JPS5335379A - Bump type semiconductor device - Google Patents

Bump type semiconductor device

Info

Publication number
JPS5335379A
JPS5335379A JP10959576A JP10959576A JPS5335379A JP S5335379 A JPS5335379 A JP S5335379A JP 10959576 A JP10959576 A JP 10959576A JP 10959576 A JP10959576 A JP 10959576A JP S5335379 A JPS5335379 A JP S5335379A
Authority
JP
Japan
Prior art keywords
semiconductor device
type semiconductor
film
bump type
thick
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10959576A
Other languages
Japanese (ja)
Inventor
Masaru Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP10959576A priority Critical patent/JPS5335379A/en
Publication of JPS5335379A publication Critical patent/JPS5335379A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE: To perform bump wiring by making a thick Al film encircling the thick Al2O3 film on a substrate insulation film, connecting the Al film to wiring layers at the bottom surface, and covering the top surface together with the protruded Al2O3 with a metal layer as specified.
COPYRIGHT: (C)1978,JPO&Japio
JP10959576A 1976-09-13 1976-09-13 Bump type semiconductor device Pending JPS5335379A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10959576A JPS5335379A (en) 1976-09-13 1976-09-13 Bump type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10959576A JPS5335379A (en) 1976-09-13 1976-09-13 Bump type semiconductor device

Publications (1)

Publication Number Publication Date
JPS5335379A true JPS5335379A (en) 1978-04-01

Family

ID=14514241

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10959576A Pending JPS5335379A (en) 1976-09-13 1976-09-13 Bump type semiconductor device

Country Status (1)

Country Link
JP (1) JPS5335379A (en)

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