JPS5335379A - Bump type semiconductor device - Google Patents
Bump type semiconductor deviceInfo
- Publication number
- JPS5335379A JPS5335379A JP10959576A JP10959576A JPS5335379A JP S5335379 A JPS5335379 A JP S5335379A JP 10959576 A JP10959576 A JP 10959576A JP 10959576 A JP10959576 A JP 10959576A JP S5335379 A JPS5335379 A JP S5335379A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- type semiconductor
- film
- bump type
- thick
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
PURPOSE: To perform bump wiring by making a thick Al film encircling the thick Al2O3 film on a substrate insulation film, connecting the Al film to wiring layers at the bottom surface, and covering the top surface together with the protruded Al2O3 with a metal layer as specified.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10959576A JPS5335379A (en) | 1976-09-13 | 1976-09-13 | Bump type semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10959576A JPS5335379A (en) | 1976-09-13 | 1976-09-13 | Bump type semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5335379A true JPS5335379A (en) | 1978-04-01 |
Family
ID=14514241
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10959576A Pending JPS5335379A (en) | 1976-09-13 | 1976-09-13 | Bump type semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5335379A (en) |
-
1976
- 1976-09-13 JP JP10959576A patent/JPS5335379A/en active Pending
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