JPS5472958A - Electrode structure of semiconductor device - Google Patents
Electrode structure of semiconductor deviceInfo
- Publication number
- JPS5472958A JPS5472958A JP13998677A JP13998677A JPS5472958A JP S5472958 A JPS5472958 A JP S5472958A JP 13998677 A JP13998677 A JP 13998677A JP 13998677 A JP13998677 A JP 13998677A JP S5472958 A JPS5472958 A JP S5472958A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- film
- opening part
- metal layer
- exposing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/023—Redistribution layers [RDL] for bonding areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13998677A JPS5472958A (en) | 1977-11-24 | 1977-11-24 | Electrode structure of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13998677A JPS5472958A (en) | 1977-11-24 | 1977-11-24 | Electrode structure of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5472958A true JPS5472958A (en) | 1979-06-11 |
Family
ID=15258272
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13998677A Pending JPS5472958A (en) | 1977-11-24 | 1977-11-24 | Electrode structure of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5472958A (ja) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52131455A (en) * | 1976-04-28 | 1977-11-04 | Hitachi Ltd | Semiconductor device |
-
1977
- 1977-11-24 JP JP13998677A patent/JPS5472958A/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52131455A (en) * | 1976-04-28 | 1977-11-04 | Hitachi Ltd | Semiconductor device |
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