JPS5637640A - Method and apparatus for wire bonding - Google Patents

Method and apparatus for wire bonding

Info

Publication number
JPS5637640A
JPS5637640A JP11288879A JP11288879A JPS5637640A JP S5637640 A JPS5637640 A JP S5637640A JP 11288879 A JP11288879 A JP 11288879A JP 11288879 A JP11288879 A JP 11288879A JP S5637640 A JPS5637640 A JP S5637640A
Authority
JP
Japan
Prior art keywords
bonding
vibration
tool
setting value
descending speed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11288879A
Other languages
Japanese (ja)
Inventor
Yuzo Taniguchi
Kazuhisa Takashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11288879A priority Critical patent/JPS5637640A/en
Publication of JPS5637640A publication Critical patent/JPS5637640A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/78344—Eccentric cams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To increase the speed of working and obtain the stable bonding by eliminating the loss time in process before the bonding and by bonding after the confirmation of the fact that the vibration of a bonding arm is sufficiently attenuated. CONSTITUTION:An arm 12 movable vertically around a stationary shaft 11 constitutes a supersonic cone at its one end 12a and includes a wedge 13 at its distal end. Immediately before bonding, the vibration of a tool 13 is detected by 22 and 23 and then compared with a setting balue at 28. When the measured value is less than the setting value, the bonding work is started because it means that there is no problems. When the measured value is more than the setting value, the bonding work is not started because it means that the satisfied bonding can not be obtained. On this occasion, the drive of a motor 15 is immediately controlled by 30 to stop temporaly descent to fht tool 13 or reduce a descending speed of the to a extremely lowered level. Then, when the vibration is attenuated after the lapse of minute time and its degree becomes less than the setting value, the tool 13 begins to descend or increase its descending speed again and the bonding is carried out. Thus, it becomes possible to obtain the stable bonding while increasing the descending speed as a whole.
JP11288879A 1979-09-05 1979-09-05 Method and apparatus for wire bonding Pending JPS5637640A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11288879A JPS5637640A (en) 1979-09-05 1979-09-05 Method and apparatus for wire bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11288879A JPS5637640A (en) 1979-09-05 1979-09-05 Method and apparatus for wire bonding

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP60212497A Division JPS61111552A (en) 1985-09-27 1985-09-27 Wire bonder

Publications (1)

Publication Number Publication Date
JPS5637640A true JPS5637640A (en) 1981-04-11

Family

ID=14598020

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11288879A Pending JPS5637640A (en) 1979-09-05 1979-09-05 Method and apparatus for wire bonding

Country Status (1)

Country Link
JP (1) JPS5637640A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5854645A (en) * 1981-09-28 1983-03-31 Toshiba Corp Wire bonding device
JPS61111552A (en) * 1985-09-27 1986-05-29 Hitachi Ltd Wire bonder
JPH06237173A (en) * 1993-02-08 1994-08-23 G D S:Kk Multiplier or d/a converter using charge transfer element

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5473562A (en) * 1977-11-24 1979-06-12 Hitachi Ltd Wire bonding device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5473562A (en) * 1977-11-24 1979-06-12 Hitachi Ltd Wire bonding device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5854645A (en) * 1981-09-28 1983-03-31 Toshiba Corp Wire bonding device
JPS61111552A (en) * 1985-09-27 1986-05-29 Hitachi Ltd Wire bonder
JPH06237173A (en) * 1993-02-08 1994-08-23 G D S:Kk Multiplier or d/a converter using charge transfer element

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