JPS5473562A - Wire bonding device - Google Patents

Wire bonding device

Info

Publication number
JPS5473562A
JPS5473562A JP14000177A JP14000177A JPS5473562A JP S5473562 A JPS5473562 A JP S5473562A JP 14000177 A JP14000177 A JP 14000177A JP 14000177 A JP14000177 A JP 14000177A JP S5473562 A JPS5473562 A JP S5473562A
Authority
JP
Japan
Prior art keywords
discriminator
time
waveform
vibrator
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14000177A
Other languages
Japanese (ja)
Other versions
JPS6123652B2 (en
Inventor
Shunichiro Fujioka
Shunei Uematsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14000177A priority Critical patent/JPS5473562A/en
Publication of JPS5473562A publication Critical patent/JPS5473562A/en
Publication of JPS6123652B2 publication Critical patent/JPS6123652B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H01L2224/78314—Shape
    • H01L2224/78317—Shape of other portions
    • H01L2224/78318—Shape of other portions inside the capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To eliminate blank striking of wire, by detecting the vibration frequency of vibrator composing a bonding device, comparing the detected waveform with the vibration waveform at the time of normal bonding, and stopping the device or issuing an alarm based on the result of comparison.
CONSTITUTION: A wire 2 having an insertion hole 12 for tool 1 is abutted against the pad provided on a semiconductor pellet 4, and the tool 1 is driven by a drive unit consisting of a horn 6, an amplifier 11, and a vibrator 7. The oscillation output from an oscillator 9 is applied to this drive unit through a transformer 8, and a discriminator 10 is connected to part of an electrode detection circuit 13, which is a feedback circuit. This discriminator 10 is composed of memory device, arithmetic device, etc. Thus, the stored voltage waveform at the time of normal bonding is compared with the voltage waveform at the time of operation when the feedback current is voltage-converted. In this way, discriminating the conditions of the operations, when an abnormality is detected, a signal is issued from the discriminator 10 to a stopping device or an alarm device.
COPYRIGHT: (C)1979,JPO&Japio
JP14000177A 1977-11-24 1977-11-24 Wire bonding device Granted JPS5473562A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14000177A JPS5473562A (en) 1977-11-24 1977-11-24 Wire bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14000177A JPS5473562A (en) 1977-11-24 1977-11-24 Wire bonding device

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP58241974A Division JPS59229833A (en) 1983-12-23 1983-12-23 Ultrasonic wave wire bonding method
JP62026241A Division JPS62234338A (en) 1987-02-09 1987-02-09 Wire bonding device

Publications (2)

Publication Number Publication Date
JPS5473562A true JPS5473562A (en) 1979-06-12
JPS6123652B2 JPS6123652B2 (en) 1986-06-06

Family

ID=15258616

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14000177A Granted JPS5473562A (en) 1977-11-24 1977-11-24 Wire bonding device

Country Status (1)

Country Link
JP (1) JPS5473562A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55105339A (en) * 1979-02-07 1980-08-12 Toshiba Corp Ultrasonic bonding method
JPS5637640A (en) * 1979-09-05 1981-04-11 Hitachi Ltd Method and apparatus for wire bonding
JPS5784741U (en) * 1980-11-12 1982-05-25
JPS57135735U (en) * 1981-02-20 1982-08-24
JPS58210629A (en) * 1982-06-02 1983-12-07 Marine Instr Co Ltd Bonding and apparatus thereof

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55105339A (en) * 1979-02-07 1980-08-12 Toshiba Corp Ultrasonic bonding method
JPS5637640A (en) * 1979-09-05 1981-04-11 Hitachi Ltd Method and apparatus for wire bonding
JPS5784741U (en) * 1980-11-12 1982-05-25
JPS57135735U (en) * 1981-02-20 1982-08-24
JPS58210629A (en) * 1982-06-02 1983-12-07 Marine Instr Co Ltd Bonding and apparatus thereof
JPH0141023B2 (en) * 1982-06-02 1989-09-01 Kaijo Denki Kk

Also Published As

Publication number Publication date
JPS6123652B2 (en) 1986-06-06

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