 Comsat Method of packaging microwave semiconductor components and integrated circuits

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6322191U (en) * 1986-07-26 1988-02-13
JPH0611594U (en) * 1990-12-17 1994-02-15 高清産業株式会社 Toilet seat cover

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4876221A (en) * 1988-05-03 1989-10-24 Matsushita Electric Industrial Co., Ltd. Bonding method
US5063177A (en) * 1990-10-04 1991-11-05 Comsat Method of packaging microwave semiconductor components and integrated circuits

Also Published As

Publication number Publication date
JPS6020895B2 (en) 1985-05-24

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