JPS5469063A - Manufacture of electronic device - Google Patents
Manufacture of electronic deviceInfo
- Publication number
- JPS5469063A JPS5469063A JP13595377A JP13595377A JPS5469063A JP S5469063 A JPS5469063 A JP S5469063A JP 13595377 A JP13595377 A JP 13595377A JP 13595377 A JP13595377 A JP 13595377A JP S5469063 A JPS5469063 A JP S5469063A
- Authority
- JP
- Japan
- Prior art keywords
- concavity
- substrate
- projection
- resin
- manufacture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Led Device Packages (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE: To secure an easy formation of the display window simultaneously with the resin sealing of the substrate by providing the projection touching the LED set onto the wiring substrate at the concavity of the molding tool.
CONSTITUTION: The wiring substrate is inserted to metal mold concavity 6 with electronic parts 2 put downward, and substrate projection bar 7 is hooked to each hooking step part 8. In this case, the substrate is held horizontally within the concavity, and LED3 touches top surface 9a of projection 9. Then fused resin 10 is filled into concavity 6 through pouring. Substrate 1 is drawn out of concavity 6 after solidification of resin 10, thus window edge W remaining as a through-hole.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13595377A JPS5469063A (en) | 1977-11-11 | 1977-11-11 | Manufacture of electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13595377A JPS5469063A (en) | 1977-11-11 | 1977-11-11 | Manufacture of electronic device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5469063A true JPS5469063A (en) | 1979-06-02 |
JPS5549422B2 JPS5549422B2 (en) | 1980-12-11 |
Family
ID=15163692
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13595377A Granted JPS5469063A (en) | 1977-11-11 | 1977-11-11 | Manufacture of electronic device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5469063A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5791572A (en) * | 1980-11-28 | 1982-06-07 | Toshiba Corp | Light module and manufacture therefor |
JPS58223336A (en) * | 1982-06-22 | 1983-12-24 | Nec Corp | Manufacture of casting mold |
US4486364A (en) * | 1981-12-04 | 1984-12-04 | Stanley Electric Company, Ltd. | Method and apparatus for molding a synthetic resin lens for a light emitting diode |
WO2014118856A1 (en) * | 2013-01-31 | 2014-08-07 | パナソニック株式会社 | Electronic circuit device and method for manufacturing electronic circuit device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02136970U (en) * | 1989-04-17 | 1990-11-15 |
-
1977
- 1977-11-11 JP JP13595377A patent/JPS5469063A/en active Granted
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5791572A (en) * | 1980-11-28 | 1982-06-07 | Toshiba Corp | Light module and manufacture therefor |
JPS6244831B2 (en) * | 1980-11-28 | 1987-09-22 | Tokyo Shibaura Electric Co | |
US4486364A (en) * | 1981-12-04 | 1984-12-04 | Stanley Electric Company, Ltd. | Method and apparatus for molding a synthetic resin lens for a light emitting diode |
JPS58223336A (en) * | 1982-06-22 | 1983-12-24 | Nec Corp | Manufacture of casting mold |
JPS6255297B2 (en) * | 1982-06-22 | 1987-11-19 | Nippon Electric Co | |
WO2014118856A1 (en) * | 2013-01-31 | 2014-08-07 | パナソニック株式会社 | Electronic circuit device and method for manufacturing electronic circuit device |
JPWO2014118856A1 (en) * | 2013-01-31 | 2017-01-26 | パナソニックIpマネジメント株式会社 | Electronic circuit device and method for manufacturing electronic circuit device |
US9568169B2 (en) | 2013-01-31 | 2017-02-14 | Panasonic Intellectual Property Management Co., Ltd. | Electronic circuit device and method for manufacturing electronic circuit device |
Also Published As
Publication number | Publication date |
---|---|
JPS5549422B2 (en) | 1980-12-11 |
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