GB1288992A - - Google Patents

Info

Publication number
GB1288992A
GB1288992A GB1288992DA GB1288992A GB 1288992 A GB1288992 A GB 1288992A GB 1288992D A GB1288992D A GB 1288992DA GB 1288992 A GB1288992 A GB 1288992A
Authority
GB
United Kingdom
Prior art keywords
copper
layer
electroplated
coating
printed circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1288992A publication Critical patent/GB1288992A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Abstract

1288992 Printed circuits WESTINGHOUSE ELECTRIC CORP 22 June 1970 30138/70 Heading H1R In a method of making printed circuits the conductors on each side of an epoxy glass board are connected together by coating the walls of an aperture in the board, firstly with a layer 30 of copper, nickel, palladium, silver or gold by chemical or electroless methods, secondly with an electroplated conductive layer 32 provided from a non-cyanide bath such as copper pyrophosphate, sulphuric or fluoroborate acid and thirdly with a layer of electroplated copper 34 provided from a cyanide bath, finally a lead-in coating 36 is electroplated upon the copper layer 34.
GB1288992D 1970-06-22 1970-06-22 Expired GB1288992A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3013870 1970-06-22

Publications (1)

Publication Number Publication Date
GB1288992A true GB1288992A (en) 1972-09-13

Family

ID=10302926

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1288992D Expired GB1288992A (en) 1970-06-22 1970-06-22

Country Status (1)

Country Link
GB (1) GB1288992A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2407639A1 (en) * 1977-10-28 1979-05-25 Blaupunkt Werke Gmbh METHOD AND DEVICE FOR THE MANUFACTURING OF PRINTED CIRCUITS
GB2305299A (en) * 1995-09-12 1997-04-02 Irish Circuits Ltd Printed circuit board production process
EP0936639A2 (en) * 1998-02-10 1999-08-18 Lucent Technologies Inc. Process for forming device comprising metallized magnetic substrates
EP1091024A1 (en) * 1998-04-30 2001-04-11 Ebara Corporation Method and device for plating substrate
EP1923488A3 (en) * 1998-09-14 2009-05-27 Ibiden Co., Ltd. A process for manufacturing a multilayer printed circuit board

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2407639A1 (en) * 1977-10-28 1979-05-25 Blaupunkt Werke Gmbh METHOD AND DEVICE FOR THE MANUFACTURING OF PRINTED CIRCUITS
GB2305299A (en) * 1995-09-12 1997-04-02 Irish Circuits Ltd Printed circuit board production process
EP0936639A2 (en) * 1998-02-10 1999-08-18 Lucent Technologies Inc. Process for forming device comprising metallized magnetic substrates
EP0936639A3 (en) * 1998-02-10 1999-09-29 Lucent Technologies Inc. Process for forming device comprising metallized magnetic substrates
US6007758A (en) * 1998-02-10 1999-12-28 Lucent Technologies Inc. Process for forming device comprising metallized magnetic substrates
EP1091024A1 (en) * 1998-04-30 2001-04-11 Ebara Corporation Method and device for plating substrate
EP1091024A4 (en) * 1998-04-30 2006-03-22 Ebara Corp Method and device for plating substrate
EP1923488A3 (en) * 1998-09-14 2009-05-27 Ibiden Co., Ltd. A process for manufacturing a multilayer printed circuit board
US7691189B2 (en) 1998-09-14 2010-04-06 Ibiden Co., Ltd. Printed wiring board and its manufacturing method
US7827680B2 (en) 1998-09-14 2010-11-09 Ibiden Co., Ltd. Electroplating process of electroplating an elecrically conductive sustrate
US8065794B2 (en) 1998-09-14 2011-11-29 Ibiden Co., Ltd. Printed wiring board and its manufacturing method

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee