FR2407639A1 - METHOD AND DEVICE FOR THE MANUFACTURING OF PRINTED CIRCUITS - Google Patents

METHOD AND DEVICE FOR THE MANUFACTURING OF PRINTED CIRCUITS

Info

Publication number
FR2407639A1
FR2407639A1 FR7828803A FR7828803A FR2407639A1 FR 2407639 A1 FR2407639 A1 FR 2407639A1 FR 7828803 A FR7828803 A FR 7828803A FR 7828803 A FR7828803 A FR 7828803A FR 2407639 A1 FR2407639 A1 FR 2407639A1
Authority
FR
France
Prior art keywords
printed circuits
manufacturing
conductive
copper layer
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7828803A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Blaupunkt Werke GmbH
Original Assignee
Blaupunkt Werke GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Blaupunkt Werke GmbH filed Critical Blaupunkt Werke GmbH
Publication of FR2407639A1 publication Critical patent/FR2407639A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Chemically Coating (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

A.PROCEDE POUR FABRIQUER DES CIRCUITS IMPRIMES DONT LA FACE SUPERIEURE ET LA FACE INFERIEURE SONT RELIEES PAR DES PASSAGES OU ORIFICES METALLISES REALISES DANS LA PLAQUE DU CIRCUIT IMPRIME. B.PROCEDE CARACTERISE EN CE QU'ON MET EN PLACE UNE COUCHE DE CUIVRE, A L'EPAISSEUR VOULUE POUR LES CHEMINS CONDUCTEURS, ON RECOUVRE LA COUCHE DE CUIVRE D'UNE COUCHE PHOTORESISTANTE, ON PROCEDE A UNE INSOLATION NEGATIVE DE LA PLAQUE CONDUCTRICE SELON LE MODELE DES CHEMINS CONDUCTEURS, ON EFFECTUE L'ATTAQUE CHIMIQUE DE LA PLAQUE CONDUCTRICE.A.PROCEDE FOR MANUFACTURING PRINTED CIRCUITS WHOSE UPPER SIDE AND BOTTOM SIDE ARE CONNECTED BY METAL PASSAGES OR ORIFICES MADE IN THE PRINTED CIRCUIT PLATE. B. PROCESS CHARACTERIZED IN THAT WE PLACE A COPPER LAYER AT THE THICKNESS DESIRED FOR THE CONDUCTIVE PATHS, THE COPPER LAYER IS COVERED WITH A PHOTORESISTANT LAYER, A NEGATIVE INSOLATION OF THE CONDUCTIVE PLATE IS PROCESSED ACCORDING TO THE CONDUCTIVE PATH MODEL, THE CHEMICAL ATTACK ON THE CONDUCTIVE PLATE IS PERFORMED.

FR7828803A 1977-10-28 1978-10-09 METHOD AND DEVICE FOR THE MANUFACTURING OF PRINTED CIRCUITS Withdrawn FR2407639A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19772748345 DE2748345A1 (en) 1977-10-28 1977-10-28 METHOD AND DEVICE FOR THE MANUFACTURING OF PRINTED CIRCUIT BOARDS

Publications (1)

Publication Number Publication Date
FR2407639A1 true FR2407639A1 (en) 1979-05-25

Family

ID=6022480

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7828803A Withdrawn FR2407639A1 (en) 1977-10-28 1978-10-09 METHOD AND DEVICE FOR THE MANUFACTURING OF PRINTED CIRCUITS

Country Status (5)

Country Link
JP (1) JPS5471737A (en)
DE (1) DE2748345A1 (en)
FR (1) FR2407639A1 (en)
GB (1) GB2009515A (en)
SE (1) SE7811055L (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113079634B (en) * 2020-05-29 2022-11-18 新华三技术有限公司合肥分公司 Circuit board and preparation process thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3159486A (en) * 1959-08-03 1964-12-01 Rca Corp Method of making electrical conductors
FR1381882A (en) * 1963-02-06 1964-12-14 Siemens Ag Process for the manufacture of printed circuits and circuits conforming to those thus obtained
DE1496984A1 (en) * 1963-02-06 1969-11-06 Siemens Ag Process for producing printed circuits according to the build-up method
GB1288992A (en) * 1970-06-22 1972-09-13
NL7108456A (en) * 1968-11-01 1972-12-20

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3159486A (en) * 1959-08-03 1964-12-01 Rca Corp Method of making electrical conductors
FR1381882A (en) * 1963-02-06 1964-12-14 Siemens Ag Process for the manufacture of printed circuits and circuits conforming to those thus obtained
DE1496984A1 (en) * 1963-02-06 1969-11-06 Siemens Ag Process for producing printed circuits according to the build-up method
NL7108456A (en) * 1968-11-01 1972-12-20
GB1288992A (en) * 1970-06-22 1972-09-13

Also Published As

Publication number Publication date
DE2748345A1 (en) 1979-05-03
GB2009515A (en) 1979-06-13
JPS5471737A (en) 1979-06-08
SE7811055L (en) 1979-04-29

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Legal Events

Date Code Title Description
ST Notification of lapse