JPS5471737A - Method and apparatus for producing printed conductive plate - Google Patents
Method and apparatus for producing printed conductive plateInfo
- Publication number
- JPS5471737A JPS5471737A JP13176578A JP13176578A JPS5471737A JP S5471737 A JPS5471737 A JP S5471737A JP 13176578 A JP13176578 A JP 13176578A JP 13176578 A JP13176578 A JP 13176578A JP S5471737 A JPS5471737 A JP S5471737A
- Authority
- JP
- Japan
- Prior art keywords
- conductive plate
- printed conductive
- producing printed
- producing
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- ing And Chemical Polishing (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19772748345 DE2748345A1 (en) | 1977-10-28 | 1977-10-28 | METHOD AND DEVICE FOR THE MANUFACTURING OF PRINTED CIRCUIT BOARDS |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5471737A true JPS5471737A (en) | 1979-06-08 |
Family
ID=6022480
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13176578A Pending JPS5471737A (en) | 1977-10-28 | 1978-10-27 | Method and apparatus for producing printed conductive plate |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS5471737A (en) |
DE (1) | DE2748345A1 (en) |
FR (1) | FR2407639A1 (en) |
GB (1) | GB2009515A (en) |
SE (1) | SE7811055L (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113079634B (en) * | 2020-05-29 | 2022-11-18 | 新华三技术有限公司合肥分公司 | Circuit board and preparation process thereof |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3159486A (en) * | 1959-08-03 | 1964-12-01 | Rca Corp | Method of making electrical conductors |
DE1490374B1 (en) * | 1963-02-06 | 1969-11-20 | Siemens Ag | Process for the production of an insulating body with metal layers |
FR1381882A (en) * | 1963-02-06 | 1964-12-14 | Siemens Ag | Process for the manufacture of printed circuits and circuits conforming to those thus obtained |
US3558441A (en) * | 1968-11-01 | 1971-01-26 | Int Electronic Res Corp | Method of making a metal core printed circuit board |
GB1288992A (en) * | 1970-06-22 | 1972-09-13 |
-
1977
- 1977-10-28 DE DE19772748345 patent/DE2748345A1/en not_active Ceased
-
1978
- 1978-10-09 FR FR7828803A patent/FR2407639A1/en not_active Withdrawn
- 1978-10-24 SE SE7811055A patent/SE7811055L/en unknown
- 1978-10-27 JP JP13176578A patent/JPS5471737A/en active Pending
- 1978-10-27 GB GB7842178A patent/GB2009515A/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
FR2407639A1 (en) | 1979-05-25 |
SE7811055L (en) | 1979-04-29 |
GB2009515A (en) | 1979-06-13 |
DE2748345A1 (en) | 1979-05-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS556393A (en) | Method and apparatus for producing screened printing plate | |
ZA775455B (en) | Improved methods and apparatus for making scribed circuit boards | |
JPS5444904A (en) | Method of making flat printing plate | |
GB2007259B (en) | Process and apparatus for electrolytic etching | |
JPS547347A (en) | Electronic copy apparatus | |
JPS53114974A (en) | Method and apparatus for making nonnwoven structure | |
JPS5499004A (en) | Connecting method and apparatus for floated apparatus and offsore producing apparatus | |
JPS5471179A (en) | Method and apparatus for making facing sheet | |
JPS5452119A (en) | Method and apparatus for making plasticc reinforced* waterrhardenablyybound thin board | |
JPS5495955A (en) | Method and apparatus for massssoldering printed wiring board | |
JPS5436569A (en) | Electronic apparatus | |
JPS5463903A (en) | Method and material for making printing plate | |
IL53628A0 (en) | Method and apparatus for producing screened printing surfaces | |
JPS5456611A (en) | Method and apparatus for making cleaninggrod | |
JPS544607A (en) | Method and device for flat plate printing | |
JPS5435191A (en) | Method and apparatus for producing hydrogen | |
JPS5471737A (en) | Method and apparatus for producing printed conductive plate | |
JPS5471164A (en) | Method and apparatus for making laminate | |
JPS53135702A (en) | Method of forming printing original plate | |
JPS547169A (en) | Automactic production apparatus for print wire plate | |
JPS5434901A (en) | Method of producing printing plate | |
GB1553585A (en) | Facing plate and method and apparatus for making same | |
JPS5444903A (en) | Method of making flat printing plate | |
JPS5418305A (en) | Method of making nonnwater flat printing plate | |
JPS5447191A (en) | Apparatus for continuously punching printed matters |